Basf Corporation v. Enthone, Inc.

Court of Appeals for the Federal Circuit·Decided October 26, 2018·No. 18-1095·Unpublished

Opinion

NOTE: This disposition is nonprecedential.

United States Court of Appeals for the Federal Circuit ______________________

BASF CORPORATION, Appellant

v.

ENTHONE, INC., Appellee ______________________

2018-1095 ______________________

Appeal from the United States Patent and Trademark Office, Patent Trial and Appeal Board in No. IPR2016- 00696. ______________________

Decided: October 26, 2018 ______________________

RUSSELL BLYTHE, King & Spalding LLP, Atlanta, GA, argued for appellant. Also represented by HOLMES J. HAWKINS, III.

ROBERT M. EVANS, JR., Stinson Leonard Street LLP, St. Louis, MO, argued for appellee. Also represented by JOHN R. SCHROEDER, KYLE G. GOTTUSO. ______________________

Before DYK, WALLACH, and TARANTO, Circuit Judges. 2 BASF CORP. v. ENTHONE, INC.

WALLACH, Circuit Judge. Appellant BASF Corporation (“BASF”) petitioned for inter partes review of Enthone, Inc.’s (“Enthone”) U.S. Patent No. 7,303,992 (“the ’992 patent”). The U.S. Patent and Trademark Office’s (“USPTO”) Patent Trial and Appeal Board (“PTAB”) issued a final written decision “determin[ing] that BASF has not shown by a preponder- ance of the evidence that claims 1–15, 17–22, and 26–28 [(‘the Challenged Claims’)] of the ’992 [p]atent are un- patentable” as obvious over two asserted combinations of prior art. BASF Corp. v. Enthone, Inc. (BASF I), IPR2016-00696, 2017 WL 4014997, at *10 (P.T.A.B. Sept. 11, 2017). BASF appeals. We have jurisdiction pursuant to 28 U.S.C. § 1295(a)(4)(A) (2012). We vacate and remand. BACKGROUND Entitled “Copper Electrodeposition in Microelectron- ics,” the ’992 patent generally relates to the field of “mi- croelectronics manufacture to provide electrical interconnection in a wide variety of applications, such as . . . in the manufacture of semiconductor integrated circuit . . . devices.” ’992 patent col. 1 ll. 13–16. Specifi- cally, it teaches a “method . . . for electrolytically plating [copper] onto a semiconductor integrated circuit substrate having submicron-sized interconnect features.” Id., Abstract. “An interconnect feature is a feature such as a via or trench formed in a dielectric substrate which is then filled with metal to yield an electrically conductive interconnect.” Id. col. 1 ll. 23–25. The ’992 patent’s “method involves superfilling by rapid bottom-up deposi- tion at a superfill speed by which [copper] deposition [occurs] in a vertical direction from the bottoms of the features to the top openings of the features [and] is sub- stantially greater than [copper] deposition on the side walls.” Id., Abstract (emphasis added). Superfilling differs from conventional copper deposition methods, such BASF CORP. v. ENTHONE, INC. 3

as conformal plating that involves filling “at an equal rate on all . . . surfaces,” and therefore “avoid[s] seams and pinching off that can result in voiding.” Id. col. 2 ll. 9–11. Independent claims 1 and 17 are illustrative. Claim 1 recites: A method for electroplating a copper deposit onto a semiconductor integrated circuit device sub- strate with electrical interconnect features includ- ing submicron-sized features having bottoms, sidewalls, and top openings, the method compris- ing: immersing the semiconductor integrated circuit device substrate including submi- cron-sized features having bottoms, side- walls, and top openings wherein said submicron-sized features include high as- pect ratio[1] features having dimensions such that the high aspect ratio features have aspect ratios of at least about 3:1 in- to an electrolytic plating composition com- prising a source of [copper] ions in an amount sufficient to electrolytically depos- it [copper] onto the substrate and into the electrical interconnect features and a pol- yether suppressor compound comprising a combination of propylene oxide (PO) re- peat units and ethylene oxide (EO) repeat units present in a PO:EO ratio between about 1:9 and about 9:1 and bonded to a nitrogen-containing species, wherein the molecular weight of the suppressor com-

1 An aspect ratio is a ratio comparing depth to width. ’992 patent col. 2 l. 39. 4 BASF CORP. v. ENTHONE, INC.

pound is between about 1000 and about 30,000; and supplying electrical current to the electro- lytic composition to deposit [copper] on the substrate and superfill the submicron- sized features of rapid bottom-up deposi- tion at rate of growth in the vertical di- rection which is greater than a rate of growth in the horizontal direction. Id. col. 18 ll. 19–46. Similarly, claim 17 teaches a super- filling method that involves, inter alia: supplying electrical current to the electrolytic composition to deposit [copper] onto the substrate and superfill the submicron-sized features by rap- id bottom-up deposition at a vertical [copper] dep- osition growth rate in features from the bottoms of the features to the top openings of the features which is greater than 15 times faster than a field deposition growth rate on substrate surfaces out- side the features. Id. col. 20 ll. 51–58. DISCUSSION I. Standard of Review and Legal Standard “We review the PTAB’s factual findings for substan- tial evidence and its legal conclusions de novo.” Redline Detection, LLC v. Star Envirotech, Inc., 811 F.3d 435, 449 (Fed. Cir. 2015) (citation omitted). “Substantial evidence is something less than the weight of the evidence but more than a mere scintilla of evidence,” meaning that “[i]t is such relevant evidence as a reasonable mind might accept as adequate to support a conclusion.” In re NuVa- sive, Inc., 842 F.3d 1376, 1379–80 (Fed. Cir. 2016) (inter- nal quotation marks and citations omitted). “If two inconsistent conclusions may reasonably be drawn from BASF CORP. v. ENTHONE, INC. 5

the evidence in record, the PTAB’s decision to favor one conclusion over the other is the epitome of a decision that must be sustained upon review for substantial evidence.” Elbit Sys. of Am., LLC v. Thales Visionix, Inc., 881 F.3d 1354, 1356 (Fed. Cir. 2018) (internal quotation marks, brackets, and citation omitted). We also review the PTAB’s decision to ensure that the decision did not consti- tute arbitrary and capricious agency action. See Vicor Corp. v. SynQor, Inc., 869 F.3d 1309, 1323 (Fed. Cir. 2017). A patent claim is invalid “if the differences between the subject matter sought to be patented and the prior art are such that the subject matter as a whole would have been obvious at the time the invention was made to a person having ordinary skill in the [relevant] art [(‘PHOSITA’)].” 35 U.S.C. § 103(a) (2006). 2 Obviousness “is a question of law based on underlying findings of fact.” In re Gartside, 203 F.3d 1305, 1316 (Fed. Cir. 2000). Those underlying findings of fact include (1) “the scope and content of the prior art,” (2) “differences between the prior art and the claims at issue,” (3) “the level of ordi- nary skill in the pertinent art,” and (4) the presence of objective indicia of nonobviousness such “as commercial success, long felt but unsolved needs, failure of others,” and unexpected results. Graham v. John Deere Co. of Kan. City, 383 U.S. 1, 17–18 (1966); see United States v.

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