In re Nomiya

509 F.2d 566
CourtCourt of Customs and Patent Appeals
DecidedFebruary 6, 1975
DocketPatent Appeal No. 74-514
StatusPublished
Cited by33 cases

This text of 509 F.2d 566 (In re Nomiya) is published on Counsel Stack Legal Research, covering Court of Customs and Patent Appeals primary law. Counsel Stack provides free access to over 12 million legal documents including statutes, case law, regulations, and constitutions.

Bluebook
In re Nomiya, 509 F.2d 566 (ccpa 1975).

Opinion

RICH, Judge.

This appeal is from the decision of the Patent Office 1 Board of Appeals affirming the rejection under 35 U.S.C. § 103 of claims 1-8 and 33 in application serial No. 768,794, filed October 18, 1968, for “Semiconductor Circuit Devices Using Insulated Gate-Type Field Effect Elements Having Protective Diodes.” We reverse.

The Invention

Appellants’ invention pertains to insulated-gate-type field-effect transistors (hereinafter IGFET) and their use in [567]*567semiconductor capacitive memory cireuits having very low capacitance. For ease of discussion we reproduce Figs. 1 and 2 of the application:

The structure of Qj in Fig. 1 is an IGFET, consisting of two P-type2 regions, Si and Di, diffused into an N-type starting crystal, or substrate, usually of silicon, with an insulating oxide layer SÍO2 formed on the surface of the N-type substrate and contacting the diffused P-type regions. A metal gate electrode Gi is attached to the insulating layer. IGFETs used as switching devices, as contemplated by appellants, are customarily fabricated in the OFF-mode. In this mode, when no voltage is applied to the gate, the two P-type regions, called source (Si) and drain (Di), are electrically insulated from each other by the N-type region surrounding them. However, when a negative voltage, such as a clock pulse, is applied to the gate, the electric field so produced induces a thin P-type channel across the surface of the N-type channel across the surface of the N-type region connecting the source and the drain, permitting a current to pass between them. See In re Carlson, 412 F.2d 255, 56 CCPA 1309 (1969). Fig. 2 is a circuit diagram of a dynamic shift register employing the IGFET device of Fig. 1 [568]*568as a switch to control a bit of information stored in capacitor C, which may be distributive capacitance of the circuit.

According to the application,

* * * since the gate Gi of an insulated gate-type field effect transistor Qi as shown in Figure 1 has a high capacitive input impedance, a very small amount of electric charge accumulated on the gate Gj induces a high voltage and sometimes causes the insulating film (usually silicon dioxide) between the gate Gi and semiconductor substrate 1 to break down. Therefore, it has been proposed that a protective diode be formed, i. e. a zener diode Recj, integrally in the semiconductor body 1 and that the diode be connected in parallel with the gate Gi shown in Figure 1. It has been believed that the protective diode could prevent the insulating film from breakdown without interfering with the characteristics of the field effect transistor.

Appellants claim to have discovered that when IGFETs having protective diodes formed in the same substrate, as shown in Fig. 1, are used as switches for storing information or input signals in a memory element having very small capacitance (C on Fig. 2), parasitic transistor action between the protective diode and the drain region may take place when the PN junction Jr of the protective diode Recj is forward biased3 by a noise signal, causing the signal stored in the memory element to discharge through the drain region Di despite the lack of a pulse applied to the gate electrode. The solution to this problem found by appellants, which they claim as their invention, is a voltage-limiting means auxiliary to the protective diode, which can be a high resistance or another protective diode (hereinafter called “shunt diode”), formed outside the substrate or electrically isolated from other circuit elements on the substrate, connected in parallel with and in the same direction as the protective diode Reci.

Claim 1, with reference letters keyed to Fig. 1 and emphasis supplied, is illustrative:

1. In a semiconductor device comprising:
an insulated gate-type field effect component [QJ including a semiconductor substrate [1] of first conductivity type, source [Sj] and drain [Dj] regions of second conductivity type opposite to said first conductivity formed in a surface of said semiconductor substrate, and an insulated gate electrode [Gi] disposed on said surface between said source and drain regions and insulated from said substrate by an insulating film [Si02]; and
a protecting semiconductor diode [Reci] formed integrally in said substrate and connected in parallel between said insulated gate electrode and said semiconductor substrate for protecting the insulating film interposed between said gate electrode and said substrate from breakdown; the improvement comprising
auxiliary means connected with said semiconductor device for preventing minority carriers from said protecting semiconductor diode from reaching said drain region through said semiconductor substrate when noise signals are applied to the protecting diode.

Claim 2 is similar to claim 1 and is cast in the same “Jepson” form. Dependent claims 3-8 depend from claim 2 and recite various added limitations. Claim 33 defines a “memory circuit device” containing appellants’ invention. If claim 1 is patentable, so are the other claims.

The Rejection

The examiner cited Bergersen et al. [Bergersen] U.S. patent 3,408,511, issued October 29, 1968 on an application filed May 13, 1966. The Bergersen specification states in part:

This invention relates to an improved insulated-gate field-effect transistor (IGFET) circuit having large bi[569]*569polarity voltage capabilities. This circuit is operative as an active component of an electronic chopper or an electronic analog switching circuit and is adapted to receive large bipolarity analog input signal voltages.
When an insulated-gate field-effect transistor is used in analog switching or chopper circuits, it must be voltage controlled in such a manner that the P — N junctions between semiconductor substrate and source regions and between semiconductor substrate and drain regions do not become forward biased and enable current to flow from either the substrate region to the source region or from the substrate region to the drain region, respectively. This requirement means that the insulated-gate field-effect transistor can only handle input signals of a limited amplitude if these signals are connected directly in parallel with either of the above defined P-N junctions and between one of the source or drain regions and the substrate region, which is usually at ground potential. If, using the above-described connection, the input signals applied across either of the P-N junctions would be at a voltage level sufficiently high to forward bias these P — N junctions into conduction, then an alternative input signal connection must be resorted to. One such alternative connection involves disconnecting the substrate region from its ground return and from the source of input signals, leaving the substrate region floating.

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