VTT Technical Research Centre of Finland Ltd. v. SiTime Corporation

District Court, N.D. California·Decided July 21, 2020·No. 4:19-cv-01174·Unknown

Opinion

VTT TECHNICAL RESEARCH CENTRE OF CASE NO. 4:19-cv-1174-YGR FINLAND LTD., Plaintiff, CORRECTED1 CLAIM CONSTRUCTION vs. Re: Dkt. Nos. 44, 45, 63 SITIME CORPORATION, Defendant.

Plaintiff VTT Technical Research Centre of Finland Ltd. (“VTT”) brings this patent infringement action against defendant SiTime Corporation (“SiTime”), alleging that SiTime infringes U.S. Patent No. 8,558,643 (the “’643 Patent”), titled “Micromechanical Device Including N-Type Doping for Providing Temperature Compensation and Method of Designing Thereof.” Now before the Court are the parties’ claim construction disputes. Having carefully considered the papers submitted, the parties’ arguments presented at the claim construction hearing on May 15, 2020, and the pleadings in this action, and for the reasons set forth below, the Court hereby adopts the constructions set forth herein. I. BACKGROUND The ’643 Patent is directed to temperature control of resonators (and other micromechanical devices). (’643 Patent at 1:8-9.) Resonators are structures that vibrate (or oscillate) at a precise frequency. (Dkt. No. 44-5 (“SiTime Prospectus”) at 2.) When combined with another circuit that sustains the resonator’s vibration, the components form an oscillator that can be used to provide clock signals in a system. (Id; Dkt. No. 45-5 (“Nguyen Decl.”) ¶ 17.) For example, a computer might have oscillators to provide clock signals that synchronize the CPUs, communication chips, and other components. (SiTime Prospectus at 2.) Traditionally, resonators have been made out of quartz crystal. (Id. at 3.) However, quartz crystal suffers from several limitations, including narrow frequency range, sensitivity to shock, and limited programmability. (Id.) For this reason, electronics manufacturers have been trying to replace quartz crystal with semiconductor-based “microelectromechanical systems” (MEMS). (Id. at 1; ’643 Patent at 1:17-19.) MEMS resonators have greater programmability and may be advantageously manufactured using scalable fabrication techniques. (’643 Patent at 1:15-19; SiTime Prospectus at 3.) One challenge preventing widespread adoption of MEMS resonators is “temperature drift.” (’643 Patent at 1:19-22, 1:29-31.) In order to keep time accurately, resonators need to oscillate at a stable frequency in the face of changing environmental conditions. (See SiTime Prospectus at 2.) Silicon-based resonators, however, have a resonance frequency that fluctuates due to ambient temperature. (’643 Patent at 1:19-26.) Temperature drift stems from changes in material stiffness as temperature increases. (Id. at 1:22-24.) When temperatures increase, silicon becomes less “stiff” and thus vibrates at a lower frequency. (Id.; Nguyen Decl. ¶ 19.) A known technique for reducing temperature drift involves “doping,” or adding an impurity (“dopant”) to silicon. (See ’643 Patent at 1:61-2:2.) The prior art attempted to use n-type (negative charge) and p-type (positive charge) dopants, as well as combined layers of p-doped and n-doped materials, to reduce temperature drift. (Id. at 1:61-2:43; Nguyen Decl. ¶ 20.) However, these techniques failed to achieve temperature compensation over sufficiently wide temperature ranges. (’643 Patent at 2:47-48.) Moreover, the inventors of the ’643 Patent found that even at optimal doping levels, constant doping concentration fails to achieve stable frequency. (Id. at 15:4-25, Figs. 16a-c.) To improve the prior art, the ’643 Patent proposes a “novel temperature compensated semiconductor structure whose temperature sensitivities can be managed . . . over a wide device that has a drive or sense means coupled to a resonator2 with “at least two regions having different materials properties.” (Id. at claims 1, 29.) The material properties of the regions and their relative volumes “define an effective material having the desired temperature compensation characteristics.” (Id. at 2:63-66.) Specifically, each region comprises one or more n-type doping agent, and the type of doping agent, its concentration, and the crystal orientation are “configured so that the temperature sensitivities of the generalized stiffness are of opposite sign at least at one temperature” for the regions. (Id. at 2:66-3:7, claim 1.) As a result of this configuration and the relative volume, the overall temperature drift of the generalized stiffness is 50 ppm or less over 100 ℃. (Id. at claims 1, 29.) The invention works as follows: when silicon is “doped” with another material, its temperature sensitivity—the extent and direction in which its frequency or stiffness changes due to temperature at a given point—changes. (See id. at 6:23-25, 15:4-9, Figs. 15a-c.) By adjusting dopant types, concentrations, and crystal orientation, the regions can have opposite temperature sensitivities, so that one region has increasing frequency as temperature increases while another region has decreasing frequency. (Id. at 3:16-60, Figs. 2a-2b.) Additionally, by changing the volume, the regions’ weight on the overall elasticity can be adjusted. (Id. at 12:44-67.) Thus, by configuring these factors, the resonator can be designed so that the effects of temperature “cancel out” among the regions and the overall temperature behavior of the composite material is the weighted average of the constituents.3 (Id. at 6:23-33, 15:26-30, Fig. 2c.) In this way, an effective material with low temperature drift can be achieved. (Id. at 15:20-25.) Independent claim 1 recites:

2 The claims recite a “semiconductor element capable of resonating or deflecting,” which presumably includes, but is broader than, a resonator. (See ’643 Patent at claims 1, 29.)

3 The specification describes implementing the invention in a “superlattice” structure where regions with different dopant concentrations are stacked. (’643 Patent at 4:1-15, 7:15- 11:50.) However, the specification makes clear that “other layer configurations can be used too, provided that they form a coupled spring system and the slopes of the temperature sensitivities suitably match at each point of the desired temperature range.” (Id. at 12:25-30.) Even without a lattice structure, “the general approach of cancelling positive/negative temperature coefficients (of 1 1. A micromechanical device comprising; a semiconductor element capable of deflecting or resonating and comprising at 2 least two regions having different material properties, 3 drive or sense means functionally coupled to said semiconductor element, 4 wherein 5 at least one of said regions comprises one or more n-type doping agents, 6 the relative volumes, doping concentrations, doping agents and/or crystal orientations of the regions being configured so that 7 the temperature sensitivities of the generalized stiffness are opposite 8 in sign at least at one temperature for the regions, and 9 the overall temperature drift of the generalized stiffness of the semiconductor element is 50 ppm or less on a temperature range of 10 100° C. Independent claim 29 recites: a 12 29. A method for designing a micromechanical device comprising 13 . . a semiconductor element capable of deflecting or resonating and comprising at 14 least two regions having different material properties,

45 drive or sense means functionally coupled to said semiconductor element,

“i A 16 the method comprising 7 choosing a basic semiconductor material for the semiconductor element,

18 choosing at least one n-dopant to be added to the semiconductor material, designing the inner structure of the semiconductor material, 19 wherein said designing of the inner structure comprises determining at least 20 two n-dopants, n-dopant concentrations and/or crystal orientations of n- doped material, and their relative volumes in the distinct regions of the 21 semiconductor element so that the overall temperature drift of the generalized stiffness of the semiconductor element is less than 50 ppm. 23 24 // 25 // 2 Hy 27 28

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VTT Technical Research Centre of Finland Ltd. v. SiTime Corporation, (N.D. Cal. 2020).

VTT Technical Research Centre of Finland Ltd. v. SiTime Corporation (VTT Technical Research Centre of Finland Ltd. v. SiTime Corporation) — published by Counsel Stack Legal Research, free access to 12M+ legal documents.

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