Psc Computer Products, Inc. v. Foxconn International, Inc. And Hon Hai Precision Industry Co., Ltd.

355 F.3d 1353, 69 U.S.P.Q. 2d (BNA) 1460, 2004 U.S. App. LEXIS 776, 2004 WL 78009
CourtCourt of Appeals for the Federal Circuit
DecidedJanuary 20, 2004
Docket03-1089
StatusPublished
Cited by67 cases

This text of 355 F.3d 1353 (Psc Computer Products, Inc. v. Foxconn International, Inc. And Hon Hai Precision Industry Co., Ltd.) is published on Counsel Stack Legal Research, covering Court of Appeals for the Federal Circuit primary law. Counsel Stack provides free access to over 12 million legal documents including statutes, case law, regulations, and constitutions.

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Psc Computer Products, Inc. v. Foxconn International, Inc. And Hon Hai Precision Industry Co., Ltd., 355 F.3d 1353, 69 U.S.P.Q. 2d (BNA) 1460, 2004 U.S. App. LEXIS 776, 2004 WL 78009 (Fed. Cir. 2004).

Opinion

GAJARSA, Circuit Judge.

PSC Computer Products, Inc. (“PSC”) appeals the final judgment of the United States District Court for the Central District of California granting Foxconn International, Inc. and Hon Hai Precision Industry Co. Ltd. (collectively “Foxconn”) summary judgment of non-infringement of U.S. Patent No. 6,061,239 (the “'239 patent”). PSC Computer Prods., Inc. v. Fox-conn Int’l, No. 01-CV-6414. Because PSC dedicated plastic clips to the public by explicitly claiming only clips made of metal while specifically disclosing that the prior art included clips made of plastic, we affirm.

BACKGROUND

The United States Patent and Trademark Office (“PTO”) issued the '239 patent for a “Cam-Type Retainer Clip for Heat Sinks for Electronic Integrated Circuits.” The '239 patent was assigned to PSC. The '239 patent covers a small but significant component of a complex technology product — the microchip. Like many electronic *1355 components, an operating microchip generates heat. A microchip generates heat as electrons flow through the “logic gates” that enable it to compute the desired outputs from its given inputs. An operating microchip generates heat proportional to the number of logic gates on that chip. Because modern chips generate enough heat to risk becoming self-destructive, system designers need to include heat sinks to dissipate the heat. This heat dissipation extends the useful life of both the microchip and adjacent heat sensitive components.

The '239 patent describes an invention for securing a heat sink to a chip using a cam-type retainer clip. Claim 1 of the '239 patent claims:

In a heat sink assembly providing cooling to an electronic semiconductor device wherein the device is mounted in a module, the module having means for engagement with a retainer clip, and the heat sink having a generally flat bottom surface and heat conducting engagement with the semiconductor device upper surface and a plurality of fins on the upper surface defining at least one channel, the improvement comprising a heat sink retainer clip including:
an elongated, resilient metal strap received in one of the channels of the heat sink having holding means at each end engaging the engagement means on the module, the center portion of the strap spaced a predetermined distance above the upper surface of the heat sink base when the strap is not in tension; and a cam-type latch pivotally mounted in the center portion of the strap and including a cam with a bearing surface, the distance from the pivot access to the bearing surface of the cam being greater than the distance between the pivot access and the upper surface of the base of the heat sink when said strap is not in tension, and an arm fixedly mounted to said cam, said arm, when rotated, causing said bearing surface of said cam to be forced against the surface of the base of the heat sink placing the strap in tension so as to force the heat sink into heat conducting engagement with the module.

'239 patent, col. 6, 11. 6-31 (emphasis added).

The strap and the latch are the only two parts of a cam-type retainer clip for a heat sink assembly, as implied by Claim 1. One way that vendors can differentiate their products is by manufacturing these clip parts out of different materials. The choice of materials for the retainer clip lies at the heart of this dispute. PSC and Foxconn sell competing cam-type retainer clips for heat sink assemblies. PSC’s clip is made of metal, while Foxconn’s clip is made of plastic. PSC filed suit in the United States District Court for the Central District of California alleging that Foxconn’s clip infringed the '239 patent. PSC conceded that Foxconn’s clip did not literally infringe the '239 patent because Claim 1 covers clips containing “an elongated, resilient metal strap,” and Fox-conn’s clip was made of plastic, but maintained nonetheless that Foxconn’s plastic clip infringes the '239 patent under the doctrine of equivalents. Foxconn, in turn, argued that PSC had dedicated clips with plastic parts to the public, and moved for summary judgment of non-infringement on that ground.

The district court reviewed the '239 patent’s claims and written description, and agreed with Foxconn that PSC had dedicated plastic clips to the public. In granting summary judgment to Foxconn, the district court relied on our recent decision in Johnson & Johnston Associates v. R.E. Service Co., 285 F.3d 1046 (Fed.Cir. 2002) (en banc), where we held that a patent applicant who discloses but does not *1356 claim subject matter has dedicated that matter to the public and cannot reclaim the disclosed matter under the doctrine of equivalents. Id. We had previously outlined this rule in Maxwell v. J. Baker, Inc., 86 F.3d 1098 (Fed.Cir.1996), where we similarly held that a patent that disclosed subject matter in its written description without claiming it dedicated that subject matter to the public, and that use of the dedicated matter did not infringe the patent. The district court here determined that because the written description of the '239 patent disclosed clips made of plastic parts without claiming plastic, it had dedicated plastic clips to the public. Foxconn, therefore, could not infringe the '239 patent by equivalents because its plastic clips used materials in the public domain.

In reaching that conclusion, the district court noted the specific language in the written description stating that: “[t]he elongated strap [ ] is made of a resilient metal such as stainless steel although other resilient materials may he suitable for the strap,” '239 patent, col. 4, 11. 49-51 (emphasis added), and that “[ojther prior art devices use molded plastic and/or metal parts that must be cast or forged which again are more expensive metal forming operations.” Id., col. 2.11. 39 — 41 (emphasis added).

According to the district court, these passages demonstrate that, at the time that the inventor applied for the '239 patent, he knew that other materials, including plastic, could be used to make “parts” of his invention, and that the inventor asserted the metal design of the- '239 patent as an improvement over the prior art. The '239 patent, however, does not claim plastic parts, but instead includes an explicit “metal” limitation. The district court applied Johnson to conclude that the disclosure of unclaimed materials in the '239 patent’s written description dedicated those materials to the public. This dedication prevented PSC from using the doctrine of equivalents to extend the scope of its patent claims to include plastic.

The district court found further support for this conclusion in SciMed Life Systems v. Advanced Cardiovascular Systems, 242 F.3d 1337 (Fed.Cir.2001), where we explained that:

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355 F.3d 1353, 69 U.S.P.Q. 2d (BNA) 1460, 2004 U.S. App. LEXIS 776, 2004 WL 78009, Counsel Stack Legal Research, https://law.counselstack.com/opinion/psc-computer-products-inc-v-foxconn-international-inc-and-hon-hai-cafc-2004.