§ 21-17-436 — Interim debentures; bonds for funding

(a) For the purpose of funding any interim debentures, any
bonds pledged as collateral security to secure the payment of
interim debentures, upon their surrender as pledged property,
may be reissued, and any bonds not previously issued but
authorized to be issued by any law for a purpose or purposes the
same as or encompassing the purpose or purposes for which the
interim debentures were issued, may be issued for such a
funding.
(b) Any bonds shall mature at such time or times as the
board may determine, but in no event exceeding fifty (50) years
from the dates of the interim debentures so funded and the bonds
so pledged as collateral security, or if the dates are not the
same, from whichever date is the earlier.
(c) Bonds for funding and bonds for any other purpose or
purposes may be issued separately or issued in combination in
one (1) or more series.
(d) Except as herein otherwise provided in W.S. 21-17-433
through 21-17-436, any funding bonds shall be issued as is
provided by this act for other bonds.