Semicaps PTE Ltd v. Hamamatsu Corporation

District Court, N.D. California·Decided April 23, 2020·No. 4:17-cv-03440·Unknown

Opinion

SEMICAPS PTE LTD, Case No. 17-cv-03440-DMR Plaintiff, y. CLAIM CONSTRUCTION ORDER HAMAMATSU CORPORATION, et al., 1] Defendants. Plaintiff SEMICAPS Pte Ltd. (““SEMICAPS’”) filed this patent case against Defendants } Hamamatsu Corporation, Hamamatsu Photonics K.K., and Photonics Management Corp. (collectively, “Hamamatsu”). SEMICAPS alleges that Hamamatsu infringes several claims of U.S. Patent No. 7,623,982 (the “°982 patent’), which relates to testing of electronic circuits using alaser. The parties dispute the construction of three terms. This order follows briefing, a technology tutorial, and a claim construction hearing pursuant to Markman v. Westview Jnstruments, Inc., 517 U.S. 370 (1996). I. BACKGROUND A. The ‘982 Patent 71 SEMICAPS is the owner by assignment of the ‘982 patent titled, “Method of Testing an Electronic Circuit and Apparatus Thereof.” Compl. § 11, Ex. A (982 Patent). The °982 patent was issued by the United States Patent and Trademark Office (“USPTO”) on November 24, 2009. It “relates generally to semiconductor processing, and more particularly to a method of testing an electronic circuit, as well as to a respective apparatus,” and is directed toward determining the location of defects on a semiconductor circuit. See “982 Patent 1:6-8. The ‘982 patent describes the problem it seeks to solve. It explains that “conventional 2g || laser induced techniques generally involve using a scanned laser beam, typically in the infrared

frequency range, to stimulate integrated circuit failures which are sensitive to thermal or carrier stimulations.” ‘982 Patent at 1:16-19. These techniques include Optical Beam Induced Resistance Change (“OBIRCH”), Thermal Induced Voltage Alteration (“TIVA”), and Differential Resistance Measurement (“DReM”). Id. at 1:22-27. However, advances in integrated circuit technology, including “the use of more metallization layers and new low k inter-layer dielectric materials with lower thermal conductivity,” have reduced the laser coupling efficiency, which in turn reduces the detection sensitivity. Id. at 1:28-33. The inventors explain that “conventional approaches” to improve the detection sensitivity of laser induced techniques have not been entirely successful. For example, increasing the power of the laser beam used “in order to compensate for the reduced laser coupling efficiency . . . may not be desirable,” because “there may be potential laser induced damage on the integrated circuit under test when the power of the laser beam used is too high.” Id. at 1:38-49. Another approach is to use “a pulsed laser in conjunction with a lock-in amplifier,” which increases detection sensitivity. Id. at 1:50-52. However, lock-in amplifiers are “not used in a real-time integrated circuit testing environment” because “accurate calibration and fine control of the lock-in amplifier parameters is typically difficult to achieve in practice.” Id. at 1:62-67. According to the specification, the ‘982 patent attempts to increase detection sensitivity in a laser-based fault detection system without increasing the power of the laser beam or using lock- in amplifiers. ‘982 Patent at 10:19-46. “The method comprises radiating a laser beam onto the electronic circuit, and determining a plurality of samples of a response signal output by the electronic circuit during the period when the laser beam is radiated.” ‘982 Patent, Abstract. A signal processor “process[es] the sample measurements of the response signal of the electronic circuit under test” by “accumulat[ing] the plurality of samples to generate a value, and then generat[ing] a test result based on the value generated.” ‘982 Patent at 3:65-4:2. Based on the generated value, a fault on the electronic circuit may appear as a bright spot, bright line, or bright area at a pixel location corresponding to the location of the fault on the electronic circuit. Id. at 4:16-24, 4:34-38, 5:12-16. claims 4-8, 17, and 21-25. Claims 4-8 and 17 pertain to a method of testing an electronic circuit, while claims 21-25 describe a related apparatus. B. Procedural History SEMICAPS filed this lawsuit on June 14, 2017. On September 19, 2017, the court granted Hamamatsu’s unopposed motion to stay the case pending inter partes review (“IPR”) proceedings initiated by Hamamatsu challenging the validity of the ‘982 patent. [Docket No. 28.] The case resumed following the issuance of two Final Written Decisions by the Patent Trial and Appeal Board (““PTAB”) in the IPR proceedings. [Docket No. 53-1 (Marton Decl., June 6, 2019) □ 4, 5, Exs. B (Final Written Decision in IPR2017-02110), C (Final Written Decision in IPR2017- } 02112).] Hamamatsu then moved to dismiss the complaint, arguing that the asserted claims are invalid because they claim patent-ineligible subject matter. The court denied the motion on August 16, 2019. See SEMICAPS Pte Ltd. v. Hamamatsu Corp., 393 F. Supp. 3d 802 (N.D. Cal. 2019), reconsideration denied, No. 17-CV-03440-DMR, 2019 WL 5722568 (N.D. Cal. Nov. 5, 2019). Cc. Disputed Terms The parties dispute the proper construction of three terms: “value,” “another value,” and “test result.”' SEMICAPS asserts that these terms should be given their plain and ordinary meaning. Hamamatsu disagrees and proposes constructions for each of them. SEMICAPS proposes its own constructions in the event the court concludes that construction is necessary. II. LEGAL STANDARDS “The purpose of claim construction is to determine the meaning and scope of the patent claims asserted to be infringed.” O2 Micro Int’l Ltd. v. Beyond Innovation Tech, Co., 521 F.3d 1351, 1360 (Fed. Cir. 2008) (quotation omitted). Claim construction is a question of law to be determined by the court. Markman, 517 U.S. at 387. In construing disputed terms, the court first a The parties originally asked the court to construe three additional terms: “control system,” 2g || “measuring circuit,” and “signal processor.” They withdrew those terms shortly before the claim construction hearing. [See Docket No. 83.]

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