Waytec Electronics Corp. v. Rohm & Haas Electronic Materials, LLC

459 F. Supp. 2d 480, 2006 WL 3051769
CourtDistrict Court, W.D. Virginia
DecidedOctober 27, 2006
DocketCivil Action 6:05CV00024
StatusPublished
Cited by7 cases

This text of 459 F. Supp. 2d 480 (Waytec Electronics Corp. v. Rohm & Haas Electronic Materials, LLC) is published on Counsel Stack Legal Research, covering District Court, W.D. Virginia primary law. Counsel Stack provides free access to over 12 million legal documents including statutes, case law, regulations, and constitutions.

Bluebook
Waytec Electronics Corp. v. Rohm & Haas Electronic Materials, LLC, 459 F. Supp. 2d 480, 2006 WL 3051769 (W.D. Va. 2006).

Opinion

CORRECTED MEMORANDUM OPINION

WILSON, District Judge.

This is a suit by a manufacturer of printed circuit boards, Waytec Electronics Corporation (“Waytec”), against the manufacturer, Rohm and Haas Electronic Materials, LLC (“Rohm and Haas”), and Northern Laminate Sales, Inc. (“NLS”), the distributor, of a chemical solution designed for copper plating of printed circuit boards, Copper Gleam PPR (“Copper Gleam”), that Waytec used in its manufacturing process. 1 After having successfully used Copper Gleam in its manufacturing process for three years or more, Waytec began to experience intermittent cracking of the copper plating on some of its circuit boards. Deciding that Copper Gleam was the problem, Waytec sued Rohm and Haas and NLS alleging fraud in the inducement, breach of express and implied warranties, negligence, and conspiracies to defraud and willfully injure Waytec. Rohm and Haas and NLS moved for summary judgment on multiple grounds: that Waytec had no evidence of fraud, that Waytec had no evidence that Copper Gleam caused the copper plating to crack, and that they had disclaimed all warranties except the warranty that the product was within customary trade tolerances, of uniform quality and conformed to the seller’s specifications, and that even in that instance they had disclaimed consequential and incidental damages. After reviewing the parties’ summary judgment submissions, the court discerned scant, if any, evidence of fraud and only tenuous evidence of causation. Under the circumstances the court was concerned that Waytec had transformed a simple ease of nonconforming goods involving sophisticated industrial users into a tort action. The court held the motion for summary judgment under advisement and informed the parties that it would proceed to trial in stages, and at the first stage require Waytec to prove its fraud case with clear and convincing evidence and that the latter stages would be dependent upon resolution of the first. 2

After Waytec rested its fraud case at trial, the court found that there was no scientifically reliable evidence identifying Copper Gleam, rather than Waytec’s own *485 internal processes, as the source of the cracking and no evidence from which a reasonable jury could find by clear and convincing evidence that either Rohm and Haas or NLS fraudulently induced Waytec to purchase Copper Gleam. Accordingly, the Court announced that it found no material issue of fact to submit to the jury and that it would grant judgment as a matter of law to Rohm and Haas and NLS. This opinion memorializes and supplements the court’s reasoning.

I.

Waytec ensures the electrical conductivity of its printed circuit boards through a technically demanding electrolytic copper plating process in which a layer of copper is added to the board’s exposed surfaces and holes. 3 It immerses the boards in a chemical bath and uses an electric charge to create a chemical reaction that causes the copper to adhere. Initially, Waytec used a direct current process — a process in which the current flows in only one direction. Robert Welch, who is now Way-tec’s Process Engineering Manager, investigated changing Waytec’s manufacturing process to increase Waytec’s productivity and its ability “to run high aspect ratio boards.” In 1997, after investigating for more than a year and after speaking with other engineers, Welch transitioned Way-tec from its direct current process to a “pulse periodic reverse process” — a process in which the electric current flows in both directions. The new process called for an acid copper suitable for pulse periodic reverse applications. Waytec began purchasing Copper Gleam for that purpose. 4 Waytec had virtually no problems with the product for three years or more. In fact, the process and the product performed so well that Welch wrote an article extolling their virtues. Waytec was able to increase its production rate, essentially without incident. During this time, Way-tec ran its electrolytic plating lines constantly, processing approximately 1200 circuit boards daily.

Beginning in 2000, however, Waytec began to experience some cracking problems in its circuit boards, most of which it caught through its own inspection. By 2001, however, it started to receive a significant number of complaints from its customers about the problem. The development of the cracking problem coincided with a change in Waytec’s manufacturing process, as Waytec shifted from the production of double-sided boards to multilayer boards and reduced the number of boards that it produced each day from approximately 1200 to 600 or 700. This decrease in production resulted in its electrolytic copper plating tanks sitting idle for long periods of time rather than running constantly.

Rohm and Haas and NLS representatives traveled to Waytec’s facility on numerous occasions to assist in diagnosing the cause of the cracking and recommended a variety of changes to Waytec’s production process. They suggested, for example, that Waytec needed to improve “additive analysis” and “in-process quality control,” to use deionized water, and to use a chiller for temperature control. 5 At trial, *486 Welch acknowledged that some of the representatives were his personal friends who were attempting to solve Waytec’s problem; he did not even remotely suggest that they had deceived him. Waytee implemented some, but not all, of the suggestions, failing to adopt recommendations with regard to agitation, water quality, and temperature regulation. Welch testified that Waytee opted to ignore these recommendations despite the fact that some of the procedures were required by Copper Gleam’s data sheets, because he did not think them necessary, claiming that he knew his own operation better than the product’s supplier. He also rejected Rohm and Haas’ recommendation that Waytee use a newer generation product, CuPulse, instead of Copper Gleam, because he thought the conversion would be too costly. However, he did follow one recommendation — the recommendation that he treat the chemical bath with carbon. He understood that the cracking was caused by a build-up of organics in the treatment solution and that he could control that build-up with carbon, although he viewed the treatment as too time-consuming and costly.

By 2004, all of Rohm and Haas’ other customers had changed to newer products such as CuPulse, leaving Waytee as the sole user of Copper Gleam. Rohm and Haas refused to continue to supply Copper Gleam to Waytee in light of its failure to follow its recommendations and product specifications, unless Waytee executed a waiver of liability. Waytee refused and transitioned over a three-month period back to the direct current plating system and another supplier’s product. At trial, Welch testified that because the cracking problem stopped when Waytee returned to the direct current process and switched to another supplier’s product, he believed that Copper Gleam must have caused Waytec’s cracking problem. He testified, however, that it was necessary for Waytee to clean its solution tanks before converting to the different chemistry, and that after a cleaning process he would not expect cracking.

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Bluebook (online)
459 F. Supp. 2d 480, 2006 WL 3051769, Counsel Stack Legal Research, https://law.counselstack.com/opinion/waytec-electronics-corp-v-rohm-haas-electronic-materials-llc-vawd-2006.