Power Mosfet Technologies, L.L.C. v. Siemens Ag

378 F.3d 1396
CourtCourt of Appeals for the Third Circuit
DecidedAugust 17, 2004
Docket03-1083
StatusPublished
Cited by3 cases

This text of 378 F.3d 1396 (Power Mosfet Technologies, L.L.C. v. Siemens Ag) is published on Counsel Stack Legal Research, covering Court of Appeals for the Third Circuit primary law. Counsel Stack provides free access to over 12 million legal documents including statutes, case law, regulations, and constitutions.

Bluebook
Power Mosfet Technologies, L.L.C. v. Siemens Ag, 378 F.3d 1396 (3d Cir. 2004).

Opinion

378 F.3d 1396

POWER MOSFET TECHNOLOGIES, L.L.C. and Third Dimension Semiconductor, Inc., Plaintiffs-Appellants,
v.
SIEMENS AG, Infineon Technologies Corporation, and Infineon Technologies AG, Defendants-Cross Appellants, and
STMicroelectronics, N.V., STMicroelectronics, S.R.L, and STMicroelectronics, Inc. (formerly known as SGS-Thomson Microelectronics, Inc.), Defendants-Cross Appellants, and
International Rectifier Corporation and International Rectifier Corporation North Carolina, Defendants-Cross Appellants.

No. 03-1083.

No. 03-1469.

No. 03-1470.

No. 03-1471.

United States Court of Appeals, Federal Circuit.

Decided August 17, 2004.

Appeal from the United States District Court for the Eastern District of Texas, David Folsom, J. COPYRIGHT MATERIAL OMITTED COPYRIGHT MATERIAL OMITTED Allen M. Sokal, Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P., of Washington, DC, argued for plaintiffs-appellants. With him on the brief were Donald R. Dunner and Smith R. Brittingham IV. Of counsel on the brief was Alfonso Garcia Chan, Shore Deary, L.L.P., of Dallas, TX.

Robert Neuner, Baker Botts L.L.P., of New York, NY, argued for defendants-cross appellants Siemens AG, et al. With him on the brief were Neil P. Sirota of New York, NY; and Jeffrey D. Baxter, of Dallas, TX.

Constantine L. Trela, Jr., Sidley Austin Brown & Wood LLP, of Chicago, IL, argued for defendants-cross appellants STMicroelectronics, N.V., et al. With him on the brief was James P. Bradley, of Dallas, TX. Of counsel on the brief were Bruce S. Sostek and Jane Politz Brandt, Thompson & Knight LLP, of Dallas, TX. Of counsel was Li Chen, Sidley Austin Brown & Wood LLP, of Dallas, TX; and Max Ciccarelli, Thompson & Knight LLP, of Dallas, TX.

David E. Killough, Vinson & Elkins L.L.P., of Austin, TX, for defendants-cross appellants International Rectifier Corporation, et al. Of counsel was Glenn W. Trost, Coudert Brothers LLP, of Los Angeles, CA.

Before MICHEL, GAJARSA, and PROST, Circuit Judges.

GAJARSA, Circuit Judge.

Power Mosfet Technologies, L.L.C. ("PMT"), appeals the final judgment of the United States District Court for the Eastern District of Texas that United States Patent No. 5,216,275 (the "'275 patent") was not infringed by defendants-cross appellants Siemens AG, Infineon Technologies Corporation, and Infineon Technologies AG (collectively, "Infineon"), or by defendants-cross appellants STMicroelectronics, N.V., STMicroelectronics, S.R.L., and STMicroelectronics, Inc. (collectively, "ST"). Power Mosfet Techs. v. Siemens AG, No. 2:99-CV-168 (E.D.Tex. Sept. 30, 2002). PMT also appeals the district court's denial of its motion for a new trial. In the event that this court accepts certain arguments made by PMT, Infineon and ST conditionally cross-appeal the district court's judgment that the '275 patent was not anticipated by United States Patent No. 4,754,310 (the "Coe patent"). ST also conditionally cross-appeals the district court's judgment that the '275 patent is not anticipated by United States Patent No. 3,171,068 (the "Denkewalter patent"). Infineon alone cross-appeals the district court's denial of its motion for attorney fees. Finally, International Rectifier Corporation and International Rectifier Corporation North Carolina (collectively, "IR") cross-appeal the district court's denial of its motion for attorney fees under Federal Rule of Civil Procedure 54(d)(1) following the dismissal with prejudice of PMT's claims against it. For the reasons stated herein, we affirm the district court's judgment of noninfringement, its denial of PMT's motion for a new trial, and its denial of Infineon's motion for attorney fees and IR's motion for costs.

I. BACKGROUND

PMT is a Texas limited liability corporation with its corporate offices in Marshall, Texas, and is the owner of the '275 patent. The '275 patent is entitled "Semiconductor Power Devices with Alternating Conductivity Type High-Voltage Breakdown Regions."

A. Semiconductor Technology

Semiconductor power devices control the flow of electricity through an electronic circuit. They are typically constructed of silicon, which, by itself, is not a very good conductor of electricity. Silicon's conductivity, however, can be enhanced by a process known as doping. Doping adds impurities to the crystal structure of pure silicon and creates either a surplus or deficiency of free electrons in the silicon material. Both conditions enable the flow of current through the material. When doping results in a surplus of electrons, the material is described as "n-type" because it has a net negative charge. When the result is a deficiency of electrons (i.e., a surplus of "holes") the NOTE: FIGURE 1 IS ELECTRONICALLY NON-TRANSFERABLE.

material is described as "p-type" because it has a net positive charge. Within the n-type and p-type categories, the material may be further categorized as heavily doped (n + or p + regions) or lightly doped (n - or p - regions).

The semiconductor power device described in the '275 patent is known as a MOSFET. A cross-section from a traditional MOSFET is reproduced above from figure 1 of the '275 patent. The '275 patent describes the fabrication process of the traditional MOSFET device as follows: an n - layer 5 is grown on an n + substrate 4, followed by the growth of a p + layer 3 on the top of the n - layer 5. The above-described process may also be performed with p-type materials substituted for the n-type materials, and n-type materials for the p-type. '275 patent, col. 5, ll. 23-29. In the traditional MOSFET design, layer 5 consists of a single conductivity type, either n- or p-type.

Also shown in figure 1 are the electrical connections of the semiconductor device. The terminals labeled "S" are the "source" terminals, where a positive voltage source is connected to the device. The terminal labeled "D" is the "drain" terminal, where the negative voltage connection is made. Terminal "G" is the "gate" terminal, and controls the current flow or, simply put, turns the device on and off. When on, current flows from the source to drain and, when off, current flow is blocked. The '275 patent refers to region 5 as the "voltage sustaining layer" because, when not conducting current, it sustains a voltage between the S and D terminals.

The on and off states of a MOSFET device are controlled by applying a voltage to the gate terminal. When applied, the gate voltage creates an electric field inside the device that manipulates the electrons in the doped silicon to create conducting channels for current through the silicon material. When the gate voltage is removed, the electrons return to their normal positions and the voltage sustaining layer again prevents current from flowing through the device.

Two characteristics of MOSFETs are relevant to understanding the invention disclosed by the '275 patent. The "on-resistance" ("Ron") of the device is the resistance of the conducting channel through the semiconductor material. The higher the on-resistance, the greater the power loss (and accompanying heat generation) resulting from the current flow through the device.

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