Ocean Semiconductors LLC v. Analog Devices, Inc.

CourtDistrict Court, D. Massachusetts
DecidedJuly 15, 2025
Docket1:20-cv-12310
StatusUnknown

This text of Ocean Semiconductors LLC v. Analog Devices, Inc. (Ocean Semiconductors LLC v. Analog Devices, Inc.) is published on Counsel Stack Legal Research, covering District Court, D. Massachusetts primary law. Counsel Stack provides free access to over 12 million legal documents including statutes, case law, regulations, and constitutions.

Bluebook
Ocean Semiconductors LLC v. Analog Devices, Inc., (D. Mass. 2025).

Opinion

UNITED STATES DISTRICT COURT DISTRICT OF MASSACHUSETTS ___________________________________ ) OCEAN SEMICONDUCTOR LLC, ) ) Plaintiff, ) ) v. ) Civil Action ) No. 20-cv-12310-PBS ANALOG DEVICES, INC., ) ) Defendant. ) ______________________________ )

MEMORANDUM AND ORDER July 15, 2025 Saris, J. INTRODUCTION Plaintiff Ocean Semiconductor LLC (“Ocean”) alleges that Defendant Analog Devices, Inc. (“ADI”) infringed claims 4 and 5 of U.S. Patent No. 6,836,691 (“the ’691 patent”), a “Method and Apparatus for Filtering Metrology Data Based on Collection Purpose,” through the use of Inficon Inc.’s (“Inficon’s”) FabGuard system in violation of 35 U.S.C. § 271(a) & (g). ADI moves for summary judgment on the grounds that (1) Ocean relies on new theories that are untimely and prejudicial, (2) Ocean lacks evidence that ADI actually used the accused FabGuard software, (3) Ocean posits infringement theories that fail to satisfy the ’691 1 patent’s claim limitations, and (4) the ’691 patent claims patent- ineligible subject matter pursuant to 35 U.S.C. § 101. After a hearing, the Court ALLOWS ADI’s motion for summary judgment (Dkt. 302) on the third ground that no reasonable juror could find that ADI infringed claims 4 and 5 of the ’691 patent.

BACKGROUND Drawing all reasonable inferences in favor of Ocean, the Court treats the following facts as undisputed. See Quintana-Dieppa v. Dep’t of Army, 130 F.4th 1, 7 (1st Cir. 2025). The Court begins by outlining the parties and, drawing from the parties’ expert reports, describes the semiconductor manufacturing process. It then turns to the FabGuard software, its use by ADI, and the asserted patent and its claims. I. The Parties Ocean, a non-practicing entity, is the assignee and owner of

the ’691 patent. ADI is a semiconductor company that develops and sells semiconductor products. ADI operates semiconductor fabrication plants throughout the United States and abroad to produce its semiconductor products. Either directly or through third-party foundries, ADI also contracts with third-party semiconductor manufacturers to produce its products. ADI acquired Maxim

2 Integrated Products Ince. (“Maxim”) in 2021 and assumed control over its semiconductor fabrication plants. II. Chip Manufacturing ADI manufactures semiconductor chips. Semiconductor chips are found in a range of technology, including cars, laptops, and smartphones. In simple terms, to create semiconductor chips, a fabrication plant must transform raw silicon extracted from highly purified silica sand into circular, polished wafers. Once the

eee ON Pa ear a. Ras un = Ret ae Bee Ba foc □□□ ee Sens: ra i ye (a J af ory i page 0) □ “sf r □□ i ae “ae > r 1s SF ey y Figure 1 depicting silicon on the left and wafers on the right. Dkt. 336-1 4 46. wafers are formed, circuits are built onto the wafers. To build circuits, thin layers of conductive and insulating materials, such as copper or silicon dioxide, are first deposited onto the surface of the wafers with a final coating that is sensitive to light. Ultraviolet light is then used to engrave a pattern onto the wafer. Finally, layers of the circuit are etched away, and the wafer is

broken down into smaller, rectangular pieces to form the semiconductor chips.

1 Coro 2) pt aS mm (aS oo Pe cee ete

~ -~

Figure 2 depicting the deposition, light projection, and cutting steps of chip production. Dkt. 330 4 46.

Semiconductor chip manufacturing takes place inside a fabrication facility which consists of sterile rooms and closed environments called chambers. While in a chamber, a wafer is isolated from the rest of the fabrication plant while it undergoes a specific process step that requires a particular pressure or other environmental condition. The actual process of deposition, light projection, and etching involves hundreds of small steps, each of which “requires a microscopic degree of precision.” Dkt. 330 @ 47. Accordingly, fabrication plants employ process monitoring technigues to assist in optimizing the process, verifying that each step is performed accurately, and troubleshooting when they are not. Two

complementary forms of process monitoring are relevant here: process control and Fault Detection and Classification (“FDC”). Process control refers to “[t]he process of reviewing measurements and considering whether and how to update the process” to improve product quality and consistency. Id. ¶ 49. FDC is an automated system that evaluates large volumes of process and wafer data

against predefined thresholds to determine whether a fault has occurred and, if so, what may have caused it. A fault refers to “an abnormal tool condition, such as when a parameter strays beyond its acceptable boundary.” Id. ¶ 50. By detecting these faults, a fabrication plant can stop continuing to process a wafer that is already defective, and the tools that caused the fault may be identified more efficiently. III. FabGuard FabGuard is a software FDC tool designed by Inficon to assist semiconductor fabrication plants by “analyzing data and identifying manufacturing faults” to prevent and remedy faulty

chip production. Dkt. 336-1 ¶ 162. To do so, FabGuard implements a system of data triggers that interface with sensors. Sensors are tools that measure various conditions -- for example, temperature or pressure -- inside a manufacturing chamber at various points in the process. The measurements taken during the manufacturing process are called metrology data. 5 FabGuard’s data triggers determine when the software starts and stops collecting metrology data. Certain parameters can be configured to direct FabGuard under what conditions it should begin data collection and under what conditions to end data collection. Some start and stop triggers include when the chamber pressure is above or below a certain point; when the endpoint signal,

indicating the completion of a process step, is received; or when a fault signal, indicating that an error has occurred during the process step, is received. There are other conditions in which FabGuard will collect data, such as when FabGuard has not received any trigger for 15 minutes. In that case, FabGuard begins “idle acquisition.” Dkt. 324-2 at 8. This mode collects data while a tool is idle, which means it is not processing wafers. All modes are pre-configured, and the user can select which sensors to collect data from. IV. ADI’s Use of FabGuard ADI used FabGuard’s acquisition and idle triggers. ADI used

FabGuard’s acquisition triggers to collect data for two purposes: first, to determine when a given process step, such as the etch step, was complete; and second, to identify whether a fault had occurred during the process step. If the process step was completed without faults, then the data collection ended because the purpose for the data collection -- the determination of the endpoint -- 6 had been achieved. Alternatively, if a fault was detected, the tool was placed in idle mode. When a tool or chamber in a fabrication plant was in idle mode, an idle trigger was used to collect a new dataset with baseline measurements. The purpose of this data was to monitor chamber stability (e.g., temperature, or pressure conditions) to ensure that the next wafer processed in

the chamber would experience the correct environmental conditions. Each dataset collected by FabGuard is associated with the trigger that initiated it, for example, to identify the endpoint of the process step or to take baseline measurements. See Dkt. 336-1 ¶¶ 299, 316. FabGuard did not retroactively change the trigger associated with a dataset that was previously collected. See Dkt. 309-8 at 406:11-13. V.

Free access — add to your briefcase to read the full text and ask questions with AI

Related

Merck & Co. v. Teva Pharmaceuticals USA, Inc.
395 F.3d 1364 (Federal Circuit, 2005)
Robert Brennan v. Roderick Hendrigan
888 F.2d 189 (First Circuit, 1989)
Samuel Mesnick v. General Electric Company
950 F.2d 816 (First Circuit, 1991)
Vitronics Corporation v. Conceptronic, Inc.
90 F.3d 1576 (Federal Circuit, 1996)
Jack Guttman, Inc. v. Kopykake Enterprises, Inc.
302 F.3d 1352 (Federal Circuit, 2002)
Advanced Steel Recovery, LLC v. X-Body Equipment, Inc.
808 F.3d 1313 (Federal Circuit, 2015)
Harley-Davidson Credit Corp. v. Galvin
807 F.3d 407 (First Circuit, 2015)
Wi-Lan, Inc. v. Apple Inc.
811 F.3d 455 (Federal Circuit, 2016)
Akzo Nobel Coatings, Inc. v. Dow Chemical Company
811 F.3d 1334 (Federal Circuit, 2016)
Medgraph, Inc. v. Medtronic, Inc.
843 F.3d 942 (Federal Circuit, 2016)
Homeland Housewares, LLC v. Whirlpool Corporation
865 F.3d 1372 (Federal Circuit, 2017)
Cherkaoui v. City of Quincy
877 F.3d 14 (First Circuit, 2017)
Ellis v. Fidelity Management Trust
883 F.3d 1 (First Circuit, 2018)

Cite This Page — Counsel Stack

Bluebook (online)
Ocean Semiconductors LLC v. Analog Devices, Inc., Counsel Stack Legal Research, https://law.counselstack.com/opinion/ocean-semiconductors-llc-v-analog-devices-inc-mad-2025.