Rudolph Technologies, Inc. v. Camtek, Ltd.

666 F. App'x 925
Court of Appeals for the Federal Circuit·Decided December 22, 2016·No. 2015-1418·Unpublished

Opinions

Opinion dissenting-in-part filed by Circuit Judge Reyna.

Per Curiam.

Rudolph Technologies, Inc. (“Rudolph”) appeals an inter partes reexamination decision of the U.S. Patent and Trademark Office Patent Trial and Appeal Board (“Board”). The Board affirmed the examiner’s decision that rejected claims 1-3, 6, 7, 9-11, 14, and 17-19 of. U.S. Patent No. 7,729,528 (the “’528 patent”) as obvious. The Board rejected on new grounds claims 30-34 and 36 of the ’528 patent as obvious. We reverse the Board’s rejection of claims 9-11 as obvious. We affirm the Board’s obviousness determinations for claims 1-3, 6, 7, 14, and 17-19 on original grounds as supported by substantial evidence. We dismiss for lack of jurisdiction Rudolph’s appeal as to the newly rejected claims.

Background

The ’528 patent describes systems and methods for inspecting substrates, such as silicon wafers, used to fabricate computer chips or “die.” A substrate can consist of an individual die, a plurality of die, one portion of an individual die, or portions of an individual die. See generally claim 1. The claims are directed to using a visual inspection device for visually inputting multiple known good quality substrates and using a microprocessor to train the system and develop a model of a good quality wafer. ’528 Patent col. 7 11. 5-8, 13-16. The visual inspection device' may be any type of camera capable of high-resolution imaging. Id. cols. 9-10 11. 67-01. By creating a model from imaging multiple substrates, the model can be used to inspect substrates of unknown quality to distinguish good quality substrates from defective substrates. The inspection device accounts for color and other visual variations that could produce false negatives if a one-to-one comparison is used. Id. col. 8, 1.55-col. 9 1. 42, col. 14 11. 28-60. A gray scale is used for each pixel in the camera image, providing a value from 0 to 255 to indicate variation from pure black to pure white. Id. col. 14 11. 47-53. A mean may be determined from the pool of substrates. Id. col. 13 11. 13-19, col. 14 11. 47-49. Standard deviations of the gray scale value of each pixel may also be determined from the [927]*927pool. Id. col. 14 11. 54-60. Acceptable variations may be adjusted based on viewing additional substrates. Id. col. 14 11. 28-67.

Once a model of a good quality wafer is developed, substrates of unknown quality are inspected by the inspection device in a single inspection phase. The unknown quality substrate images are compared to the model to determine their quality. Id. cols. 15-18 11. 56-21. If the model and the inspected substrate match, then the inspected substrate passes inspection; if they do not match, then the inspected substrate fails inspection. Id. col. 7 1.54-col. 8 1. 15.

The ’528 patent has 53 claims, with independent claims 1, 9, 14, 30, and 32 being relevant to this appeal.

Claim 1 recites a “visual inspection device for visually inputting a plurality of known good quality substrates during training.” Claim 1 does not recite “training a model,” but the claim does reference “a microprocessor having processing and memory capabilities for developing a model of good quality substrate and comparing unknown quality substrates to the model.”

Claim 9 recites “training a model as to parameters of a good substrate via optical viewing of multiple known good substrates” and “inspecting the unknown quality substrates using the model.” Both claims 1 and 9 disclose the use of multiple substrates.

Claim 14 recites “a controller for comparing pixel data for unknown quality substrates to a model of a good quality substrate.” Unlike claims 1 and 9, claim 14 does not disclose forming a model through multiple substrates. Also, claim 14 does not recite the “training” or “training a model” limitations.

Claims 30 and 32 recite using at least two substrates to create a model. Claims 30 and 32 do not recite the “training” limitation.

All claims recite an “illuminator,” a method for “illuminating,” or a means for “illuminating” the substrate or a portion of the substrate during inspection.

Prior Art References

In the inter partes reexamination proceeding, the examiner relied on two references: U.S. Patent No. 5,982,921 (“Alu-mot”) and U.S. Patent No. 5,298,963 ■ (“Moriya”). See, e.g., J.A. 4-5, 1290-1303.

Alumot describes a system for inspecting individual die on semiconductor wafers. Alumot identifies defective die by comparing an inspected die to a reference pattern. Alumot teaches that inspection occurs in two phases and discloses that “it is contemplated, however, that the invention, or features thereof, could also be embodied in the apparatus which effects only the first examination or only the second examination.” J.A. 385. Alumot discloses that the reference pattern can be created using “at least one” reference:

As also indicated above, during the Phase I examination (and also the Phase II examination), the pattern of one die D, serving as the inspected pattern, is compared with the light pattern of at least one other die, serving as the reference pattern, to determine the likelihood of a defect being present in the inspected pattern.

Alumot col. 8 11. 37-43 (emphasis added).

Alumot further teaches that a comparator (i.e., Comparator 77) receives data about the reference pattern from a memory storing data about the reference (i.e., Reference Die Memory 75) and data about the die under inspection. J.A. 341, 376. The comparator then compares the two data items to determine whether the die is potentially defective. The comparison is done pixel by pixel. J.A. 341, 376: The reference image or pattern may therefore be a pat[928]*928tern on another like article (e.g., a die-to-die comparison), another like pattern on the same article (repetitive-pattern comparison), or data stored in a database (die-to-database comparison):

Instead of using, as a reference to be compared with the data derived from the inspected article, data generated from real images of another like article (in the die-to-die comparison), or of another like pattern on the same article (repetitive pattern comparison), the reference data may be generated from simulated images derived from a database; such a comparison is called a die-to-database comparison.

Alumot col. 27 11. 45-51 (emphases added); see also J.A. 1291.

Moriya discloses another system for inspecting the surface of semiconductor wafers. J.A. 303-21. In particular, Moriya teaches using an illuminator to provide illumination to a moving substrate and a camera for capturing still images of the moving substrate during inspection of the substrate’s surface. See, e.g., Moriya col. 4 11. 32-40, col. 7 11. 57-66, col. 8 11. 22-38.

Procedural History

'In 2012, Camtek Ltd. (“Camtek”) requested inter partes reexamination of the ’528 patent. The examiner rejected claims 1-3, 6, 7, 9-11, 14, and 17-19 as obvious over Alumot in view of Moriya and rejected claims 30-34 and 36 as anticipated by Alumot. J.A. 1290-1303. On appeal, the Board affirmed the examiner’s rejection of claims 1-3, 6, 7, 9-11, 14, and 17-19 as obvious. ¿.A. 10-11. The Board further rejected claims 30-34 and 36 on new grounds as obvious over Alumot. J.A. 15-16,19-21.

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Rudolph Technologies, Inc. v. Camtek, Ltd., 666 F. App'x 925 (Fed. Cir. 2016).

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