Mems Technology Berhard v. International Trade Commission

447 F. App'x 142
CourtCourt of Appeals for the Federal Circuit
DecidedJune 3, 2011
Docket2010-1018
StatusUnpublished
Cited by12 cases

This text of 447 F. App'x 142 (Mems Technology Berhard v. International Trade Commission) is published on Counsel Stack Legal Research, covering Court of Appeals for the Federal Circuit primary law. Counsel Stack provides free access to over 12 million legal documents including statutes, case law, regulations, and constitutions.

Bluebook
Mems Technology Berhard v. International Trade Commission, 447 F. App'x 142 (Fed. Cir. 2011).

Opinion

Lourie, Circuit Judge.

MEMS Technology Berhad (“MemsTech”) appeals from a final determination by the United States International Trade Commission that the importation and sale of certain silicon microphone packages violated § 387 of the Tariff Act of 1930 as amended, 19 U.S.C. § 1337. The Commission determined that MemsTech’s accused products infringe the asserted claims of U.S. Patents 7,242,089 and 6,781,231 (the “'089” and “'231” patents) and that the asserted claims are not invalid under 35 U.S.C. § 102 or § 103 for anticipation or obviousness. We affirm.

Background

Knowles Electronics LLC (“Knowles”) owns the '089 and '231 patents, which pertain to microelectromechanical system (“MEMS”) packages comprising a substrate, a cover, and a microphone (also termed a transducer). '089 patent col.l 11.49-50; '231 patent col.l 11.40-41. MEMS microphone packages are used in a variety of consumer electronic devices, including mobile phones.

The '089 patent discloses MEMS packages that allow acoustic energy to contact a transducer while protecting the transducer from light, electromagnetic radiation, and physical damage. '089 patent col.l 11.44-49. The MEMS packages of the '089 patent include a volume defined by the transducer and either the cover or the substrate. Asserted on appeal are claims 1, 2, 9,15,17, 20, 28, and 29. 1 Claim 1, the independent claim from which the other asserted claims depend, recites:

1. A surface mountable package for containing a transducer, the transducer being responsive to sound pressure levels of an acoustic signal to provide an electrical output representative of the acoustic signals, the surface mountable package comprising:
at least a first member and a second member and a chamber being defined by the first member and the second member, the transducer being attached to a surface formed on one of the first member or the second member and the transducer residing within the chamber; the surface being formed with at least one patterned conductive layer, the patterned conductive layer being electrically coupled to the transducer; an outside surface of the surface mountable package comprising a plurality of terminal pads electrically coupled to the patterned conductive layer; a volume being defined by the transducer and one of the first member or the second member, the volume being acoustically coupled to the transducer; and
one of the first member or the second member being formed to include an aperture, the aperture configured to permit the passage of an acoustic signal to the transducer.

'089 patent col.ll 11.20-44 (emphases added). A cross-sectional view of a preferred embodiment is shown in Figure 1, infra, which comprises a cover 20, a substrate 14, a transducer 12, and a back volume or air cavity 18. Id. col.3 11.36-43. The MEMS package depicted in Figure 1 also comprises an aperture 24 in the cover 20, which allows external sound waves to reach the transducer in the package. Id. col.3 1.66— col.4 1.4.

*146 [[Image here]]

The '231 patent discloses MEMS packages that shield the microphone from an interference signal or an environmental condition. '231 patent col.l 11.38-39. Claims 1 and 2 are asserted. Claim 1 recites:

1. A microelectromechanical system package comprising:
a microelectromechanical system microphone;
a substrate comprising a surface for supporting the microelectromechanical microphone;
a cover comprising a conductive layer having a center portion bounded by a peripheral edge portion; and
a housing formed by connecting the peripheral edge portion of the cover to the substrate, the center portion of the cover spaced from the surface of the substrate to accommodate the microelectro-mechanical system microphone, the housing including an acoustic port for allowing an acoustic signal to reach the microelectromechanical system microphone wherein the housing provides protection from an interference signal.

Id. col.5 11.12-25 (emphasis added). Claim 2 recites:

2. A microelectromechanical system package for providing a shield from an interference signal, the microelectrome-chanical package comprising:
a silicon-based microphone;
a substrate including a surface at least partially covered by a first layer of a conductive material, the silicon-based microphone is electrically coupled to the layer of a conductive material;
a cover comprising a second layer of a conductive material, the cover electrically connected to the first layer of a conductive material and providing a chamber in which the silicon-based microphone is located, the chamber providing an acoustic front volume for the silicon-based microphone.

Id. col.5 11.26-38 (emphases added). Figure 1, infra, depicts a cross-sectional view of a preferred embodiment, which comprises a cover 20, a substrate 14, and surface-mountable components 12 (one of which is a transducer). Id. col.3 11.17-24.

*147 [[Image here]]

MemsTech imports MEMS Microphonepackages into the United States. On December 6, 2007, Knowles filed a complaint at the Commission alleging a -violation of § 337 in the importation and sale of certain MEMS microphone packages (the “accused products”) by reason of infringement of the asserted claims of the '089 and '231 patents. Knowles named MemsTech as the only respondent.

On January 3, 2008, the Commission instituted a § 337 investigation based on Knowles’ complaint. 73 Fed. Reg. 2,277, 2,278 (Jan. 14, 2008). In response to Knowles’ allegations, MemsTech asserted noninfringement and invalidity of the asserted claims. On January 12, 2009, the Administrative Law Judge (“ALJ”) issued his “Initial Determination on Violation of Section 337 and Recommended Determination on Remedy and Bond.” In re Certain Silicone [sic] Microphone Packages & Prods. Containing Same, Inv. No. 337-TA-629, 2009 WL 389263 (U.S.I.T.C. Jan. 12, 2009) (hereinafter, “Initial Determination”).

With respect to the '089 patent, the ALJ construed the term “electrically coupled” in claim 1 to mean "arranged so that electrical signals may be passed either directly, or indirectly via intervening circuitry, from one component to another.” J.A. 70. The ALJ construed “volume” in claims 1, 15, and 28 to mean “a space defined by the transducer and one of the first member or the second member.” J.A. 86. The ALJ determined that MemsTech’s accused products infringe claims 1, 2, 9, 15, 17, 20, 28, and 29 of the '089 patent. 2

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Bluebook (online)
447 F. App'x 142, Counsel Stack Legal Research, https://law.counselstack.com/opinion/mems-technology-berhard-v-international-trade-commission-cafc-2011.