Power Mosfet Technologies, L.L.C. v. Siemens AG

378 F.3d 1396, 72 U.S.P.Q. 2d (BNA) 1129, 2004 U.S. App. LEXIS 17020
CourtCourt of Appeals for the Federal Circuit
DecidedAugust 17, 2004
DocketNos. 03-1083, 03-1469 to 03-1471
StatusPublished
Cited by79 cases

This text of 378 F.3d 1396 (Power Mosfet Technologies, L.L.C. v. Siemens AG) is published on Counsel Stack Legal Research, covering Court of Appeals for the Federal Circuit primary law. Counsel Stack provides free access to over 12 million legal documents including statutes, case law, regulations, and constitutions.

Bluebook
Power Mosfet Technologies, L.L.C. v. Siemens AG, 378 F.3d 1396, 72 U.S.P.Q. 2d (BNA) 1129, 2004 U.S. App. LEXIS 17020 (Fed. Cir. 2004).

Opinion

GAJARSA, Circuit Judge.

Power Mosfet Technologies, L.L.C. (“PMT”), appeals the final judgment of the United States District Court for the Eastern District of Texas that United States Patent No. 5,216,275 (the “'275 patent”) was not infringed by defendants-cross appellants Siemens AG, Infineon Technologies Corporation, and Infineon Technologies AG (collectively, “Infineon”), or by defendants-cross appellants STMicroelectronics, N.V., STMicroelectronics, S.R.L., and STMicroelectronies, Inc. (collectively, “ST”). Power Mosfet Techs. v. Siemens AG, No. 2:99-CV-168 (E.D.Tex. Sept. 30, 2002). PMT also appeals the district court’s denial of its motion for a new trial. In the event that this court accepts certain arguments made by PMT, Infineon and ST conditionally cross-appeal the district court’s judgment that the '275 patent was not anticipated by United States Patent No. 4,754,310 (the “Coe patent”). ST also conditionally cross-appeals the district court’s judgment that the '275 patent is not anticipated by United States Patent No. 3,171,068 (the “Denkewalter patent”). Infineon alone cross-appeals the district court’s denial of its motion for attorney fees. Finally, International Rectifier Corporation and International Rectifier Corporation North Carolina (collectively, “IR”) cross-appeal the district court’s denial of its motion for attorney fees under Federal Rule of Civil Procedure 54(d)(1) following the dismissal with prejudice of PMT’s claims against it. For the reasons stated herein, we affirm the district court’s judgment of noninfringement, its denial of PMT’s motion for a new trial, and its denial of Infineon’s motion for attorney fees and IR’s motion for costs.

I. BACKGROUND

PMT is a Texas limited liability corporation with its corporate offices in Marshall, Texas, and is the owner of the '275 patent. The '275 patent is entitled “Semiconductor Power Devices with Alternating Conductivity Type High-Voltage Breakdown Regions.”

A. Semiconductor Technology

Semiconductor power devices control the flow of electricity through an electronic circuit. They are typically constructed of silicon, which, by itself, is not a very good conductor of electricity. Silicon’s conductivity, however, can be enhanced by a process known as doping. Doping adds impurities to the crystal structure of pure silicon and creates either a surplus or deficiency of free electrons in the silicon material. Both conditions enable the flow of current through the material. When doping results in a surplus of electrons, the material is described as “n-type” because it has a net negative charge. When the result is a deficiency of electrons (i.e., a surplus of “holes”) the

[1401]*1401[[Image here]]

material is described as “p-type” because it has a net positive charge. Within the n-type and p-type categories, the material may be further categorized as heavily doped (n + or p + regions) or lightly doped (n' or p' regions).

The semiconductor power device described in the '275 patent is known as a MOSFET. A cross-section from a traditional MOSFET is reproduced above from figure 1 of the '275 patent. The '275 patent describes the fabrication process of the traditional MOSFET device as follows: an n' layer 5 is grown on an n + substrate 4, followed by the growth of a p + layer 3 on the top of the n" layer 5. The above-described process may also be performed with p-type materials substituted for the n-type materials, and n-type materials for the p-type. '275 patent, col. 5, 11. 23-29. In the traditional MOSFET design, layer 5 consists of a single conductivity type, either n- or p-type.

Also shown in figure 1 are the electrical connections of the semiconductor device. The terminals labeled “S” are the “source” terminals, where a positive voltage source is connected to the device. The terminal labeled “D” is the “drain” terminal, where the negative voltage connection is made. Terminal “G” is the “gate” terminal, and controls the current flow or, simply put, turns the device on and off. When on, current flows from the source to drain and, when off, current flow is blocked. The '275 patent refers to region 5 as the “voltage sustaining layer” because, when not conducting current, it sustains a voltage between the S and D terminals.

The on and off states of a MOSFET device are controlled by applying a voltage to the gate terminal. When applied, the gate voltage creates an electric field inside the device that manipulates the electrons in the doped silicon to create conducting channels for current through the silicon material. When the gate voltage is removed, the electrons return to their normal positions and the voltage sustaining layer again prevents current from flowing through the device.

Two characteristics of MOSFETs are relevant to understanding the invention disclosed by the '275 patent. The “on-resistance” (“Ron”) of the device is the resistance of the conducting channel through the semiconductor material. The higher the on-resistance, the greater the power loss (and accompanying heat generation) resulting from the current flow through the device. The second characteristic is the “breakdown voltage” (“Vb”), which is the maximum voltage that the semiconductor device can sustain between its terminals. In traditional semiconductor devices, there is an exponential relationship between Vb and Ron. See '275 pat[1402]*1402ent, col. 1,11. 29-31. Higher Vb values are a desirable characteristic in a semiconductor device, but the resulting benefit must be balanced against the corresponding undesirable increase in Ron values,

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The invention of the '275 patent is a design for a voltage sustaining layer that results in a new relationship between Vb and Ron. According to the '275 patent, the new relationship allows lower Ron values without the same magnitude of accompanying loss in Vb that results in traditional semiconductor devices. Id. at col. 1,11. 55-66. Figure 4, reproduced from the '275 patent above, depicts a semiconductor device according to the invention. An n-type layer 5 is grown on an n + substrate 4. Layer 5 is then “trenched” to make deep U-grooves where the bottoms of the grooves “just reach [contact layer] 4.” Id. at col. 5, 1. 35. The trenches are then filled with p-material, resulting in alternating n-regions 6 and p-regions 7 that make up the voltage sustaining layer. Finally, a p + region 3 is grown over the alternating n- and p-regions. As with the traditional MOSFET devices, the '275 patent explains that p-type material can be substituted for n-type material, and vice versa.

The '275 patent designates its voltage sustaining layer the “composite buffer layer, or shortly, CB-layer,” due to its alternating semiconductor regions. Id. at col. 1,11. 57-58.

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The '275 patent further discloses several geometries for the differing conductivity areas, which are reproduced above. Independent claims 11 and 14 and dependent claims 12, 13, and 16 are at issue in this appeal. Claim 11 is representative,1 and is [1403]*1403set out below:

A semiconductor power device comprising:

a first contact layer of a first conductivity type;

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Bluebook (online)
378 F.3d 1396, 72 U.S.P.Q. 2d (BNA) 1129, 2004 U.S. App. LEXIS 17020, Counsel Stack Legal Research, https://law.counselstack.com/opinion/power-mosfet-technologies-llc-v-siemens-ag-cafc-2004.