Cabot Corp. v. Solution Technology, Inc.

122 F. Supp. 2d 599, 2000 U.S. Dist. LEXIS 19126, 2000 WL 1809012
CourtDistrict Court, W.D. North Carolina
DecidedOctober 10, 2000
Docket3:96CV505-MCK
StatusPublished

This text of 122 F. Supp. 2d 599 (Cabot Corp. v. Solution Technology, Inc.) is published on Counsel Stack Legal Research, covering District Court, W.D. North Carolina primary law. Counsel Stack provides free access to over 12 million legal documents including statutes, case law, regulations, and constitutions.

Bluebook
Cabot Corp. v. Solution Technology, Inc., 122 F. Supp. 2d 599, 2000 U.S. Dist. LEXIS 19126, 2000 WL 1809012 (W.D.N.C. 2000).

Opinion

ORDER

McKNIGHT, United States Magistrate Judge.

This patent case is before the undersigned United States magistrate judge by consent of the parties pursuant to 28 U.S.C. § 636(c). At issue is whether this case is exceptional based upon willful infringement and litigation misconduct, as “exceptional” is understood for purposes of applying 35 U.S.C. § 285, and whether costs and attorneys’ fees should be awarded to Cabot. 1 These matters were exhaustively discovered and tried to the bench. After searching review of the evidence in light of appropriate standards of proof and relevant case authority, it is the conclusion of the undersigned that the exceptional case standard has not been met and, therefore, that attorneys’ fees should not be awarded.

*602 FINDINGS OF FACT

In all actions tried upon the facts without a jury ..., the court shall find the facts specially and state separately its conclusions of law thereon, ....

Rule 52(a), Fed.R.Civ.Pro.

Accordingly, I essay to set in order a narrative of these things clearly and convincingly shown and relevant, and not found in the various discovery orders of this Court. 2

Preliminary

Chemical mechanical planarization or polishing (“CMP”)

CMP is a technique for flattening surfaces by means of abrasion. It has application in building semiconductor wafers. In this process, an eight-inch piece of single-crystal silicon is used as a plate onto which the manufacturer deposits layers of circuitry. The metal layer is insulated by depositing an oxide layer, essentially glass (TEOS). Oxide CMP planarizes the glass to an appropriate level.

In CMP, the chemical part is the oxidizer. The mechanical part is the abrasive. To achieve CMP, it is necessary to have an abrasive and a chemical component which interact with the surface. Abrasives include alumina and silica. The abrasive in the dispersion (for example, alumina or cerium oxide) achieves the polishing.

Roughly, one adds to the abrasive dispersion different oxidizers (such as ferric nitrate, potassium iodate, hydrogen peroxide, ferric sulfate,.or potassium ferric cyanide), which are the chemical component. The oxidizers change the surface of the metal being polished on the surface layer in such a way that the abrasive can then more easily remove it.

Aluminas

There are precipitated and fumed alumi-nas, the terms describing the chemical process of their generation. For the processes at issue, fumed alumina has a more advantageous viscosity than precipitated alumina because the liquid is thinner yet maintains good stability.

Boehmite is an alkoxide-based alumina containing gamma alumina.

Paul J. Yancey’s education and work; the founding of Solution Technology, Incorporated (“STI”); STI’s approach to testing its slurries

Paul J. Yancey (“Yancey”) was educated as a chemical engineer. By 1994, Yancey had been working as a chemical engineer for nearly thirty years, and, at least since 1985, in the field of dispersions (suspensions of particles in liquid media).

Yancey joined Union Carbide Corporation in 1966. He worked in Union Carbide’s Linde division in the manufacture of aluminum oxide materials for ceramics for polishing and growing single crystals of aluminum oxide and other materials used in lasers. He grew crystals and learned techniques for polishing them. He developed a slurry for polishing materials consisting of a permanent dispersion of particles, and this product figured importantly in the Linde product line.

Yancey left Union Carbide for Sawyer Research Products. There he worked in the manufacture of synthetic quartz for use in the high frequency circuit business. He did some polishing and grew sapphire crystals.

Thereafter, he worked for Allied Chemical and came to Charlotte, N.C., with that company in 1979. His work for Allied Chemical involved growing single crystals and polishing materials for lasers and bubble memory technology. These materials were polished with abrasives.

Thereafter, he started the United States subsidiary of Baikowski International, which is a supplier of high purity alumina. In the course of this work, he developed material made from aluminas which were very good polishing powders.

*603 In 1985, Yancey left BaikowsM to start Solution Technology, Incorporated (“STI”). He was interested in selling alumina compounds in liquid form in permanent suspension. Baikowski was not interested in pursuing such materials, so Yancey, having 19 years of experience with polishing substrates and three or four years of experience with permanent slurries, started STI and began manufacturing liquid compounds which were permanently stable, meaning, in Yancey’s understanding, that they had a shelf life of at least one year.

STI’s first products were based on alu-minas that were in permanent dispersions and were primarily directed to the optics industry. STI sold dry powders of high purity aluminas and several other optical materials. One of STI’s first customers was the Airtron division of Litton Industries, which polished gallium arsenite substrates for use in some high end integrated circuits for industries such as communications. STI branched out from aluminas into compounds based upon cerium oxide, zirconium oxide, diamond, and silica.

When STI was founded, Yancey worked alone and mixed the slurries. At that time, STI did not have testing equipment. Even as late as 1996, Yancey would ask potential customers to test most of the slurries.

However, STI did have certain testing equipment. In 1992, after IBM became a customer, STI purchased a MicroTrac particle size analyzer from Leeds and Northrup, a BET surface area analyzer, and a zeta potentiometer, primarily for quality control. The particle size analyzer gave a printout of particle size distribution, a histogram of sizes within each particle size range or a cumulative distribution that essentially added up each of those size ranges until they reached 100 and plotted the curve. The particle size analyzer worked by introducing ultrasonically a pH-adjusted predispersed sample into the circulation system of the analyzer. An inappropriate pH causes agglomeration of the particles upon introduction into the sample well of the analyzer. The agglomeration will show up on the printout as a bump on the right side of the curve in the 10 to 15 micron range, indicating large particles, which is anomalous. A solution with 10-15-micron particles could scratch the surface of what is being polished. Yancey has operated MicroTrac and Horiba particle size analyzers.

The BET surface analyzer measures the surface area of the outside surface of particles. The zeta potentiometer measures the charge on a particle in a solution. The repulsion resulting from higher charges promotes stability when the particles are sufficiently small relative thereto.

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Bluebook (online)
122 F. Supp. 2d 599, 2000 U.S. Dist. LEXIS 19126, 2000 WL 1809012, Counsel Stack Legal Research, https://law.counselstack.com/opinion/cabot-corp-v-solution-technology-inc-ncwd-2000.