Creative Integrated Systems, Inc. v. Nintendo of America, Inc.

526 F. App'x 927
CourtCourt of Appeals for the Federal Circuit
DecidedJune 3, 2013
Docket2012-1579, 2012-1626
StatusUnpublished
Cited by2 cases

This text of 526 F. App'x 927 (Creative Integrated Systems, Inc. v. Nintendo of America, Inc.) is published on Counsel Stack Legal Research, covering Court of Appeals for the Federal Circuit primary law. Counsel Stack provides free access to over 12 million legal documents including statutes, case law, regulations, and constitutions.

Bluebook
Creative Integrated Systems, Inc. v. Nintendo of America, Inc., 526 F. App'x 927 (Fed. Cir. 2013).

Opinion

REYNA, Circuit Judge.

Creative Integrated Systems, Inc. (“Creative”) owns U.S. Patent No. 5,241,-497 (the '497 patent), which covers certain *928 improvements to read only memory (“ROM”). Creative sued Nintendo of America, Inc., Nintendo Co., Ltd., Macro-nix America, Inc., and Macronix International Co., Ltd. (collectively, “Nintendo”) for infringement, alleging that ROM chips used in Nintendo gaming systems infringed claims 5-7 and claim 12 of the '497 patent. After a Markman hearing, the parties agreed to a stipulated judgment of non-infringement. Creative appealed the construction of a term known as “term one,” and Nintendo cross-appealed, arguing that the district court erred in finding the “first means” and “second means” terms in claims 5 and 12 not to be indefinite. For the reasons that follow, we reverse the district court’s construction of term one and affirm its ruling that the first and second means are not indefinite. The judgment of non-infringement is therefore vacated.

Baokground

The '497 patent “relates to a read only memory (ROM), and in particular to improvements in the circuitry and methodology of the subcircuits included within a very large scale integrated (VLSI) ROM.” '497 patent col. 1 11. 12-15. According to the patent, a typical ROM is comprised of thirteen logical components:

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Id. fig. 1. Although the specification of the '497 patent describes improvements to several of these components, it claims improvements to only one of them: the “memory cell array.”

The memory cell array, which contains all of the data stored in the ROM, is a grid of memory cell blocks that, for our purposes, can be thought of as being organized into columns. Each memory cell block contains a certain number of bits of data. To read data from the ROM, the memory cell array must select a single block from this grid, and the block must *929 select a single bit of data. Figure 19 shows the memory cell array with all but one column hidden.

497 patent fíg. 19. In the discussion that follows, we shall refer to the column depicted in figure 19 as “Column 1.”

Column 1 is comprised of three memory cell blocks (77). 1 Three lines connect these blocks to one another: two virtual ground lines (VGO and VG1) and one main bit line (BLO). 2 Ordinarily, none of these blocks are electrically connected to the main bit line. To read an individual bit from Column 1, it is necessary to connect one of the blocks to the main bit line by enabling the block select line (BSi) corresponding to the block that contains the desired bit. An individual bit within a block is then designated by selectively enabling the word lines (Wli) in that block. This creates a path from one of the virtual ground lines through the block to the main bit line, where the bit can ultimately be read.

Although all of the lines can be thought of as physical wires, they come in two different varieties: diffusion lines and me-tallization lines. Diffusion lines are made by introducing impurities into the ROM chip’s silicon base material; metallization lines are made of metal. Each type of line has different properties and uses. Diffusion lines and metallization lines are located on different layers of the ROM chip and are separated by a layer of insulation. When a connection between a metallization line and a diffusion line is necessary, it must be made via a “contact point,” a metal post that travels vertically through the insulation layer. The virtual ground lines and main bit lines discussed above are metallization lines, while the lines within individual blocks are diffusion lines.

With this background in mind, we proceed to the claims. The '497 patent claims *930 improvements to the memory cell blocks that make up the grid in the memory cell array depicted in figure 19 and described above. The specification describes two embodiments for implementing the blocks in the memory cell array. For convenience, we refer to each of these embodiments by the number of the figure depicting it in the written description. See '497 patent col. 8 1. 46 to col. 9 1. 27 (describing the figure 7 embodiment); id. at col. 9 1. 28 to col. 10 1. 3 (describing the figure 9 embodiment).

In the figure 7 embodiment, the block is connected to the virtual ground lines and the main bit line by three pairs of contacts:

The metallization lines for the two virtual ground lines (78, connected to the leftmost and rightmost pairs of contacts) and the main bit line (79, connected to the middle pair of contacts) are shown shaded in gray. These lines are connected to both the top and the bottom of the block via the six contacts. The remaining lines are diffusion lines.

The block can be selected for reading by enabling block select line BS, which connects the block to the main bit line by means of block select transistors 80 and 85. The block contains four columns of memory cells, with each memory cell storing one bit of data. By selectively coupling one of the virtual ground lines to ground and the other to the precharge, either the left or the right two columns are selected for reading. The CA and CB lines control four column select transistors (81, 82, 83, and 84) to narrow this down to a single column. Finally, address data enters the block on lines 88-1 to -N to designate which memory cell within the selected column will be read.

The figure 7 and figure 9 blocks perform identical functions — allowing the ROM to read the bit of data at a particular address — and certain features are common to both embodiments. The main difference between the two embodiments is the layout of the contacts. Instead of employing six contacts, the figure 9 embodiment re *931 quires only three: one in the middle for the main bit line, and two on the sides for the virtual ground lines:

As in the figure 7 embodiment, lines CA and CB control the four column select transistors (101, 102, 116, 118), permitting the selection of one of the four columns, and the configuration of the two virtual ground lines determines whether the left two or right two columns of memory cells are read. Because there is only one contact to the main bit line, the two block select transistors (130) are both located on the same end of the block.

The figure 9 embodiment is designed to be arranged in alternation with its mirror image to form a column in the memory cell array. When arranged in this manner, it requires only half the number of contacts as the figure 7 embodiment. A further advantage of this arrangement is that regardless of which memory cell is addressed, the path between the virtual ground and the main bit line is always approximately equal to the length of the addressed block. See '497 patent col. 39 11. 22-24 and col. 41,11.17-19.

As originally drafted, the claims did not include the metallization lines. The paten-tee submitted an amendment adding the lines, explaining that

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Bluebook (online)
526 F. App'x 927, Counsel Stack Legal Research, https://law.counselstack.com/opinion/creative-integrated-systems-inc-v-nintendo-of-america-inc-cafc-2013.