In Re Applied Materials, Inc.

692 F.3d 1289, 103 U.S.P.Q. 2d (BNA) 2000, 2012 WL 3711586, 2012 U.S. App. LEXIS 18349
CourtCourt of Appeals for the Federal Circuit
DecidedAugust 29, 2012
Docket2011-1461, 2011-1462, 2011-1463, 2011-1464
StatusPublished
Cited by72 cases

This text of 692 F.3d 1289 (In Re Applied Materials, Inc.) is published on Counsel Stack Legal Research, covering Court of Appeals for the Federal Circuit primary law. Counsel Stack provides free access to over 12 million legal documents including statutes, case law, regulations, and constitutions.

Bluebook
In Re Applied Materials, Inc., 692 F.3d 1289, 103 U.S.P.Q. 2d (BNA) 2000, 2012 WL 3711586, 2012 U.S. App. LEXIS 18349 (Fed. Cir. 2012).

Opinions

Opinion for the court filed by Circuit Judge LINN.

Dissenting opinion filed by Circuit Judge NEWMAN.

LINN, Circuit Judge.

Applied Materials, Inc. (“Applied”) appeals from four decisions of the Board of Patent Appeals and Interferences (“Board”). The Board affirmed the examiner’s rejections under 35 U.S.C. § 103 in separate ex parte reexaminations of the claims of Applied’s U.S. Patents No. 5,921,855 (“'855 Patent”); No. 6,520,847 (“'847 Patent”); No. 6,699,115 (“'115 Patent”); and No. 6,824,455 (“'455 Patent”) (collectively, “Applied’s Patents”) covering polishing pads for chemical mechanical polishing (“CMP”). Ex parte Applied Materials, Inc., Reexamination No. 90/010,106, 2010 WL 3454259, at *10 (B.P.A.I. Aug. 31, 2010) (“Applied /”); Ex parte Applied Materials, Inc., Reexamination No. 90/010,107, 2010 WL 3454261, at *10 (B.P.A.I. Aug. 31, 2010) (“Applied II”); Ex parte Applied Materials, Inc., Reexamination No. 90/010,108, 2010 WL 3448884, at *10 (B.P.A.I. Aug. 31, 2010) (“Applied III”); Ex parte Applied Materials, Inc., Reexamination No. 90/010,109, 2010 WL 3448885, at *10 (B.P.A.I. Aug. 31, 2010) (“Applied IV”). The Board denied rehearing in each case. Ex parte Applied Materials, Inc., Reexamination No. 90/010,106, 2011 WL 938723, at *3 (B.P.A.I. Mar. 17, 2011); Ex parte Applied Materials, Inc., Reexamination No. 90/010,107, 2011 WL 938725, at *3 (B.P.A.I. Mar. 17, 2011); Ex parte Applied Materials, Inc., Reexamination No. 90/010,108, 2011 WL 938733, at *3 (B.P.A.I. Mar. 17, 2011); Ex parte Applied Materials, Inc., Reexamination No. 90/010,109, 2011 WL 938726, at *3 (B.P.A.I. Mar. 17, 2011). The four appeals are consolidated before this court. Because the Board’s decisions are supported by substantial evidence, this court affirms.

I. Background

A. The Patents

Integrated circuits are formed on a substrate “by the sequential deposition of conductive, semiconductive or insulative layers” that are “etched [after deposition] to create circuitry features.” '855 Patent col.l 11.10-14; '847 Patent col.l 11.22-26; '115 Patent col.l 11.23-27; '455 Patent col.l 11.25-29. Because the substrate surface becomes increasingly non-planar through this process, the substrate must be periodically planarized, i.e. flattened. '855 Patent col.l 11.14-30; '847 Patent col.l 11.26-32; '115 Patent col.l 11.27-33; '455 Patent col.l 11.29-35. CMP is one method of planarizing in which the substrate to be planarized is placed against a rotating polishing pad, and a polishing slurry is applied. '855 Patent col.l 11.31-48; '847 Patent col.l 11.33-52; '115 Patent col.l 11.34-52; '455 Patent col.l 11.36-54. Problems in the art— particularly for pads with perforations— included the uneven distribution of slurry, the accumulation of waste material during pad conditioning, and a polishing problem associated with pad flexibility. '855 Patent col.l 1.62-col.2 1.48; '847 Patent col.2 11.10-61; 115 Patent col.2 11.10-61; '455 Patent col.2 11.12-65. The claimed inventions are “sufficiently rigid” pads with grooves that advantageously distribute the [1293]*1293slurry, remove waste material, and increase pad life. '855 Patent col.3 11.16-24; '847 Patent col.4 11.4-12; '115 Patent col.4 11.4-12; '455 Patent col.411.7-15.

Applied’s Patents were amended during the reexamination. The amended claims cover pads (or an apparatus with a pad) for CMP with grooves having a depth “between about 0.02 inches and 0.05 inches,” a width “between about 0.015 inches and 0.04 inches,” a pitch “between about 0.09 inches and 0.24 inches,” and “sidewalls that are substantially perpendicular to the polishing surface.” Applied I at *1 (emphasis removed); see also Applied II at *1-2; Applied III at *1-2; Applied IV at *1-2. The pitch refers to “the radial distance between adjacent grooves.” '855 Patent col.5 11.28-29; '847 Patent col.6 11.42-44; '115 Patent col.6 11.42-44; '455 Patent col.6 11.39-41.

B. Proceedings Below

The Board’s decision in each of the consolidated appeals is essentially identical. The Board affirmed the examiner’s obviousness rejections under 35 U.S.C. § 103(a) based on the following prior art: (1) “Improving CMP Performance Using Grooved Polishing Pads” from the CMP-MIC Conference on February 22-23, 1996 by Milind Weling, et al. (“Weling”); (2) the English translation of a Japanese Patent Application, publication number H5146969, published June 15, 1993 (“Breivogel”); and (3) a European Patent Application, publication number 0 674 972 Al, published April 10,1995 (“Talieh”).

Weling discloses U-shaped grooves but also discloses a groove depth and pitch smaller than that claimed in Applied’s Patents. Nevertheless, the Board found that Weling’s disclosure of a width of 0.01 inches met the claim limitation requiring widths between “about 0.015 inches and 0.04 inches.”

Talieh and Breivogel disclose grooves with larger dimensions than the grooves in Weling. Breivogel’s calculated width and pitch overlap with those claimed in Applied’s Patents. While the width and pitch disclosed in Talieh are larger than those in Applied’s Patents, Talieh discloses that the grooves can have a larger or smaller pitch. The depth disclosed by Talieh and Breivogel overlap the depths claimed in Applied’s Patents. The overlap between the ranges in Applied’s claims and the dimensions disclosed in the prior art was accurately depicted by the United States Patent and Trademark Office (“PTO”) in the following table.

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Appellee’s Br. 22.

The Board found Applied’s claims obvious because the prior art discloses values overlapping the claimed ranges and the dimensions were result-effective variables. The Board treated the identification of an optimal range of a result-effective variable as being within the ordinary skill in the [1294]*1294art. See In re Boesch, 617 F.2d 272, 276 (CCPA 1980); In re Aller, 42 CCPA 824, 220 F.2d 454, 456 (1955).

The Board found that Applied failed to provide evidence that the claimed groove dimensions produced unexpected results. Additionally, the Board found that Weling did not teach away from the invention claimed in Applied’s Patents and that there was insufficient evidence of commercial success to outweigh the evidence of obviousness.

In each case, Applied requested rehearing, which the Board denied. Applied appeals all four decisions of the Board. This court has jurisdiction under 28 U.S.C. § 1295(a)(4).

II. Discussion

A. Standard of Review

Obviousness is a question of law with several underlying factual inquiries, including what a reference teaches, whether a reference teaches away, and whether there is commercial success. Graham v. John Deere Co. of Kan. City, 388 U.S. 1, 17-18, 86 S.Ct. 684, 15 L.Ed.2d 545 (1966); Para-Ordnance Mfg., Inc. v. SGS Imps. Int'l Inc.,

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692 F.3d 1289, 103 U.S.P.Q. 2d (BNA) 2000, 2012 WL 3711586, 2012 U.S. App. LEXIS 18349, Counsel Stack Legal Research, https://law.counselstack.com/opinion/in-re-applied-materials-inc-cafc-2012.