Robotic Vision Systems, Inc. v. View Engineering, Inc.

189 F.3d 1370, 51 U.S.P.Q. 2d (BNA) 1948, 1999 U.S. App. LEXIS 21337, 1999 WL 689569
CourtCourt of Appeals for the Federal Circuit
DecidedSeptember 3, 1999
Docket98-1477
StatusPublished
Cited by55 cases

This text of 189 F.3d 1370 (Robotic Vision Systems, Inc. v. View Engineering, Inc.) is published on Counsel Stack Legal Research, covering Court of Appeals for the Federal Circuit primary law. Counsel Stack provides free access to over 12 million legal documents including statutes, case law, regulations, and constitutions.

Bluebook
Robotic Vision Systems, Inc. v. View Engineering, Inc., 189 F.3d 1370, 51 U.S.P.Q. 2d (BNA) 1948, 1999 U.S. App. LEXIS 21337, 1999 WL 689569 (Fed. Cir. 1999).

Opinion

GAJARSA, Circuit Judge.

DECISION

View Engineering, Inc. (“View”) appeals the July 1, 1998 decision of the United States District Court for the Central District of California, Docket 96-CV-2288, finding that View had infringed U.S. Patent No. 5,465,152 (“the ’152 patent”), issued to the Robotic Vision Systems, Inc. (“RVSI”), and holding the patent to be not invalid for obviousness under 35 U.S.C. § 103. Because the trial court did not err in its determinations, we affirm.

BACKGROUND

Robotic Vision Systems, Inc. (“RVSI”) manufactures and sells machines to perform inspections of integrated circuit devices. Until June 1998, View Engineering, Inc. (“View”) also manufactured and sold inspection equipment, in particular, its Model 880 inspection machine. Although RVSI and View do not manufacture chips themselves, they sell equipment for use by device manufacturers.

United States Patent No. 5,465,152 issued to RVSI on November 7, 1995. The patent is directed to a “Method for Copla-narity Inspection of Package or Substrate Warpage for Ball Grid Arrays, Column Arrays, and Similar Structures.” Ball grid arrays (“BGAs”) are integrated circuit devices that have an array of solder balls on one face. Each ball sits on a metal pad, known as a “signal pad,” which in turn sits on a “substrate” and connects the ball to the internal integrated circuitry. “Coplanarity” refers to the degree to which a set of points are in the same plane, i.e., how “flat” something is. At the time of the invention, ball-top coplanarity measurements 1 were known in the prior *1372 art because it is important for device manufacturers to know the coplanarity of the solder balls to make sure that the BGA devices will mate properly with other devices.

The 152 patent discloses a method for using incident laser radiation to measure the coplanarity of a substrate. The measurements are not done on the substrate directly or on the ball-tops, but are done by using “index pads” on the substrate as targets to perform the measurements. 2 According to the written description, these index pads can be separately manufactured pads used only to measure substrate coplanarity, or the index pads can be selected from signal pads that may or may not eventually be used as BGA sites. The only independent claim in the 152 patent is claim 1, which reads as follows:

1. A method for determining coplanarity of substrates for ball grid array, column grid array, and similar surface mount integrated circuit chips, using 3-D optical sensing means, comprising the steps of:
[1] providing opaque fiducials as index pads
[2] where the heights of said index pads are correlated with signal pad heights in a neighborhood about said index pads;
[3] said index pads being opaque to incident radiation from said 3-D optical sensing means;
[4] reflecting by said index pads sufficient radiation allow height measurement by said 3-D optical sensing means;
[5] disposing said index pads in a prearranged pattern over a domain of array signal pads;
[6] restricting said index pads to a predetermined range of heights;
[7] measuring the heights of each of at least three said index pads at said index pad coordinate locations;
[8] suitably fitting a preselected surface shape to the index pad height and coordinate location data;
[9] and calculating the difference in height between each index pad and the preselected surface shape evaluated at the index pad location.

(paragraphing and emphasis added). Dependent claims 3 and 12 are also at issue. They read as follows:

3. A method as defined in claim 1, wherein said index pads are metallic and opaque.
12. A method as described in claim 1, in which the index pads are identical with the signal pads rather than separately fabricated elements intended solely for use as fiducial pads, which index pads are located at signal pad sites occupied by array elements such as bga balls, columns or other; and determining coplanarity prior to deposition of grid array elements.

The written description of the 152 patent discloses three examples as preferred embodiments of the claimed method:

There must be a close correlation between the heights of the index pads and the signal pads since the objective of having the index pads is to provide a means of inferring the heights of the signal pads. This can be accomplished by properly designing the fabrication process. One means of accomplishing this is to use unused signal pads as index pads. A second means is to construct index pads by plating additional material on existing signal pads using photoresist masking techniques to avoid plating signal pads which are not dedicated to indexing. ...
There are innumerable ways of creating and disposing the index pads over the substrate only several of which will be detailed here. However, other embodiments which generally follow the *1373 concepts outlined here are considered to be covered by this disclosure.
Three approaches serve to illustrate the method. In the first two cases, the index pads are selected from the totality of pad on the substrate. In third case, the index pads are fabricated separately from the signal pads. In case one, the index pads are selected from the total number of available pads and dedicated for measurement purposes. That is, they are empty signal pads. They are distributed over the substrate surface so that their height provides a measure of the variations in signal pad coplanarity.

T52 Patent, col. 5,11. 80-57 (emphasis added). Therefore, the written description discloses the use of signal pads as index pads, and index pads that are separately fabricated.

RVSI filed suit against View alleging that View infringed the method claims of the ’152 patent through the View Model 880 inspection machine. The 880 machine measures BGA coplanarity by using bare signal pads as laser targets. View moved for summary judgment of noninfringement, arguing that properly interpreted, the claim required the manufacture or fabrication of the index pads along with their measurement. The court, on summary judgment, rejected this argument and held that the language of claim 1 - specifically the terms “providing,” “correlating,” “disposing,” and “restricting” - did not require separate manufacture of the index pads, and encompassed the selection of pre-existing signal pads as index pads for measurement purposes.

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189 F.3d 1370, 51 U.S.P.Q. 2d (BNA) 1948, 1999 U.S. App. LEXIS 21337, 1999 WL 689569, Counsel Stack Legal Research, https://law.counselstack.com/opinion/robotic-vision-systems-inc-v-view-engineering-inc-cafc-1999.