Rambus Inc. v. Hynix Semiconductor Inc.

569 F. Supp. 2d 946, 2008 U.S. Dist. LEXIS 107149, 2008 WL 2754805
CourtDistrict Court, N.D. California
DecidedJuly 10, 2008
DocketC-05-00334 RMW, C-05-02298 RMW, C-06-00244 RMW
StatusPublished
Cited by10 cases

This text of 569 F. Supp. 2d 946 (Rambus Inc. v. Hynix Semiconductor Inc.) is published on Counsel Stack Legal Research, covering District Court, N.D. California primary law. Counsel Stack provides free access to over 12 million legal documents including statutes, case law, regulations, and constitutions.

Bluebook
Rambus Inc. v. Hynix Semiconductor Inc., 569 F. Supp. 2d 946, 2008 U.S. Dist. LEXIS 107149, 2008 WL 2754805 (N.D. Cal. 2008).

Opinion

CLAIM CONSTRUCTION ORDER FOR THE FARMWALD/HOROWITZ PATENTS AND ORDER DENYING THE MANUFACTURERS’ MOTIONS FOR SUMMARY JUDGMENT OF NON-INFRINGEMENT AND INVALIDITY DEPENDING ON CLAIM CONSTRUCTION

RONALD M. WHYTE, District Judge.

Rambus has accused the Manufactur *951 ers 1 of infringing various patents. Largely in accord with the local rules, the parties have submitted their joint claim construction statement showing 72 claim terms in dispute. Rambus has filed its opening and responding Markman 2 briefs, motions for summary judgment of infringement, and oppositions to the Manufacturers’ motions. The Manufacturers have filed their responsive Markman brief, oppositions to Rambus’s summary judgment motions, and their own motions for summary judgment of invalidity under Rambus’s proposed claim constructions and non-infringement under theirs. The court has reviewed the papers and considered the arguments of counsel and now sets forth its claim construction and rulings on the summary judgment motions dealing with the Farmwald/Horowitz patents. The claim construction pertaining to the Ware patents is set forth in a separate order.

I. THE FARMWALD/HOROWITZ PATENT FAMILY

Fifteen of the seventeen patents-in-suit descend from the original patent application no. 07/510,898 filed by Drs. Michael Farmwald and Mark Horowitz on April 18, 1990. 3 Because these fifteen share substantially similar specifications, the court’s discussion refers to U.S. Patent No. 6, 182, 184. 4 Given the number of claim terms in dispute and complexity of the technology, the court begins by explaining the context of the invention and the contents of the specification relevant to the disputed issues. Cf . Phillips v. AWH Corp., 415 F.3d 1303, 1313, 1315-17 (Fed.Cir.2005) (en banc). It then briefly recounts aspects of the prosecution history before turning to claim construction.

A. Background of the Inventions and the Specification’s Written Description

Drs. Farmwald and Horowitz began their collaboration in the fall of 1988. Tr. 4078:21-4079:7. 5 Dr. Farmwald met with Dr. Horowitz over dinner to discuss how processor speeds and memory speeds were diverging and how memory systems needed to become faster to keep up. Tr. 4079:9-4082:9. Within the semiconductor industry, this problem was commonly referred to as the “memory bottleneck” or “memory gap.” Tr. 4084:7-4091:8 (Dr. Horowitz); 4161:10-4163:3 (Carl Everett); 5498:9-5502:8 (Dr. Farmwald). Over the course of the next year and a half, Drs. Farmwald and Horowitz worked on a variety of ideas for closing the memory gap, and they eventually wrote up their ideas in a patent application. Tr. 4133:15-4134:14. Dr. Horowitz testified that he “took over” *952 the drafting of the specification. Id. The following discussion walks through the patents’ common specification to illustrate the scope of the written description and explain the technology.

1. The Prior Art and Objects of the Invention

Dr. Horowitz testified that with the specification, he and Dr. Farmwald were “trying to describe our inventions, all the innovations that we had come up with to build a very high speed interface.” Tr. 4134:10-14. The court will summarize here, however, only the intrinsic evidence and not the inventors’ self-serving testimony. The specification begins with the field of the invention, where it describes “an integrated circuit bus interface” as well as “a new method for physically implementing the bus architecture.” '184 patent, col. 1,11. 21-26. From these introductory sentences, it is clear that the Farmwald/Horo-witz specification discloses more than one invention.

The background of the invention discusses general features of prior art memory devices, focusing on how prior art bus architectures were not as efficient as they could be. Id., col. 1, 1. 30-col. 2, 1. 5. The comparison with the prior art is extensive and illustrates some of the problems that Drs. Farmwald and Horowitz sought to address with their inventions. It starts by noting that “prior art memory systems have attempted to solve the problems of high speed access to memory with limited success.” Id, col. 2, 11. 8-10. The first piece of prior art examined by the specification is “the earliest 4-bit micro processor.” Id., col. 2, 11. 10-11 (citing U.S. Pat. No. 3,821,715 (Hoff et. al.)). The Hoff micro processor connected multiple memory devices to a single CPU over a 4-bit wide bus that multiplexed, i.e., carried both, address and control information. Id., col. 2, 11. 13-16. It also used point-to-point control signals to select which memory device the CPU sought to access. Id. Drs. Farmwald and Horowitz critiqued aspects of the Hoff micro processor, noting that it used fixed access times for transmitting information and did not permit the memory devices to send information in blocks. Id., col. 2,11. 16-20. “Most importantly],” its use of point-to-point device select lines meant that it did not send device control information over the bus. Id.

The next piece of prior art discussed is U.S. Patent No. 4,315,308 (Jackson), which described a bus architecture using a single 16-bit wide bus that multiplexed data, address, and control information. Id., col. 2, 11. 21-24. It implemented some block-mode operations and allowed some access time variation, but it could not handle multiple requests and did not bus all signals. Id., col. 2, 11. 24-30. Another patent described a DRAM with multiplexed address and data information inside the DRAM, but with a “conventional” bus comprised of separate data, address, and control lines to connect to the external device environment. Id., col. 2,11. 31-34.

Shifting away from describing prior art bus architectures, Drs. Farmwald and Horowitz described prior art packaging technology. Id., col. 2, 11. 35-42. While others had attempted to use 3-D packages for DRAMS with connections along a single edge only, the need for point-to-point wiring to enable a master device to select the correct memory device posed complex geometrical problems. Id. No prior art packaging solution had considered using a new interface to do away with the need for point-to-point device select wiring.

Leaving DRAM packaging and returning to DRAM architecture, Drs. Farmwald and Horowitz discussed the “state-of-the-art DRAM interface” in U.S. *953 Patent No. 3,969,706 (Proebsting, et.al.). This DRAM architecture used two-way multiplexed address signals and maintained separate pins for data and control information. Id., col. 2, 11. 43-47. One of its problems was that it required more and more pins as the DRAM grew, and many of these pins had to be connected point-to-point to various devices. Id., col. 2,11. 47-50.

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569 F. Supp. 2d 946, 2008 U.S. Dist. LEXIS 107149, 2008 WL 2754805, Counsel Stack Legal Research, https://law.counselstack.com/opinion/rambus-inc-v-hynix-semiconductor-inc-cand-2008.