Kyocera International, Inc. v. United States

527 F. Supp. 337, 2 Ct. Int'l Trade 91, 2 C.I.T. 91, 1981 Ct. Intl. Trade LEXIS 1559
CourtUnited States Court of International Trade
DecidedSeptember 11, 1981
DocketCourt 77-7-01123
StatusPublished
Cited by7 cases

This text of 527 F. Supp. 337 (Kyocera International, Inc. v. United States) is published on Counsel Stack Legal Research, covering United States Court of International Trade primary law. Counsel Stack provides free access to over 12 million legal documents including statutes, case law, regulations, and constitutions.

Bluebook
Kyocera International, Inc. v. United States, 527 F. Supp. 337, 2 Ct. Int'l Trade 91, 2 C.I.T. 91, 1981 Ct. Intl. Trade LEXIS 1559 (cit 1981).

Opinion

NEWMAN, Judge:

At issue is the scope and meaning of certain portions of item 685.90 of the Tariff Schedules of the United States (TSUS), and their application to the imported merchandise involved in this action.

Plaintiff imported certain ceramic articles from Japan used in integrated circuit devices, entered at the port of Los Angeles during 1976. The imports are described on the invoices as “MEP’s” (“multilayer elec *338 tronic parts”), with or without other descriptive information, and after further processing in the United States are used to “package” semiconductors.

The District Director classified the merchandise under item 685.90, TSUS, modified by T.D. 68-9 as “other electrical apparatus * * * for the protection of electrical circuits, or for making connections to or in electrical circuits”, and assessed duty at the rate of 8.5 percent ad valorem. Plaintiff claims that the imported articles comprise parts of integrated circuits, and are properly dutiable under item 687.60, TSUS, modified by T.D. 68-9 as parts of “transistors and other related electronic crystal components” at the rate of 6.0 percent ad valorem.

For the reasons indicated below, plaintiff’s claim is sustained.

I.

The record herein consists of the testimony of three witnesses for plaintiff and of two witnesses for defendant, the official entry papers, twenty-two exhibits by plaintiff, and certain of defendant’s answers to interrogatories and responses to requests for admissions.

Following are the relevant facts:

The imported merchandise comprises one of two major components of what is known in the semiconductor industry as a “multilayer integrated circuit package”. In its imported condition, the merchandise in dispute is known as a “ceramic body” or “MEP”, and consists of a minute piece of extremely hard ceramic material averaging about %" X Vi" X Vw". Each ceramic body has a rectangular cavity in one of its two relatively large surfaces, and located around the interior surface of the rectangular cavity are a number of small discrete metallized areas called “bonding pads”. Located along the two long narrow surfaces of the package are a number of other small discrete metallized areas called “brazing pads”.

After importation, plaintiff performs the assembly and processing required to complete the integrated circuit package. Specifically, plaintiff attaches a “lead frame” to each of the brazing pads of the ceramic body, and then gold-plates all exposed metallic surfaces. After completion of assembly and processing, the integrated circuit packages function as a package or housing for an associated integrated circuit chip and are sold to integrated circuit manufacturers.

An integrated circuit chip, containing tens or hundreds (or perhaps thousands) of transistors or related semiconductor components, is a very small (typically Vio" X Vio" X 13/iooo" thick) and fragile piece of silicon. Inasmuch as such chips are fragile and extremely susceptible to corrosion damage when exposed to the normal environment, the chips must be physically shielded and protected by an appropriate housing or “package”.

Following completion of assembly and processing by plaintiff, the subject merchandise provides this essential “housing” function by totally enclosing an integrated circuit chip in its internal cavity. When the package is ready to be used, an integrated circuit chip is first permanently affixed to the “die pad” in the package cavity. Thereupon, after minute “bonding wires” are connected from the chip to the bonding pads in the package cavity, a lid is permanently affixed to the multilayer package so as to completely close the cavity, and thus totally seal the integrated circuit chip from the outside environment.

When the integrated circuit chip is enclosed in the package and the small metal “tie bar” is clipped from the leads of the package, the entire assembly is known in the electronics industry as an “integrated circuit”. Despite the complete enclosure of the integrated circuit chip by the multilayer package, the chip remains electrically coupled to the outside world by means of the electrical paths through the chip bonding wires, bonding pads, metallization embedded in the package, and the leads.

To summarize briefly, the imported merchandise is one of the major components of an integrated circuit package. An integrat *339 ed circuit package, in turn, is used as the housing for a very fragile integrated circuit chip so that the extremely minute and complex electronic circuitry contained in the chip becomes commercially useful. In its final form, the combination of the chip in an integrated circuit package is known, and commercially marketed, as an integrated circuit.

II.

Turning to the legal aspects, at the outset it should be noted that defendant concedes that the imports are parts of integrated circuits and as such are described in item 687.60, TSUS, as “other related electronic crystal components”. However, in seeking to sustain the classification by the District Director under item 685.90, TSUS, defendant correctly points out that General Interpretative Rule 10(ij) of the General Head-notes and Rules of Interpretation, TSUS, provides that a provision for parts of an article does not prevail over a specific provision for such part. Upon this predicate, defendant contends that as to the integrated circuit packages in issue, item 685.90, TSUS is such a “specific” provision since it provides for “other electrical apparatus * * for the protection of electrical circuits, or for making connections to or in electrical circuits” (emphasis added).

In support of its contention that the imports are used for the “protection” of electrical circuits, defendant relies upon the following lexicographic definitions:

Webster’s Third New International Dictionary (1963)
protect — 1. to cover or shield from that which would injure, destroy or detrimentally affect...
Funk & Wagnall’s New Standard Dictionary of the English Language (1956)
1. to keep as from harm, deterioration, danger, temptation or any other evil, by interposition, active or passive; preserve in safety; guard; shield;...

Based upon the foregoing definitions, there can be no doubt that the package literally “protects” the integrated circuit chip. Further, inasmuch as the package connects the electric circuitry of the integrated circuit chip to the circuitry of the outside world (or printed circuit board), the package literally makes connections to or in electrical circuits. In a word, defendant advances this literal application of the statute to the merchandise.

Plaintiff, on the other hand, urges a more limited construction of the statute, citing a technical lexicographic authority and legislative history.

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Bluebook (online)
527 F. Supp. 337, 2 Ct. Int'l Trade 91, 2 C.I.T. 91, 1981 Ct. Intl. Trade LEXIS 1559, Counsel Stack Legal Research, https://law.counselstack.com/opinion/kyocera-international-inc-v-united-states-cit-1981.