POWERTECH TECHNOLOGY INC. v. Tessera, Inc.

660 F.3d 1301, 2011 WL 4526038
Court of Appeals for the Federal Circuit·Decided September 30, 2011·No. 2010-1489·Published·Cited by 13 cases

Opinion

DYK, Circuit Judge.

Powertech Technology Inc. (“PTI”) filed a declaratory action seeking declarations of non-infringement and invalidity of Tess-era, Inc.’s (“Tessera”) United States Patent No. 5,663,106 (“'106 patent”). The United States District Court for the Northern District of California dismissed the action for lack of subject matter jurisdiction, finding no Article III case or controversy between the parties. Powertech Tech. Inc. v. Tessera, Inc., No. 10-00945, 2010 WL 2194829 (N.D.Cal. June 1, 2010). Because we conclude a controversy did exist, we reverse and remand for further proceedings on the merits.

Background

I

A semiconductor chip (“chip”) is a miniaturized electronic circuit that can be incorporated into larger electronic devices like cell phones and personal computers. A semiconductor package (“package”) protects a delicate chip from mechanical and thermal damage by encapsulating it in molded plastic, generally referred to as an “encapsulant.” The encapsulation process, however, can sometimes contaminate the delicate terminals on the exterior of the chip, preventing the terminals from connecting the package to other electronic components.

Tessera’s '106 patent is a process patent that is directed to methods for preventing the contamination of exposed chip terminals during encapsulation. As illustrated below, the claimed process requires a protective barrier (30) which protects terminals (26) of the chip (12) from coming in contact with the encapsulant (40) when it is injected into the encapsulation area through a fill hole (36).

*1303 [[Image here]]

PTI is a Taiwanese sub-contracting company that packages chips for various customers in the semiconductor industry. PTI’s customers send bare chips to PTI, and PTI encapsulates them in protective materials before returning the packaged chips to the customers. Notably, as the packager of the chips, PTI appears to be the only party in the supply chain to allegedly practice the method claims of the '106 patent (i.e., the encapsulation of the chip in protective materials). PTI’s customers then incorporate the pre-packaged chips into downstream electronic products for marketing, selling, and importing worldwide, including in the United States. As discussed below, Tessera has alleged that PTI’s encapsulation process is covered by the claims of the '106 patent.

Since the late 1990s, Tessera has licensed its technology to more than sixty semiconductor companies through agreements called Tessera Compliant Chip Licenses (“TCC Licenses”). Tessera and PTI entered into such an agreement on October 20, 2003, under which PTI agreed to pay running royalties in return for a license under the '106 patent (and other patents) to assemble, use, or sell certain “TCC Licensed Products.” PTI claims it has complied with all of its obligations under the license agreement, including the obligation to pay royalties on a post-sale quarterly basis.

II

The current declaratory action stems partly from Tessera’s allegations in two earlier suits — one before the United States International Trade Commission (“ITC proceedings or action”) and one in the United States District Court for the Eastern District of Texas (“Texas action”). In the ITC action, Tessera sought relief under Section 337 of the Tariff Act of 1930, 19 U.S.C. § 1337, alleging infringement of the 106 patent and three other patents by eighteen defendants through the importation and sale of certain semiconductor chips. See In the Matter of Certain Semiconductor Chips with Minimized Chip Package Size and Products Containing Same (III), No. 337-TA-630, 2010 WL 686377 (Int’l Trade Comm’n Feb. 24, 2010) (“Final Determination”)', In the Matter of Certain Semiconductor Chips with Minimized Chip Package Size and Products Containing Same (III), No. 337-TA-630 (Int’l Trade Comm’n Aug. 28, 2009) (“Initial Determination”). In the Texas action, filed on the same day as the ITC action, Tessera asserted infringement of the same patents, accusing the same defendants and products. Tessera’s Complaint for Patent Infringement and Jury Demand, Tessera, Inc. v. A-DATA Tech. *1304 Co., No. 2:07-CV-534 (E.D.Tex. Dec. 7, 2007), ECF No. 1. As Tessera has conceded, the Texas action “is no different than the [ITC action] for present purposes.” J.A. 432. The Texas action has been stayed pending the final outcome of the ITC proceedings. See 28 U.S.C. § 1659.

The accused products in the ITC and Texas actions were semiconductor chips that come in two formats: a first group consisting of so-called “wBGA” chips and a second group consisting of so-called “ixBGA” chips. 1 PTI is licensed by Tess-era to manufacture both wBGA and pJBGA chips. Though PTI was not a named party in either the ITC or Texas action, it maintains that some of the accused companies were customers who directly or indirectly purchased their wBGA and pBGA chips from PTI. For example, PTI asserts that three of the accused companies — Elpida Memory, Inc. (“Elpida”), Powerchip Semiconductor Corp., and ProMOS Technologies Inc. — used (and continue to use) PTI to package their chips, and that most of the other accused companies indirectly purchased PTI-packaged chips from these three companies or similar companies. In addition, PTI asserts that Kingston Technology Co. directly purchased packaged chips from PTI to incorporate into downstream electronic products.

In the Initial Determination of the ITC proceedings, the Administrative Law Judge (“ALJ”) ruled that the '106 patent was not invalid and not infringed by the accused wBGA and p,BGA products. The ALJ also determined that Tessera’s patent rights were exhausted with respect to all accused products sold by Tessera’s licensees, including PTI. 2 In its Final Determination, the ITC affirmed the ALJ’s determination that the wBGA products did not infringe, but it held that the pJBGA products did infringe. The ITC did not, however, issue an exclusion order under Section 337 with respect to the wBGA products because it determined that Elpida was the only importer of IxBGA chips and that all of Elpida’s pJBGA chips were purchased from licensed vendors, including PTI.

The ITC action culminated in our recent decision in Tessera, Inc. v. International Trade Commission, 646 F.3d 1357, 1361 (Fed.Cir.2011), where we affirmed the ITC’s finding that there was no Section 337 violation. We held, inter alia, that (1) the '106 patent was not invalid as anticipated by three prior art references: U.S. Patent Nos.

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POWERTECH TECHNOLOGY INC. v. Tessera, Inc., 660 F.3d 1301, 2011 WL 4526038 (Fed. Cir. 2011).

660 F.3d 1301 (POWERTECH TECHNOLOGY INC. v. Tessera, Inc.) — published by Counsel Stack Legal Research, free access to 12M+ legal documents.

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