Volterra Semiconductor Corp. v. Primarion, Inc.

799 F. Supp. 2d 1092, 2011 U.S. Dist. LEXIS 152549, 2011 WL 2600655
Procedural entryThis page is a short order in Volterra Semiconductor Corp. v. Primarion, Inc.. Read the opinion of the Court — 796 F. Supp. 2d 1025
District Court, N.D. California·Decided June 30, 2011·No. Case C-08-05129 JCS·Published

Opinion

ORDER RE:

1) VOLTERRA’S FED.R. CIV. PROC. 50(a) MOTION FOR JUDGMENT , AS A MATTER OF LAW OF NON-OBVIOUSNESS OF CLAIMS 9, 11, 16-19, 22 AND 24 OF THE '522 PATENT AND CLAIMS 26 AND 34 OF THE '264 PATENT AND MOTION TO STRIKE EXPERT TESTIMONY OF DR. RICHARD FAIR [Docket No. 1571]

2) VOLTERRA’S MOTION UNDER FED.R. CIV. PROC. 50(a) FOR JUDGMENT AS A MATTER OF LAW OF NONOBVIOUSNESS AT THE CLOSE OF EVIDENCE OF CLAIMS 9, 11, 16-19, 22 AND 24 OF THE '522 PATENT AND CLAIMS 26 AND 34 OF THE '264 PATENT [Docket No. 1589]

3) DEFENDANTS’ FED. R. CIV. P. 50(a) MOTION FOR JUDGMENT AS A MATTER OF LAW OF OBVIOUSNESS OF CLAIMS 9, 11, 16-19, 22 AND 24 OF THE '522 PATENT AND CLAIMS 26 AND 34 OF THE '264 PATENT [Docket No. 1581]

JOSEPH C. SPERO, United States Magistrate Judge.

I. INTRODUCTION

At the close of Defendants’ case and again at the close of evidence, Volterra brought motions seeking judgment as a matter of law as to Defendants’ obviousness defense (hereinafter, the “Plaintiffs Obviousness JMOL Motions”), pursuant to Rule 50(a)(1) of the Federal Rules of Civil Procedure. Defendants, in turn, brought a motion for judgment as a matter of law on their obviousness defense at the close of Plaintiffs case (hereinafter, “Defendants’ Obviousness JMOL Motion”). On the record of the trial, the Court GRANTED Plaintiffs Obviousness JMOL Motions *1094 as to the Metalized Pad Claims, that is, Claims 22 and 24 of U.S. Patent No. 6,462,522 (“the '522 patent”) and Claims 26 and 34 of U.S. Patent No. 5,278,264 (“the '264 patent”), and denied Plaintiffs JMOL Obviousness JMOL Motions in all other respects. The Court denied Defendants’ Obviousness JMOL Motion. The Court indicated that a formal order would follow after the trial. This Order sets forth the reasons for the Court’s ruling in favor of Volterra with respect to the Metalized Pad Claims. 1

II. BACKGROUND

At trial, Defendants presented two obviousness combinations. First, as to Claims 26 and 34 of the '264 patent and Claims 22 and 24 of the '522 patent (the Metalized Pad Claims), Defendants relied on the following prior art references in support of their obviousness defense: 1) “A Low-Voltage CMOS DC-DC Converter for a Portable Battery-Operated System,” IEEE (1994) by Stratakos et al. (“Stratakos 1994”); 2) “Chip on Board Technologies for Multichip Technologies,” by John Lau published by Chapman & Hall in 1994 (“Lau 1994”); and 3) U.S. Patent No. 5,412,239 to Williams (“Williams”). Second, as to Claims 9, 11 and 16-19 of the '522 patent (the Flip Chip Claims), Defendants presented evidence that these claims were obvious in light of Stratakos 1994 and Lau 1994.

With respect to the Metalized Pad Claims, Defendants presented the testimony of their expert, Dr. Fair, to show that all of the elements of these claims were disclosed in the prior art. Dr. Fair testified that Stratakos 1994 disclosed the following claim elements: 1) “an integrated chip with a power switch for a voltage regulator fabricated thereon,” 5/10/11 Transcript at 375-376; 2) “a substrate having a first plurality of doped regions and a second plurality of doped regions, the first and second pluralities of doped regions arranged in a first alternating pattern,” 5/10/11 Transcript at 376-377; and 3) “a gate region on the substrate,” 5/10/11 Transcript at 384-385. Dr. Fair further testified that Lau 1994 disclosed a “metalized pad” and that Dr. Szepesi agreed with this opinion. 5/10/11 Transcript at 392.

Dr. Fair testified that Williams disclosed the limitation requiring an “array” of pads arranged in an “alternating pattern.” 5/10/11 Transcript at 388. 2 Although Dr. Fair conceded that the word “pad” does not appear in Williams, 5/11/11 Transcript at 433, he testified that a person of ordinary skill in the art would find that Figure 12 of Williams disclosed a “pad” and that Figure 1 showed the “alternating pattern” called for in the Metalized Pad Claims. With respect to the pad, Dr. Fair’s opinion shifted during the course of the trial. On direct examination, he identified Element 91 of Figure 12 of Williams as a “pad.” *1095 5/10/11 Transcript at 398. On cross-examination, however, Dr. Fair conceded that Williams did not teach a top passivation layer above Element 91, as required under the Court’s construction of “metalized pad.” 5/10/11 Transcript at 433-135. He then took the position that the “pad” in Williams was the exposed portion of Element 90 and the area defined by Element 93, with Element 92 on either side. 5/10/11 Transcript at 430; 5/11/11 Transcript at 533-534. He identified Element 92 as a passivation layer. 5/11/11 Transcript at 534. He conceded, however, that Element 90 was described in the specification of Williams as a “first metal layer” that was located beneath both Element 91 and Element 93. 5/10/11 Transcript at 431-432. Dr. Fair testified that in order to find that Elements 90 and 93 of Williams constituted a “pad,” a person of ordinary skill in the art would have to “transform” Williams by removing the second metal layer. 5/19/11 Trial Transcript at 1616-1617. He also conceded that Williams contained no teaching or suggestion that Element 91 was optional or should be omitted. 5/1911 Transcript at 1616.

Dr. Fair testified that the “array” of pads arranged in an “alternating pattern” was disclosed in Figure 1 of Williams. 5/10/11 Transcript at 386. He testified that although Figure 1 did not disclose pads, it did show an alternating pattern of doped regions with contacts and it would be obvious to a person of ordinary skill in the art that there would be pads on top of the doped regions. 5/10/11 Transcript at 436-438.

Dr. Fair testified that the “solder ball” element of claim 34 of the '264 Patent was disclosed in Lau 1994. 5/10/11 Transcript at 407.

With respect to the Flip Chip Claims, Dr. Fair testified that Stratakos 1994 disclosed all of the elements of these claims except flip chip. 5/10/11 Transcript at 308-343. Drs. Fair and Garrou also offered testimony that Stratakos 1994 disclosed “chip-on-board” packaging, which Lau 1994 taught included three types of packaging, namely, wire bonding, tape automated bonding (“TAB”), and flip chip. 5/10/11 Transcript at 352-356; 5/11/11 Transcript at 614-617. Dr. Fair testified further that a person of ordinary skill in the art would have had a reason to combine Stratakos 1994 with Lau 1994 to eliminate the problem of resistance discussed in Stratakos 1994. 5/10/11 Transcript at 365.

In its Obviousness JMOL Motions, Volterra argued that judgment should be entered in its favor pursuant to Rule 50(a) of the Federal Rules of Civil Procedure because the jury could not reasonably find by clear and convincing evidence that either the Metalized Pad Claims or the Flip Chip Claims are obvious in light of the prior art cited above, based on the evidence and testimony presented at trial. Volterra further moved to strike Dr. Fair’s opinions addressing the Williams patent and whether a person skilled in the art would have thought it obvious to combine Stratakos 1994 with flip chip packaging.

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Volterra Semiconductor Corp. v. Primarion, Inc., 799 F. Supp. 2d 1092, 2011 U.S. Dist. LEXIS 152549, 2011 WL 2600655 (N.D. Cal. 2011).

799 F. Supp. 2d 1092 (Volterra Semiconductor Corp. v. Primarion, Inc.) — published by Counsel Stack Legal Research, free access to 12M+ legal documents.

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