Application of Franklin W. Herrick and Louis H. Bock

397 F.2d 332, 55 C.C.P.A. 1238
CourtCourt of Customs and Patent Appeals
DecidedJune 20, 1968
Docket7396
StatusPublished
Cited by2 cases

This text of 397 F.2d 332 (Application of Franklin W. Herrick and Louis H. Bock) is published on Counsel Stack Legal Research, covering Court of Customs and Patent Appeals primary law. Counsel Stack provides free access to over 12 million legal documents including statutes, case law, regulations, and constitutions.

Bluebook
Application of Franklin W. Herrick and Louis H. Bock, 397 F.2d 332, 55 C.C.P.A. 1238 (ccpa 1968).

Opinions

SMITH, Judge.

A single legal issue emerges from this twice-argued appeal: whether the subject matter sought to be patented is obvious within the meaning of 35 U.S.C. § 103. Because we conclude that the evaluation of that subject matter as a whole according to the statutory pre[333]*333cepts may not be sustained, we reverse the decision of the board.

This appeal returns to this court for determination after having been once remanded1 to the Patent Office. The remand was for further proceedings consistent with our opinion pointing out that the nature of the original rejection, and particularly the excessive number of different combinations of references relied upon, defeated the intent and purpose of 35 U.S.C. § 132. That purpose, which we there made clear, is to insure that applicants for patent are properly apprised of the rejection they must meet.

The remand has resulted in a modified examiner’s Answer, and a new decision by the Board of Appeals,2 having the effect of substantially reducing the number of references to be considered3 and thereby simplifying the basis for the rejection at least to the extent inherent in that action.4

The Invention

Appellants’ application5 discloses and claims a partially-condensed polymethylol phenol, a method for producing it, a composition of it with an alkali lignin and a process for forming a condensation product of the polymethylol phenol and alkali lignin. Claims 1, 2 and 4 are representative and read:

1. The process for producing polymethylol phenol which comprises reacting phenol with from 2.5 to 3.0 moles of aqueous formaldehyde in the presence of from 0.25 to 1.0 moles of sodium hydroxide, reacting the materials at a reflux temperature to form a polymethylol phenol having a mole ratio of from 2.3 to 2.52 moles of formaldehyde per mole of phenol, cooling the mixture to arrest condensation, adding sulfuric acid and water to the mixture and keeping the temperature below 10 °C., separating the condensate as a heavy syrup from an aqueous portion, and washing the condensate with water to free it from inorganic material, said polymethylol phenol being insoluble in water but soluble in alcohol.

2. An improved polymethylol phenol in the form of a heavy syrup having a combined formaldehyde-to-phenol mole ratio of from 2.3 to 2.52 and having a degree of condensation such that it is water insoluble but soluble in organic solvents including methanol, and being free of inorganic material.

4. The resin-forming composition comprising a polymethylol phenol in the form of a heavy syrup having a mole ratio of combined formaldehyde-to-phenol of from 2.3 to 2.52 which is water insoluble containing no free formaldehyde and being free of inorganic material, and an alkali lignin which is free of inorganic material in admixture with the polymethylol phenol, said mixture being soluble in or[334]*334ganic solvents including methanol and being condensible by heating to an insoluble, infusible resin which has low water absorption and high dielectric properties.

Claim 3, like claim 2, is directed to the polymethylol phenol; claims 5 and 6 are directed to the same composition as claim 4; and claim 8 is directed to the process of forming the condensation product attained with the composition of claim 4.

In the words of the specification, the polymethylol phenol of the invention is:

* * * characterized by having a formaldehyde to phenol ratio of from 2.30 to 2.52, freedom from inorganic constituents, and a state of condensation in such a narrow range that it is water insoluble but soluble in polar organic solvents, and is advantageously useful for forming laminating varnishes, as a component of thermosetting phenolic resin compositions, as curing agent for other phenolic materials, and for other purposes where thermosetting condensates that yield insoluble, infusible products are useful. The polymethylol phenol is soluble in such organic solvents as the lower alcohols and is compatible with natural [sic] occurring phenolic materials such as lignin, quebracho and phenolic constituents of bark. Compositions of the polymethylol phenol and such naturally occurring phenolic materials are thermosetting and can be used to make molding compounds, and paper laminates with properties equivalent to those made with conventional phenolic laminating resins. * * *

The products of the invention, being free from electrically conducting electrolytes, can be used to form laminates where dielectric properties are essential. Additionally, they have excellent dimensional stability and resistance to water.

The Prior Art

As a result of the action taken on the remand, the claims now stand rejected on prior art consisting of the following:

Amann et al. (Amann)

Thompson et al. (Thompson)

Reboulet

Schrader et al. (Schrader)

Dietz

1,614,171

2,186,687

2,228,976

2,620,321

2,673,190

Martin, “The Chemistry of Phenolic Resins” John Wiley and Sons, Inc., New York, 1956

Jan. 11, 1927

Jan. 9, 1940

Jan. 14, 1941 Dec. 2, 1952

Mar. 23, 1954

pages 23, 24, 97 and 127,

Amann describes the production of a mixture of phenol alcohols by the treatment of phenols with formaldehyde in the presence of an alkali. It states that dihydroxy diphenyl methane derivatives or higher molecular compounds of resinous character are formed if the reaction is not modulated directly by cooling or the like. Use of 1.5 or more moles of formaldehyde per mole of phenol is disclosed. The reference includes an example directed to a reaction product having a mole ratio of 2.5 moles of formaldehyde to 1 mole of phenol, which is precipitated by a weak acid while adding water and then concentrated to provide a thin brown oil.

Thompson discloses preparation of phenol-formaldehyde resin compositions to be used in the production of laminated [335]*335bodies and as adhesives. The compositions are prepared by reacting formaldehyde with phenol at more than a 2 to 1 mole ratio in the presence of an alkaline catalyst such as sodium hydroxide, neutralizing with an acid and then cooling and dehydrating.

Reboulet discloses the use of a thermoplastic lignin with 50% or more of “a binder having thermosetting characteristics, such as phenol-formaldehyde resin,” to provide a thermosetting molded product.

Schrader is directed to an adhesive prepared by mixing together a “base” resin and a “catalytic” or “nucleated” resin. The “catalytic” resin is prepared by reacting 2.25 to 3.5 moles of formaldehyde per mole of phenol in the presence of from 0.5 to 1 mole of a mixture of alkali metal hydroxide and alkali metal carbonate at a temperature between 55° and 70° C. for from 4 to 10 hours.

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397 F.2d 332, 55 C.C.P.A. 1238, Counsel Stack Legal Research, https://law.counselstack.com/opinion/application-of-franklin-w-herrick-and-louis-h-bock-ccpa-1968.