Mlc Intellectual Property LLC v. Micron Technology, Inc.

10 F.4th 1358
CourtCourt of Appeals for the Federal Circuit
DecidedAugust 26, 2021
Docket20-1413
StatusPublished
Cited by22 cases

This text of 10 F.4th 1358 (Mlc Intellectual Property LLC v. Micron Technology, Inc.) is published on Counsel Stack Legal Research, covering Court of Appeals for the Federal Circuit primary law. Counsel Stack provides free access to over 12 million legal documents including statutes, case law, regulations, and constitutions.

Bluebook
Mlc Intellectual Property LLC v. Micron Technology, Inc., 10 F.4th 1358 (Fed. Cir. 2021).

Opinion

Case: 20-1413 Document: 98 Page: 1 Filed: 08/26/2021

United States Court of Appeals for the Federal Circuit ______________________

MLC INTELLECTUAL PROPERTY, LLC, Plaintiff-Appellant

v.

MICRON TECHNOLOGY, INC., Defendant-Appellee ______________________

2020-1413 ______________________

Appeal from the United States District Court for the Northern District of California in No. 3:14-cv-03657-SI, Senior Judge Susan Y. Illston. ______________________

Decided: August 26, 2021 ______________________

FABIO E. MARINO, Polsinelli PC, Palo Alto, CA, argued for plaintiff-appellant. Also represented by TERI HONG- PHUC NGUYEN.

RUFFIN B. CORDELL, Fish & Richardson PC, Washing- ton, DC, argued for defendant-appellee. Also represented by MICHAEL JOHN BALLANCO, CHRISTOPHER DRYER, TIMOTHY W. RIFFE, ROBERT ANDREW SCHWENTKER, ADAM SHARTZER.

WILLIAM F. LEE, Wilmer Cutler Pickering Hale and Dorr LLP, Boston, MA, for amici curiae Apple Inc., Dell Case: 20-1413 Document: 98 Page: 2 Filed: 08/26/2021

2 MLC INTELLECTIAL PROPERTY LLC V. MICRON TECHNOLOGY, INC.

Inc., HP Inc., Intel Corporation. Also represented by BENJAMIN NOAH ERNST, MARK CHRISTOPHER FLEMING, LAUREN B. FLETCHER.

ANDREW DUFRESNE, Perkins Coie LLP, Madison, WI, for amici curiae Computer & Communications Industry As- sociation, High Tech Inventors Alliance. Also represented by THOMAS ANDREW CULBERT, THERESA H. NGUYEN, Seat- tle, WA.

PHILLIP R. MALONE, Juelsgaard Intellectual Property and Innovation Clinic, Mills Legal Clinic, Stanford Law School, Stanford, CA, for amici curiae Engine Advocacy, The R Street Institute. Also represented by ABIGAIL A. RIVES, Engine Advocacy, Washington, DC. Amicus curiae The R Street Institute also represented by CHARLES DUAN, R Street Institute, Washington, DC. ______________________

Before NEWMAN, REYNA, and STOLL, Circuit Judges. STOLL, Circuit Judge. MLC Intellectual Property, LLC seeks interlocutory re- view of the United States District Court for the Northern District of California’s orders excluding certain opinions of MLC’s damages expert. For the reasons that follow, we af- firm the district court’s orders precluding MLC’s damages expert from characterizing certain license agreements as reflecting a 0.25% royalty, opining on a reasonable royalty rate when MLC failed to produce key documents and infor- mation directed to its damages theory when requested prior to expert discovery, and opining on the royalty base and royalty rate where the expert failed to apportion for non-patented features. Case: 20-1413 Document: 98 Page: 3 Filed: 08/26/2021

MLC INTELLECTUAL PROPERTY LLC v. 3 MICRON TECHNOLOGY, INC.

BACKGROUND I MLC sued Micron for infringing certain claims of U.S. Patent No. 5,764,571. The ’571 patent, titled “Electri- cally Alterable Non-Volatile Memory with N-bits Per Cell,” describes methods of programming multi-level cells. The specification discloses that, in conventional single-bit per cell memory devices, a memory cell assumes either an “on” state or an “off” state, defining one bit of information. Thus, a memory device that stores n-bits of data requires n separate memory cells, meaning that the number of memory cells must increase on a one-for-one basis with the number of bits to be stored. The specification explains that an alternative approach to the single-bit per cell approach involves storing multi- ple-bits of data in a single memory cell, known as a multi- level cell. Prior approaches to multiple-bit per cell non-vol- atile memory have only used mask programmable read- only-memories (ROMs). This may be accomplished by var- ying the channel width or length of the memory cell “such that 2n different conductivity values are obtained which correspond to 2n different states corresponding to n-bits of data which can be stored on a single memory cell.” ’571 pa- tent col. 1 ll. 45–49. Another conventional ROM approach involves varying an ion implant for the threshold voltage “such that the memory cell will have 2n different voltage thresholds (Vt) corresponding to 2n different states corre- sponding to n-bits of data which can be stored on a single memory cell.” Id. at col. 1 ll. 49–54. In these multi-bit ROM approaches, the 2n conductivity level must be deter- mined during the manufacturing process, and the memory can only be used for one data pattern. Thus, each time a data pattern needs to be changed, a new batch of semicon- ductor wafers must be processed. Conventional alterable multiple-bit per cell memories can store multiple levels of charge on a capacitive storage Case: 20-1413 Document: 98 Page: 4 Filed: 08/26/2021

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element, such as dynamic random access memory (DRAM) or charge-coupled devices (CCDs). These approaches use volatile storage by providing “2n different volatile charge levels on a capacitor to define 2n different states corre- sponding to n-bits of data per memory cell.” Id. at col. 2 ll. 22–25. The problem with volatile storage is that a cell loses its data whenever power is removed, and cells must be periodically refreshed as they can lose charge over time. The ’571 patent purports to solve these problems in ROM and DRAM multiple-bit memories by disclosing a multi-bit semiconductor memory cell that has the non-vol- atile characteristics of ROM, as well as the electrically al- terable characteristics of a multi-bit per cell DRAM. Particularly, the specification describes a multi-bit per cell electrically alterable non-volatile memory (EANVM) where each cell stores information in Kn memory states, “where K is a base of a predetermined number system, n is a number of bits stored per cell, and Kn>2.” Id. at col. 2 ll. 58–61. Moreover, the ’571 patent discloses programming the multi-level cell to a state corresponding to the input infor- mation and comparing the memory state of the multi-level cell with the input information, where the input infor- mation corresponds to a reference voltage. On appeal, MLC only asserts claim 30 of the ’571 pa- tent against Micron, which reads as follows: 30. Apparatus for programming an electrically al- terable non-volatile memory cell having more than two predetermined memory states, comprising: a selecting device which selects one of a plurality of reference signals in accordance with information indicating a memory state to which said memory cell is to be programmed, each reference signal cor- responding to a different memory state of said memory cell; Case: 20-1413 Document: 98 Page: 5 Filed: 08/26/2021

MLC INTELLECTUAL PROPERTY LLC v. 5 MICRON TECHNOLOGY, INC.

a programming signal source to apply a program- ming signal to said memory cell; and a control device to control the application of said programming signal to said memory cell based on the selected reference signal. Id. at col. 15 ll. 10–22. The scope of claim 30 is narrower than the scope of the other independent claims in the ’571 patent. While the other independent claims are di- rected to a “multi-level memory device” or a “multi-level memory apparatus,” claim 30 is more narrowly directed to an “[a]pparatus for programming an electrically alterable non-volatile memory cell having more than two predeter- mined memory states.” Compare, e.g., id. at col. 12 l. 6, with id. at col. 15 ll. 10–12. II Micron manufactures and sells NAND flash wafers and packages. Flash memory is a type of non-volatile memory, and NAND flash memory is a low-cost, high-density memory option. As such, NAND flash memory is consid- ered the standard for storage-related applications. Both Micron’s NAND flash wafer, or bare die assembly, and NAND flash package may include multiple dies. Included in each die is a memory array, which may comprise both single-level and multi-level memory cells.

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