Wang Laboratories, Inc. v. Toshiba Corp.

993 F.2d 858, 1993 WL 146758
CourtCourt of Appeals for the Federal Circuit
DecidedMay 10, 1993
DocketNos. 92-1006, 92-1008 and 92-1025
StatusPublished
Cited by19 cases

This text of 993 F.2d 858 (Wang Laboratories, Inc. v. Toshiba Corp.) is published on Counsel Stack Legal Research, covering Court of Appeals for the Federal Circuit primary law. Counsel Stack provides free access to over 12 million legal documents including statutes, case law, regulations, and constitutions.

Bluebook
Wang Laboratories, Inc. v. Toshiba Corp., 993 F.2d 858, 1993 WL 146758 (Fed. Cir. 1993).

Opinion

LOURIE, Circuit Judge.

This is a patent infringement suit involving two patents on memory modules. It comes to us as a consolidated appeal and cross-appeal from the August 23, 1991 judgment, 1991 WL 333696, and the October 23, 1991 amended judgment of the United States District Court for the Eastern District of Virginia, Civil No. 90-1477-A. On August 8,1991, a jury returned a verdict in favor of Wang Laboratories, Inc., finding U.S. Patents 4,656,605 and 4,727,513 infringed by Toshiba Corporation, Toshiba America Electronic Components, Inc., and Toshiba America Information Systems, Inc. (collectively Toshiba) and NEC Corporation, NEC Electronics Inc., and NEC Technologies, Inc. (collectively NEC), and not invalid. The jury found that NEC had willfully infringed the patents in suit, while Toshiba’s infringement was not willful. On August 14, 1991, the jury determined that Wang was entitled to a reasonable royalty as compensation for the infringement and determined alternative reasonable royalty rates. On August 23, 1991, the district court entered judgment in accordance with the jury verdicts, ruled that the patents were not invalid and were infringed, and awarded a reasonable royalty as damages.

Toshiba and NEC filed post-trial motions for judgment notwithstanding the verdict (JNOV),1 which the district court subsequently denied.2 Wang moved to amend the judgment as to damages; this motion was also denied. Toshiba and NEC now appeal from the district court’s judgment denying JNOV on the issues of validity and infringement. Wang cross-appeals the district [861]*861court’s failure to amend the judgment as to the royalty rate. We affirm-in-part, reverse-in-part, and remand-in-part.

BACKGROUND

The ’605 and ’513 patents, both entitled “Single In-Line Memory Module,” were issued in the name of James E. Clayton and assigned to Wang. The ’605 patent issued on April 7, 1987, and the ’513 patent on February 23,1988 from a continuation of the application that led to the ’605 patent.3

The patents relate to single in-line memory modules (SIMMs) having eight data memory chips capable of storing 8-bit binary words or bytes.4 Additionally, the memory modules include a ninth chip, which functions as a check or parity bit for error detection.5 The nine memory chips, which are packaged in plastic leaded chip carriers (PLCCs), are mounted on a single epoxy-glass printed circuit board substrate. Decoupling capacitors for suppressing voltage spikes are also mounted on the memory module substrate. Preferably, access terminals are arrayed across the bottom of the device for data input and output, data address and memory control, and device power. The ’605 patent claims require that the ninth chip be interconnected with the other eight, while the ’513 patent claims do not require this interconnection so that the parity chip can be written to or read from independently of the eight data chips.

The ’605 patent contains one claim, which reads as follows:

A memory module for installation on a printed circuit motherboard comprising:
eight data memory chips for storing digital data, each having a data input and output, a control input, and an address input, and each being packaged in a plastic leaded chip carrier;
a ninth memory chip for storing error detection and correction information associated with the eight data memory chips, said ninth memory chip having a data input and output, a control input and an address input interconnected with those of the eight memory chips, and a control input to provide writing in or reading out of the ninth memory chip at times other than when said bytes of digital information are written into or read out of the eight data memory chips to thereby facilitate said error detection and correction operation;
an epoxy-glass printed circuit hoard substrate having a length and width adequate for mounting thereon only in a single row said nine memory chips and for interconnecting the control inputs and the address inputs of the memory chips so that bytes of digital information may be input to or output from the memory chips one at a time;
the substrate including thirty terminals for providing access to the data inputs and outputs, control inputs, and address inputs of the nine memory chips to enable reading and writing of bytes of digital information into and out of the eight memory chips and to enable reading and writing of error detection and correction information into and out of the eight memory chips;
support means for supporting the memory module at an angle with respect to the printed circuit motherboard when the memory module is installed thereon; and eight decoupling capacitors, mounted on said substrate and connected between the nine memory chips, for suppressing transient voltage spikes between said memory chips.

(Emphasis added).

The ’513 patent contains Claims 1 and 2, which read as follows:

[862]*8621. A memory module for installation on a printed circuit motherboard comprising
nine data memory chips for storing digital data, each having a data input and output, control input, and an address input, and each being packaged in a plastic leaded chip carrier, wherein said ninth memory chip is for storing detection and correction information associated with the eight data memory chips,
an epoxy-glass printed circuit board substrate having a length and width adequate for mounting thereon only in a single row said nine memory chips and for interconnecting the control inputs and the address inputs of the memory chips so that bytes of digital information may be input to or output from the memory chips,
the substrate including thirty terminals for providing access to the data inputs and outputs, control inputs, and address inputs of the nine memory chips and to enable reading and writing of information into and out of the nine chips,
support means for supporting the memory module at an angle with respect to a motherboard and
decoupling capacitors mounted on said substrate and coupled to the memory chips for suppressing transient voltages.
2. The module of claim 1 wherein all nine memory chips are interconnected such that data is input to or output from the ninth memory chips when data is input to or output from the other eight memory chips.

Toshiba and NEC manufacture several different types of memory modules, including (1) classic nine-chip modules, which have eight data chips and one error detection chip arranged in a single row on a printed circuit board substrate; (2) 3-pack modules, which have three chips arranged in a single row, two half-bytes, which read and store four bits of information each, and a parity chip; and (3) lateral modules, which have nine chips arranged in more than a single row. Of these modules, some are leaded, i.e., electrical leads extend from the module substrate and electrically connect the module to a printed circuit motherboard, and some are leadless, i.e., an edge of the module is designed to mate with a socket attached to a printed circuit motherboard.

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Wang Laboratories, Inc. v. Toshiba Corporation
993 F.2d 858 (Federal Circuit, 1993)

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Bluebook (online)
993 F.2d 858, 1993 WL 146758, Counsel Stack Legal Research, https://law.counselstack.com/opinion/wang-laboratories-inc-v-toshiba-corp-cafc-1993.