Leighton Technologies LLC v. Oberthur Card Systems, S.A.

423 F. Supp. 2d 425, 2006 U.S. Dist. LEXIS 22140, 2006 WL 983910
CourtDistrict Court, S.D. New York
DecidedApril 13, 2006
Docket04 Civ. 2496
StatusPublished

This text of 423 F. Supp. 2d 425 (Leighton Technologies LLC v. Oberthur Card Systems, S.A.) is published on Counsel Stack Legal Research, covering District Court, S.D. New York primary law. Counsel Stack provides free access to over 12 million legal documents including statutes, case law, regulations, and constitutions.

Bluebook
Leighton Technologies LLC v. Oberthur Card Systems, S.A., 423 F. Supp. 2d 425, 2006 U.S. Dist. LEXIS 22140, 2006 WL 983910 (S.D.N.Y. 2006).

Opinion

DECISION AND ORDER DENYING DEFENDANT’S MOTION FOR SUMMARY JUDGMENT

McMAHON, District Judge.

Facts

Plaintiff Leighton Technologies LLC is assignee of four related patents in the field of manufacturing integrated circuit cards, also known as “IC cards” or, more commonly, “smart cards.” The patents describe a method of manufacturing contact-less smart cards by lamination.

Conventional lamination techniques call for stacking unattached layers of polyvinyl chloride (PVC), polyester, or other plastic, possibly between layers of adhesive, to form a “book.” The book is placed between two metal plates which can be precisely heated, cooled, and weighted to apply heat and pressure to the book. Laminating devices range in size from single-card devices to high-capacity devices with several sets of plates stacked vertically.

Smart cards are credit-card-sized sheets of laminated plastic which contain embedded electronics — microchips, memory devices, antennae, etc. Some models of smart cards only operate when placed in physical contact with another computer (called a reader), which communicates with the card through metal pick-ups on the card’s surface. Newer models, called “contactless” smart cards, have built-in radio frequency antennae in place of metal *427 contacts; to send and receive data, the card just has to be “swiped” past a radio transmitter. “Hybrid” or “dual-function” smart cards possess both a contact interface and a wireless antenna connected to the same microchip or storage device.

Although there are industry standards for the design and function of smart cards, there is no standard method of manufacturing them. Old methods involve “milling” (drilling a cavity into a card after lamination) and inserting electronics into the cavity. Another method involves encasing sensitive electronics in protective layers of plastic and laminating the components between sheets of PVC or other plastic. The insulating layer protects the components from the heat and pressure of lamination, but tends to produce thicker, less aesthetically pleasing cards.

A. Plaintiff’s History

Keith Leighton, founder of Leighton Technologies, first noted the problems inherent in laminating smart cards while under contract to Motorola to produce con-tactless smart cards. Leighton Deck, ¶ 4. His initial attempts involved enclosing electronic elements directly within the books, and laminating the books with a printed circuit board (PCB) laminator. PCB laminators operate at higher heat and pressure than plastic card laminators, and used separate stacks for heating and cooling. Id. ¶¶ 5-6. Leighton had very little success in his initial attempt — many of the cards broke during lamination, and the remainder lacked a smooth surface and finish. Id. ¶ 7.

Leighton continued to research laminating techniques for contactless smart cards after the contract with Motorola expired, and ultimately seized upon a process that produced aesthetically pleasing devices at high yields and low cost. This process called for laminating a card containing electronic components in a specific sequence of temperatures and pressures which minimized damage to both the plastic sheets and the internal electronics. He patented his method in the four patents at suit in this case (“the Leighton patents”).

B. Plaintiff’s Patents

Leighton’s method, as described in his first patent, No. 5,817,207 (issued October 6, 1998), calls for the placement of electronic elements (such as microchips, wireless antennae, or other devices), “in the absence of a non-electronic carrier,” within the core of a book of plastic sheets, followed by the application of a specific cycle of heat and pressure. See '207 Patent, col. 6: lines 18-36. The heat and pressure cycle consists of (i) heating the core, then (ii) applying a first pressure to the core, and finally (in) cooling the core while applying a second pressure. Id. at 6:30-36. The card could then be inked and overla-minated. Id. at 6:37-40. Subsequent dependent claims recite additional limitations related to specific pressure and temperature settings (claims 6 through 9), and the composition and thickness of the plastic sheets.

Plaintiffs first draft of the claims, which did not recite the limitation that the electronics be placed in the book in “the absence of a nonelectronic carrier,” was rejected by the examiner during prosecution in light of U.S. Patent no. 4,450,024, which describes a similar process for lamination. (Def.Ex.14). The claims were then amended to their present form.

Plaintiffs second patent, Number 6,036,-099 (issued March 4, 2000), describes a similar process for the manufacture of hybrid smart cards. The first independent claim describes a process similar to that of the '207 patent, but provides a final step in which the metal contact plate is exposed by milling. '099 Patent, col. 9:3-5. De *428 pendent claims in the '099 Patent also recite a second pressure between 10% and 40% of the first pressure (Id. at 9:35-36), although the description of the invention indicates that 25% is preferred. 1 Id. at 6:39. The process also describes the lamination of an upper sheet with a pre-milled cavity, with the cavity being filled by a removable spacer during lamination, rather than a final milling step. (Id. at 10: 32-56).

Plaintiffs third patent, number 6,214,155 (issued April 10, 2001), is a continuation of the '207 Patent. It recites method similar to that of the '207 Patent, but does not recite a final printing step. '155 Patent, 6:18-38.

Plaintiffs fourth patent, number 6,514,-367 (issued February 4, 2003) is a continuation of the '099 Patent. In its first draft, it recited a method similar to that of the '099 Patent (for the manufacture of hybrid cards), but, like the '155 Patent, did not recite a final printing step.

However, during prosecution of the '367 Patent, the examiner discovered additional references which he determined to constitute prior art: Japanese Patent No. H6-176214 and UK Patent No. 2,279,610. Sharinn Deck, Ex. 7 at OCS — C—045452. The JP '214 patent, granted June 24, 1994, recites a “Thin-Type Contactless IC Card,” in which electronic elements such as a microchip and a radio frequency antenna are arrayed between two sheets of plastic, and the entire unit is held together by “thermocompression bonding” — another term for lamination. Sharinn Deck, Ex. 24. The UK '610 Patent, dated November 1, 1995, recites a method of laminating smart cards (including contactless smart cards or other cards containing “inductive loop[s]” of material). Sharinn Deck, Ex. 18. The patent office found that JP '214 taught the encapsulation of electronic elements directly between sheets of laminate, while the UK '610 Patent taught a similar multi-step heat and pressure cycle during lamination. Sharinn Deck, Ex. 7 at OCS— C — 045452-53.

Plaintiff responded to the above by further limiting the scope of the independent claims of the '367 Patent.

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423 F. Supp. 2d 425, 2006 U.S. Dist. LEXIS 22140, 2006 WL 983910, Counsel Stack Legal Research, https://law.counselstack.com/opinion/leighton-technologies-llc-v-oberthur-card-systems-sa-nysd-2006.