Rambus Inc. v. Hynix Semiconductor Inc.

642 F. Supp. 2d 970, 2008 U.S. Dist. LEXIS 104536, 2008 WL 5047924
District Court, N.D. California·Decided November 24, 2008·No. C-05-00334 RMW, C-05-02298 RMW, C-06-00244 RMW·Published·Cited by 2 cases

Opinion

ORDER GRANTING IN PART AND DENYING IN PART RAMBUS’S MOTIONS FOR SUMMARY JUDGMENT OF INFRINGEMENT

[Re Docket Nos. 503, 505, 506, 507, 509, 510]

[Re Docket No. 355]

[Re Docket Nos. 200, 201]

RONALD M. WHYTE, District Judge.

Rambus has accused the Manufactur *974 ers 1 of infringing various patents. The court held a two-day claim construction hearing and issued an order interpreting the disputed claim terms. Rambus Inc. v. Hynix Semiconductor Inc., 569 F.Supp.2d 946 (N.D.Cal.2008). Pursuant to a case management order, Rambus also filed motions for summary judgment of infringement by the Manufacturers’ various accused products. The Manufacturers oppose the motions.

Pursuant to another request from the court, Rambus has narrowed the number of claims at issue and the scope of accused products to be tried in January 2009. This order addresses only the motions and arguments directed at the claims and products subject to that trial.

The court has reviewed the papers and considered the arguments of counsel. For the following reasons, the court grants summary judgment as to direct infringement of claim 16 of the '295 patent (except as to Nanya’s DDR3 SDRAM); denies summary judgment as to infringement of the other claims at issue; and grants summary adjudication in favor of Rambus in a number of the Manufacturers’ non-infringement contentions.

I. BACKGROUND

A. The Accused DRAMs

The Manufacturers produce a variety of commodity DRAMs, ranging from the standard DDR2 and DDR3 SDRAMs to the graphics-specialized gDDR2, GDDR3, and GDDR4 SDRAMs to the proprietary Micron RLDRAM II. Rambus has largely agreed with the individual Manufacturers with respect to the designation of representatives of each type of DRAM, 2 and the parties rely on the data sheets of the representative devices.

B. Reading a Datasheet’s Timing Diagrams

The evidence supporting and opposing Rambus’s motion for summary judgment primarily consists of the datasheets of the accused devices. The data sheets for each Manufacturers’ device appear as exhibits to the Tolliver Declaration. 3 A datasheet describes a product in varying levels of detail. For example, the Manufacturers’ *975 product datasheets generally begin with an overview of the key features and parameters of the device. See, e.g., Hynix DDR2 at 4. A typical DRAM datasheet also includes a description of the different interface pins that send and receive signals to and from the outside world, typically a memory controller. See, e.g., id. at 8-9. The datasheet also discusses the DRAM’s testing conditions, electrical properties, and physical profile or package, though these details are not relevant to this case. Some of the Manufacturers also provide supplements to the datasheets with additional detail on specific aspects of the DRAM. For example, Hynix publishes a “DDR2 SDRAM Device Operation & Timing Diagram” that supplies substantially more detail about how its product operates. See generally Hynix DDR2 Operation.

A common feature in the datasheets is a series of timing diagrams, which are specialized graphs showing the state of various signals over a period of time. As much of the evidence related to infringement relies on interpreting timing diagrams, a brief explanation follows. The graph below depicts a burst read operation in a Hynix DDR2 SDRAM:

[[Image here]]

The graph shows the activity of four types of signals. The top signal CK/CK illustrates the differential clock signal received by the DRAM. See Hynix DDR2 at 8. The second generally depicts the command received by the DRAM (“NOP” is shorthand for “no operation”). 4 The third signal shown above is DQS/DQS, the differential data strobe! Finally, the bottom graph (“DQs”) represents the status of the multitude of data lines. 5

*976 Time progresses from left to right, marked by periods of the external clock signal. For example, “Tl” marks the first complete period of the clock signal. The dashed line dividing each clock period into halves represents the crossing point of the clock signal and its complement (CK). The ability to extract a timing signal from two points of a single clock period is what makes a DDR SDRAM “double data rate.” Accord Murphy Decl. ¶¶ 86-89; see, e.g., Hynix DDR2 at 4.

Finally, a timing diagram’s captions often convey the state of multiple parameters that influence the DRAM’s operation. In the figure above, “RL” means “read latency,” which is the delay between the DRAM receiving instructions to begin a read operation and the DRAM making data available on the DQ pins to be read. A read latency of three implies that the DRAM waits three clock cycles before making data available to be read. In a DDR2 SDRAM, the read latency is equal to the sum of the programmable CAS latency (“CL”) and the programmable additive latency (“AL,” also referred to as “Posted CAS”). See, e.g., Hynix DDR2 Operation at 19. In other words, RL = CL + AL. Finally, “BL” represents the “burst length” or duration of a given read or write operation. In the read operation shown above, the DRAM was programmed with a burst length of 8, hence 8 bits of data are made available in response to the read operation.

II. LEGAL STANDARD

Ninth Circuit law governing summary judgment procedures applies because this procedural law does not relate to substantive patent law principles. In re Cygnus Telecomm’ns Tech., LLC, Patent Litig., 536 F.3d 1343, 1351-52 (Fed.Cir.2008); see, e.g., Exigent Tech., Inc. v. Atrana Solutions, Inc., 442 F.3d 1301, 1307-09 (Fed.Cir.2006) (parsing regional circuit law of summary judgment). Rambus, as the party asserting infringement, bears the burden of persuasion at trial as to whether or not each of the Manufacturers’ accused products infringe' its claims. L & W, Inc. v. Shertech, Inc., 471 F.3d 1311, 1317-18 (Fed.Cir.2006). Thus, as the moving party, Rambus bears the burden of producing evidence showing that each device satisfies each limitation of each claim that the device is alleged to infringe. Id. at 1318. If Rambus fails to meet this burden of production, the Manufacturers need not produce anything to defeat summary judgment. Nissan Fire & Marine Ins. Co., Ltd. v. Fritz Companies, Inc.,

Free access — add to your briefcase to read the full text and ask questions with AI

Rambus Inc. v. Hynix Semiconductor Inc., 642 F. Supp. 2d 970, 2008 U.S. Dist. LEXIS 104536, 2008 WL 5047924 (N.D. Cal. 2008).

642 F. Supp. 2d 970 (Rambus Inc. v. Hynix Semiconductor Inc.) — published by Counsel Stack Legal Research, free access to 12M+ legal documents.

Related