Power Density Solutions LLC v. United States

CourtUnited States Court of Federal Claims
DecidedApril 8, 2022
Docket21-911
StatusPublished

This text of Power Density Solutions LLC v. United States (Power Density Solutions LLC v. United States) is published on Counsel Stack Legal Research, covering United States Court of Federal Claims primary law. Counsel Stack provides free access to over 12 million legal documents including statutes, case law, regulations, and constitutions.

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Power Density Solutions LLC v. United States, (uscfc 2022).

Opinion

In the United States Court of Federal Claims

) POWER DENSITY SOLUTIONS LLC, ) ) Plaintiff, ) ) No. 21-911C v. ) (Filed: April 8, 2022) ) THE UNITED STATES OF AMERICA, ) ) Defendant. ) ) ) )

Trevor Q. Coddington, Insigne PC, Carlsbad, CA, for Plaintiffs.

Grant D. Johnson, Trial Attorney, U.S. Department of Justice, Civil Division, Commercial Litigation Branch, Washington, DC, with whom were Gary L. Hausken, Director, and Brian M. Boynton, Acting Assistant Attorney General, for Defendant.

OPINION AND ORDER

KAPLAN, Chief Judge

Plaintiff Power Density Solutions, LLC (“Power Density”), the assignee of United States Patent Numbers 6,552,901 (“the ’901 patent”) and 6,313,992 (“the ’992 patent”), and Plaintiff James J. Hildebrandt (their original owner) filed this action against the government under 28 U.S.C. § 1498(a). First Am. Compl. ¶¶ 1, 4–6, 8 (“Am. Compl.”), ECF No. 16. They allege that at least eight research institutions and eleven defense contractors, acting for the government and with its consent and authorization, infringed both patents. Id. ¶¶ 9–10. 1

1 Plaintiffs identify the following research institutions in their Amended Complaint: “University of Baltimore (University of Maryland), University of Missouri System, . . . Georgia Tech Research Corporation, [t]he Leland Stanford Junior University, Massachusetts Institute of Technology, Purdue University, Rensselaer Polytechnic Institute, . . . and Universitat ULM.” Am. Compl. ¶ 10.

Plaintiffs also identify the following defense contractors: “International Business Machines Corporation (“IBM”), Lockheed Martin Corporation, Northr[o]p Grumman Systems Corporation, Nuvotronics, Inc., Raytheon Company, Selecttech Services Corporation, . . . BAE Now before the Court is the government’s partial motion to dismiss Plaintiffs’ claims pursuant to Rules 12(b)(1) and 12(b)(6) of the Rules of the Court of Federal Claims (“RCFC”). Def.’s Partial Mot. to Dismiss (“Def.’s Mot.”), ECF No. 12. The government argues that: (1) Plaintiffs have not established the Court’s subject-matter jurisdiction over the claims concerning allegedly infringing activities by research institutions that were funded by government grants or cooperative agreements, id. at 4–15; and (2) Plaintiffs failed to state a claim upon which relief can be granted because—other than for two of the defense contractors—Plaintiffs did not identify real-world systems that allegedly infringed their patents, id. at 15–20.

For the reasons set forth below, the Court concludes that Plaintiffs have not established by preponderant evidence the Court’s jurisdiction over the claims involving third-party research institutions. The Court also concludes that, as to the defense contractors, the Amended Complaint states a claim for relief and sufficiently identifies the allegedly infringing systems. The Court will therefore grant the government’s motion to dismiss Plaintiffs’ claims against the research institutions under RCFC 12(b)(1) and deny the government’s motion to dismiss Plaintiffs’ claims against the defense contractors under RCFC 12(b)(6).

BACKGROUND2

I. Power Density’s Patents

In 2001, the United States issued the ’992 patent to James J. Hildebrandt. Am. Compl. Ex. A, at 2, ECF No. 16-1.3 The patent, captioned “Method and Apparatus for Increasing the Power Density of Integrated Circuit Boards and Their Components,” id. at 2, describes a system for cooling an electronic component by directing cooling fluid through “at least one interior passageway” that is connected to “a plurality of other passageways” that lead to the component’s surface, id. at 13. The cooling fluid passes through this network of passageways “to conductively cool the interior of the [electronic] component and . . . to cool the surface of said component at least partially by evaporative cooling.” Id. The patent explains that “thermal constraints” often limit how much power electronic systems can pack into small spaces, and that “[t]he net effect”

Systems Information and Electronic Systems, Raytheon BBN Technologies Corp., . . . Booz Allen Hamilton Inc., SPC Federal, LLC, [and] L3 Communications Corporation.” Id. 2 The facts set forth in this section are based in part on the factual allegations in the Amended Complaint and the attached exhibits, which the Court accepts as true for purposes of ruling on the partial motion to dismiss under RCFC 12(b)(6). The Court also includes jurisdictional facts drawn from the government’s briefs and the attached appendices, as well as the parties’ representations at oral argument. See Rocovich v. United States, 933 F.2d 991, 993 (Fed. Cir. 1991) (explaining that the Court may go outside of the pleadings when ruling on a motion to dismiss under RCFC 12(b)(1) and “inquire into jurisdictional facts” to determine whether it has jurisdiction). Except where noted, the facts are not in dispute. 3 Documents filed electronically are imprinted with an ECF header and page number, and the Court’s citations to the exhibits and the Amended Complaint refer to the ECF pagination.

2 of Mr. Hildebrandt’s system for cooling electronic components “is increased power density.” See id. at 9.

The United States issued Mr. Hildebrandt the ’901 patent, captioned “Apparatus and System for Cooling Electronic Circuitry, Heat Sinks, and Related Components,” in 2003. Am. Compl. Ex. B, at 2, ECF No. 16-2. This patent, like the ’992 patent, describes a system of passageways that supply cooling fluid to the interior and surface of integrated circuit boards and electronic components. Id.; see also Am. Compl. Ex. A, at 2. Additionally, the ’901 patent emphasizes the cooling system’s application to heat sinks, see generally Am. Comp. Ex. B, and explains how the invention “may be used to increase the efficiency of heat sinks,” id. at 9. Specifically, the patent claims a method for “providing a heat sink with at least one interior passageway” that connects to “at least one secondary passageway” that leads to the heat sink’s surface, and for passing cooling fluid through these passageways “to cool said heat sink through both conductive and evaporative cooling.” Id. at 13.

In 2018, Mr. Hildebrandt assigned his interest in the ’992 patent and the ’901 patent to Power Density. Am. Compl. ¶ 6.

II. The Government’s ICECool Program

From 2012 to 2017, the United States Defense Advanced Research Projects Agency (“DARPA”) administered the Intrachip/Interchip Enhanced Cooling (“ICECool”) program. Id. ¶¶ 9, 14 n.1; Oral Arg. at 4:05–22. The program’s purpose was “to explore potential new cooling devices, techniques, and systems for high-powered electronics.” Oral Arg. at 4:05–22. According to Plaintiffs, the program aimed in particular “to develop next-generation military electronics thermal management systems.” Am. Compl. ¶ 9. The record suggests that the ICECool program sought to develop technology to cool computer circuitry and electronic components—and thereby boost their performance—with an “[e]mbedded cooling paradigm” (as opposed to a traditional “[r]emote cooling paradigm”) that included the use of “convective/evaporative microfluidics.” See App. to Def.’s Mot., ECF No. 12-1, at 235–36 (2015 DARPA Presentation titled “ModSim Challenges in Co-Design of Embedded Cooling Solutions,” hereinafter “DARPA presentation”); see also Am. Compl.

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