CelLink Corp. v. Manaflex LLC

District Court, N.D. California·Decided October 3, 2025·No. 4:23-cv-04231·Unknown

Opinion

CELLINK CORP., Case No. 23-cv-04231-HSG

Plaintiff, CLAIM CONSTRUCTION ORDER v. Re: Dkt. No. 157

Defendant.

On August 18, 2023, Plaintiff CelLink Corp. filed this action against Defendant Manaflex LLC (“Manaflex”) for patent infringement, trade secret misappropriation, and correction of inventorship.1 Dkt. No. 1. The parties now seek construction of ten terms found in the three asserted patents. Dkt. Nos. 157 (“CelLink Br.”), 160 (“Manaflex Br.”), 163 (“CelLink Reply Br.”). This order follows claim construction briefing and a claim construction hearing. CelLink accuses Manaflex of infringing U.S. Patent Nos. 11,116,070 (the “’070 Patent”); 12,035,459 (the “’459 Patent”); and 12,040,511 (the “’511 Patent”) (collectively, the “Asserted Patents”). Dkt. No. 132 (“SAC”). “The Asserted Patents all relate to [] interconnect circuits for use in a variety of different applications, including battery packs, solar arrays, vehicles, and light fixtures, among others, and methods of forming the same.” CelLink Br. at 6.2 1 CelLink’s initial complaint only brought claims for patent infringement of U.S. Patent No. 11,116,070 and trade secret misappropriation. Dkt. No. 1 ¶¶ 26–43. CelLink’s first amended complaint added claims for patent infringement of U.S. Patent Nos. 12,035,459 and 12,040,511 and correction of inventorship. Dkt. No. 106 ¶¶ 60–105, 116–130. A. The ’070 Patent The ’070 Patent is entitled “Interconnect Circuit Methods and Devices” and issued on September 7, 2021. Dkt. No. 157-4 (“’070 Patent”). The ’070 Patent describes “interconnect circuits and methods of forming thereof.” Id., Abstract. As explained in the specification, prior art electrical interconnects “ha[d] limited functionality and [were] limited to a relatively small set of material choices.” Id. at 1:22–44. The specification proposes as a solution “new methods of forming interconnect circuits that provide new designs and functionalities of these circuits, including complex patterns and shapes of conductive layers, new materials and features in insulating layers, thermal properties, low weight for a given electrical current, and the like.” Id. at 1:45–50. The specification goes on to describe a method that “may involve laminating a substrate to a conductive layer followed by patterning the conductive layer.” Id. at 1:55–57. “This patterning operation forms individual conductive portions, which may be also referred to as traces or conductive islands.” Id. at 1:57–59. “The substrate supports these portions relative to each other during and after patterning[,]” and “[a]fter patterning, an insulator may be laminated to the exposed surface of the patterned conductive layer.” Id. at 1:59–62. “At this point, the conductive layer portions are also supported by the insulator, and the substrate may optionally be removed, e.g., together with undesirable portions of the conductive layer.” Id. at 1:62–65. “Alternatively, the substrate may be retained as a component of the circuit and the undesirable part of the patterned conductive layer may be removed separately.” Id. at 1:65–2:1. “These approaches allow using new patterning techniques as well as new materials for substrates and/or insulators.” Id. at 2:1–3. The ’070 Patent has one independent claim—claim 1—which recites: A method of forming an interconnect circuit, the method comprising: laminating a substrate to a conductive layer, wherein the conductive layer is a metal foil, comprising a first side and a second side, opposite of the first side, and having a constant thickness, and wherein the substrate comprises an adhesive layer, laminated to the second side of the conductive layer; laminated to the substrate, wherein patterning the conductive layer forms a first conductive portion and a second conductive portion of the conductive layer, at least partially separated from the first conductive portion, wherein the substrate maintains orientation of the first conductive portion relative to the second conductive portion after patterning the conductive layer; after patterning the conductive layer, laminating a first insulator to the first side of the conductive layer; and

after laminating the first insulator to the first side of the conductive layer, removing the substrate from the conductive layer, wherein the first insulator maintains the orientation of the first conductive portion relative to the second conductive portion after the substrate is removed. Id. cl. 1. Dependent claims 2–20 of the ’070 Patent recite the method of independent claim 1 with additional limitations. B. The ’459 Patent The ’459 Patent is entitled “Methods of Forming Flexible Interconnect Circuits” and issued on July 9, 2024. Dkt. No. 157-2 (“’459 Patent”). The ’459 Patent and ’070 Patent are in the same patent family and share the same specification. The ’459 Patent has three independent claims—claims 1, 21, and 23. Claim 1 recites: A method of forming a flexible interconnect circuit, the method comprising:

laminating a substrate to a conductive layer, wherein:

the conductive layer comprises a first side and a second side, opposite of the first side, and the substrate is laminated to the second side of the conductive layer;

patterning the conductive layer using one or more of laser cutting and laser ablation while the conductive layer remains laminated to the substrate, wherein:

patterning the conductive layer forms a first conductive portion and a second conductive portion of the conductive layer, at least partially separated from the first conductive portion,

patterning the conductive layer further forms a third conductive second pattern opening from the second conductive portion, patterning the conductive layer comprises removing the third conductive portion from the substrate thereby forming a pattern opening in place of the first pattern opening, the third conductive portion, and the second pattern opening, and

the substrate maintains orientation of the first conductive portion relative to the second conductive portion during and after patterning;

laminating a first insulator to the first side of the conductive layer while the conductive layer remains laminated to the substrate; removing the substrate from the conductive layer, wherein the first insulator maintains the orientation of the first conductive portion relative to the second conductive portion while and after the substrate is removed; and

laminating a second insulator to the second side of the conductive layer while the first insulator remains laminated to the first side of the conductive layer, wherein:

the first insulator comprises a first-insulator opening prior to laminating the first insulator to the first side of the conductive layer,

the second insulator comprises a second-insulator opening prior to laminating the second insulator to the second side of the conductive layer, and

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CelLink Corp. v. Manaflex LLC, (N.D. Cal. 2025).

CelLink Corp. v. Manaflex LLC (CelLink Corp. v. Manaflex LLC) — published by Counsel Stack Legal Research, free access to 12M+ legal documents.

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