United Aircraft Corporation v. Boreen

284 F. Supp. 428, 1968 U.S. Dist. LEXIS 7758
CourtDistrict Court, E.D. Pennsylvania
DecidedApril 23, 1968
DocketCiv. A. 43563, 43586, 43588, 43587, 43598, 43590, 43589, 43591
StatusPublished
Cited by17 cases

This text of 284 F. Supp. 428 (United Aircraft Corporation v. Boreen) is published on Counsel Stack Legal Research, covering District Court, E.D. Pennsylvania primary law. Counsel Stack provides free access to over 12 million legal documents including statutes, case law, regulations, and constitutions.

Bluebook
United Aircraft Corporation v. Boreen, 284 F. Supp. 428, 1968 U.S. Dist. LEXIS 7758 (E.D. Pa. 1968).

Opinion

JOSEPH S. LORD, III, District Judge.

INTRODUCTION

United Aircraft Corporation (“UAC”) seeks an injunction and damages based on the breach of a covenant not to compete, inducement of breach of contract *431 and enticement of employes, breach of fiduciary duties, and conspiracy. In its legal claims, UAC reserved trial of the issue of damages. Causes of action based on misuse of trade secrets were not heard by agreement of the parties. Equitable relief is also sought against the Solid State Scientific Corporation, not a party to this suit, based on the defendants’ participation therein.

The defendants are Henry I. Boreen, Richard H. Moyer, John H. Kindregan, Aehille Pollino, Alvin Atteson, Stephen Markoe, Louis N. Pomante, and Eugene Conser, all former employees of the plaintiff. 1

The cases were consolidated for trial by agreement of the parties.

Jurisdiction is based on diversity of citizenship. 28 U.S.C. § 1332.

FINDINGS OF FACT

1. Plaintiff is a Delaware corporation with its main office and principal place of business in Connecticut. Each of the defendants resides in and is a citizen of Pennsylvania. The amount in controversy in each cause of action in each case exceeds $10,000 exclusive of interest and costs.

2. Definitions:

(a) Telemetry: the engineering science of transmitting information from an inaccessible location to an accessible location. The components of a telemetry system are a transducer, the sensing device which picks up information at the inaccessible location; the transmitter, which sends the information from the inaccessible place to the accessible place; and the receiver, which receives the information at the accessible place. In order to transmit these impulses or information, it is necessary to have an electrical circuit which consists basically of three parts: a tube or transistor, which provides the flow of electrons; a resistor, which impedes the flow of electrons; and a capacitor, which stores electrons.

(b) Transistor: a semiconductor device which performs the function of amplification or switching.

(c) Resistor: an electronic device which impedes the flow of electrons.

(d) Capacitor: an electronic device which filters or stores electrons.

(e) Diode: a semiconductor device that permits the flow of electrical current more readily in one direction than in the opposite direction (rectifying).

(f) Semiconductor: one of a class of materials that falls in between a- conductor and an insulator in regard to conductivity: e. g., silicon or germanium.

(g) Solid-State: the name given to semiconductor devices by virtue of the fact that the semiconductor material in which the electronic action occurs is generally in a crystalline or solid form.

(h) Integrated Circuit: a combination of inter-connected electronic devices that performs a useful circuit function.

(i) Thick-film Technique: a method of building integrated circuits whereby the passive components are made by applying a film of material in the form of inks of the thickness of approximately 1/1000" onto a ceramic base.

(j) Thin-film Technique: a method of building integrated circuits whereby the passive elements are made by sputtering or evaporating onto a silicon substrate a film of approximately 1/1,000,000."

(k) Hybrid or Multichip Circuit: a circuit using the thick- or thin-film technology and hence composed of different kinds of materials on one substrate as opposed to a monolithic integrated circuit which is made of a single piece of silicon.

(l) Tempistor: a temperature-sensitive resistor used as a temperature gauge.

(m) Silicon Planar Technique: a method of making integrated circuits and components using photolithography *432 First, the circuit must be designed. The components are assigned values and a schematic is prepared. The schematic is translated into a geometric layout. This pattern is cut out on a red plastic sheet (Rubylith) which is opaque to photographic light. The Rubyliths are reduced by about 400 times to produce glass masks. The medium used is a wafer of pure silicon on which a coating of silicon dioxide is formed in order to protect it from unwanted impurities. Five different glass masks are used to produce an integrated circuit. The first three masks are used with a photolithographic technique to etch out patterns on the oxide coating. After each etching the wafer is then placed in a diffusion furnace at about 1,000 °C. and various gases are used to introduce impurities for diffusion into the wafer. The last two masks locate the interconnection or wiring of the various components into a circuit. Testing or probing follows. After as many as 500 circuits are completed on the wafer they are separated into individual dice and packaged. A die is fastened mechanically and electrically to the bottom of the package. This is called die-bonding. The mineralization on the circuit is connected to the package leads by the use of small gold wires. This is called wire-bonding. Finally, the integrated circuit is hermetically sealed. Components may be formed using the same technology. A transistor, for example, may be formed in the following manner: a P-type impurity (positively charged: a deficiency of electrons) is etched onto the N-type pure silicon (negatively charged: an excess of electrons). Thereafter, an additional silicon dioxide protective coating may be formed over the wafer. Over the P-type impurity the oxide coating may be cut out to allow the P-type impurity to be etched with an N-type impurity. In this way an NPN transistor may be formed.

(n) MOS: metal oxide semiconductor, another way of using the planar process to build devices and circuits.

(o) Darlington: a Darlington is an electronic device used for amplification. Essentially, it employs two interconnected transistors. While we find it unnecessary for our decision, we conclude that plaintiff has not sustained its burden of proof on its assertion that the Darling-ton is an integrated circuit. 2

3. Vector Manufacturing Company, Inc. (“VMC”) was incorporated in Pennsylvania on January 24, 1956. Originally a mechanical engineering firm, VMC gradually entered the business of manufacturing and selling telemetry products until, by June of 1960, it was engaged primarily in the telemetry business. In January, 1958, VMC employed Boreen, an electrical engineer specializing in telemetry. As a manufacturer of telemetry products and systems, especially aerospace telemetry, VMC continually sought to reduce the size of the electronic circuits which it used as components.

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Bluebook (online)
284 F. Supp. 428, 1968 U.S. Dist. LEXIS 7758, Counsel Stack Legal Research, https://law.counselstack.com/opinion/united-aircraft-corporation-v-boreen-paed-1968.