Malico, Inc. v. Cooler Master USA Inc.

594 F. App'x 621
CourtCourt of Appeals for the Federal Circuit
DecidedNovember 17, 2014
Docket2013-1680
StatusUnpublished

This text of 594 F. App'x 621 (Malico, Inc. v. Cooler Master USA Inc.) is published on Counsel Stack Legal Research, covering Court of Appeals for the Federal Circuit primary law. Counsel Stack provides free access to over 12 million legal documents including statutes, case law, regulations, and constitutions.

Bluebook
Malico, Inc. v. Cooler Master USA Inc., 594 F. App'x 621 (Fed. Cir. 2014).

Opinion

CHEN, Circuit Judge.

Malico, Inc. (Malico) appeals from the United States District Court for the Northern District of California’s grant of summary judgment of obviousness as to claims 1 and 2 of its patent, U.S. Patent No. 6,476,484 (484 patent). See Malico, Inc. v. Cooler Master USA, Inc., No. C11-4537 RS, 2013 WL 4482503 (N.D.Cal. Aug. 20, 2013). Malico also appeals the district court’s grant of summary judgment limiting the time period for which Malico may recover damages. Although we agree with the district court’s damages decision, the district court failed to make adequate findings to support its obviousness determination. Thus, for the reasons set forth below, we affirm the district court’s judgment limiting damages and vacate the judgment of invalidity.

Background

I

Malico owns the '484 patent, entitled “Heat Sink Dissipat[e]r for Adapting to Thickness Change of a Combination of a CPU and a CPU Carrier.” Heat sink dissipaters are used to cool electronic components by dissipating heat generated by the component into the surrounding air. The heat sink dissipater recited in the claims of the '484 patent includes a heat dissipater and a retaining device for securing the heat dissipater to an electronic component, for example a CPU assembly.

According to the patent, prior art heat dissipaters were built to accommodate a CPU assembly with a specific thickness. If a user later wished to incorporate a CPU assembly having a different thickness, the user would need to create or purchase a different retaining device to accommodate this change in thickness. To avoid this cost, the invention of the '484 patent accommodates CPU assemblies having different thicknesses by placing pads at particular positions on the top surface of the heat dissipater. For one size of CPU assembly, the retaining device directly contacts the heat dissipater’s top surface. But for the retaining device to still engage the dissipater’s top surface when a thinner CPU assembly is used, the retaining device is rotated 90° to allow the device to directly contact the pads that are positioned on the dissipater’s top surface. For example, claim 1 recites:

1. A heat sink dissipater, comprising:

a retaining device having a pair of positioning columns formed on first two opposite sides, a pair of retaining edges formed on second two opposite sides, and a plurality of resilient legs extending inwards from said first or second two opposite sides, said retaining edges each being formed with a barb and said resilient legs each having a bent;
a heat dissipater having a plurality of fins formed on a top surface and a plurality of a[sic] gaps between said fins, said resilient legs failing into said gaps when said retaining device is positioned on said heat dissipater in a first orientation or a second orienta *623 tion orthogonal to said first orientation; and
plurality of pads formed between fins on said top surface of said heat dissi-pater;
wherein the bent of each resilient leg is placed on a pad when said retaining device is positioned on said heat dissipater in said first orientation, and each resilient leg is placed directly on said top surface when said retaining device is positioned on said heat dissipater in said second orientation.

'484 patent, 3:19-4:8 (claim 1) (emphases added).

[[Image here]]

As shown in Figure 1, the retaining device can be oriented such that the “resilient legs [22] having a bent [221]” engage the base of the heat dissipater 30, to secure the heat dissipater to the CPU assembly 10.

Claim 1 further recites that the same retaining device can be rotated 90°, as shown in Figure 2, such that the legs 221 now engage the “pads” 32 located between the fins 31 of the heat dissipater 30.

Claim 2 differs from claim 1 solely by omitting the use of “pads” and, instead, using “recesses” in the top surface of the heat dissipater. See '484 patent, 4:9-31 (claim 2) (substituting “plurality of recesses” for “plurality of pads”). To accommodate a thicker CPU assembly, the retaining device is oriented such that the legs rest in the recesses. Alternatively, to accommodate a thinner CPU assembly, the retaining device is oriented in a manner that allows the legs to rest on the top surface of the heat dissipater, rather than in the recesses.

*624 II

Malico makes and distributes heat sink dissipater products embodying the claims of its '484 patent. Rather than mark these products with the '484 patent number, Malico marked its products with “Int. Pat. XXXX.” J.A. 1068.

Cooler Master USA Inc. (Cooler Master) imported allegedly infringing heat sink dissipaters and sold them to LSI Logic Corporation (LSI). LSI then incorporated the heat sink dissipaters into the larger computer components that LSI assembles and sells.

Malico first claimed infringement of the '484 patent in a letter to LSI on or before March 17, 2008. Malico later filed an action claiming infringement of the '484 patent against Cooler Master on May 26, 2009, in the Western District of Washington, which was ultimately dismissed for lack of personal jurisdiction. In response, Malico initiated the underlying action against Cooler Master and LSI (collectively, Appellees), again asserting infringement of the '484 patent.

In the underlying action, Appellees filed a motion for summary judgment limiting damages and a motion for summary judgment of invalidity. 1 On damages, the district court concluded that Malico could not recover any damages from Cooler Master because Cooler Master received actual notice of infringement of the '484 patent after the date of Cooler Master’s last sale of the accused device. Similarly, the district court concluded that Malico could recover damages from LSI only for the period between giving LSI actual notice on March 17, 2008, and the date of the last allegedly infringing activity. Finally, the district court granted Appellees’ motion for summary judgment of invalidity, finding the two claims of the '484 patent obvious.- Malico filed a timely notice of appeal from the district court’s summary judgment on damages and invalidity. We have jurisdiction under 28 U.S.C. § 1295(a)(1).

Discussion

We review the grant of summary judgment under the law of the regional circuit. Charles Mach. Works, Inc. v. Vermeer Mfg. Co., 728 F.3d 1376, 1378 (Fed.Cir. 2013). The Ninth Circuit reviews the grant or denial of summary judgment de novo. Van Asdale v. Int’l Game Tech., 577 F.3d 989, 994 (9th Cir.2009). Summary judgment is appropriate when “there is no genuine dispute as to any material fact and the movant is entitled to judgment as a matter of law.” Fed.R.Civ.P. 56(a).

Free access — add to your briefcase to read the full text and ask questions with AI

Related

Graham v. John Deere Co. of Kansas City
383 U.S. 1 (Supreme Court, 1966)
KSR International Co. v. Teleflex Inc.
550 U.S. 398 (Supreme Court, 2007)
Honeywell International, Inc. v. United States
609 F.3d 1292 (Federal Circuit, 2010)
TriMed, Inc. v. Stryker Corp.
608 F.3d 1333 (Federal Circuit, 2010)
Kinetic Concepts, Inc. v. Smith & Nephew, Inc.
688 F.3d 1342 (Federal Circuit, 2012)
Plantronics, Inc. v. Aliph, Inc.
724 F.3d 1343 (Federal Circuit, 2013)
Wawrzynski v. H.J. Heinz Company
728 F.3d 1374 (Federal Circuit, 2013)
Van Asdale v. International Game Technology
577 F.3d 989 (Ninth Circuit, 2009)
Eurand, Inc. v. Mylan Pharmaceuticals Inc.
676 F.3d 1063 (Federal Circuit, 2012)

Cite This Page — Counsel Stack

Bluebook (online)
594 F. App'x 621, Counsel Stack Legal Research, https://law.counselstack.com/opinion/malico-inc-v-cooler-master-usa-inc-cafc-2014.