Burdon Wire & Supply Co. v. Williams

128 F. 927, 1904 U.S. App. LEXIS 4721
CourtU.S. Circuit Court for the District of Massachusetts
DecidedMarch 1, 1904
DocketNos. 1,188, 1,589
StatusPublished
Cited by2 cases

This text of 128 F. 927 (Burdon Wire & Supply Co. v. Williams) is published on Counsel Stack Legal Research, covering U.S. Circuit Court for the District of Massachusetts primary law. Counsel Stack provides free access to over 12 million legal documents including statutes, case law, regulations, and constitutions.

Bluebook
Burdon Wire & Supply Co. v. Williams, 128 F. 927, 1904 U.S. App. LEXIS 4721 (circtdma 1904).

Opinion

HAEE, District Judge.

This is a bill in equity to restrain the infringement of letters patent No. 381,527, dated April 24, 1888, to Levi L- Burdon, and letters patent No. 445,814, dated February 3, 1891, to George U. Meyer. The original suit was brought by the Burdon Wire & Supply Company, the assignee of the patents in suit. The patents were afterwards assigned to the United Wire & Supply Company, and a supplemental bill was brought by that company asking to be substituted for the Burdon Wire & Supply Com[928]*928pany as complainant in the case. The action of record may be taken in the case of the supplemental bill, as this bill shows the present parties to the controversy. The two patents are alleged in the bill to be capable of conjoint use, the Meyer patent being alleged to be a step supplemental or additional to the method which forms the .subject of the Burdon patent.

The court will first direct its attention to the Burdon patent, No. 381,527. The invention in this patent relates to the manufacture of compound ingots for seamless plated wire for use in the jeweler’s art. The first duty of the court is to inquire into the state of public knowledge at the time in reference to the art. In the former manufacture of plated wire, a flat sheet of gold was plated upon a flat block of base metal; the ingot so formed was rolled down to a convenient thickness; the flat product thus obtained was cut into strips about an inch wide; each of these plated strips was then drawn up into a tube, bringing the two longitudinal edges together. This plated tube was subsequently drawn down into plated wire. This plated tube necessarily had a longitudinal seam where the two. edges came together, and this seam, as the case .shows, was necessarily present in the plated wire which was drawn out from the plated tube. To prepare this seamed wire for use in the art, the seam was sometimes soldered up with silver solder, and sometimes was left without solder. The record discloses the objections which appear to the use of this seamed wire, either in its soldered or in its un-soldered form. In either case the seam was unsightly, and injured the appearance of the chains and other articles made from the wire. Devices had to be employed to conceal the seam whenever possible. All wire made in this way was necessarily hollow. The complainant claims that the patentee was the first to produce seamless plated wire having a base metal interior, and an exterior of gold or other precious metal without seam, a wire which for all practical purposes in commerce is claimed to be as good as a solid gold wire, and has had so constant an increase in its use that it has completely supplanted the old seamed wire. This wire is made from the compound ingot manufactured by the process, which forms the subject of the patent. The patent relates only to the formation of a cylindrical ingot by employing a seamless tube or shell of precious metal with a solid cylinder of base metal within the seamless shell, the wire drawn from these ingots being without any longitudinal seam. In making the cjdindrical ingot, it was'found absolutely'necessary that the two parts composing the ingot, namely, the seamless shell and the cylindrical core, should be soldered firmly together. It was found also to be necessary that the shell and core should be united with a thin film of solder extending uniformly throughout the entire adjacent surfaces of the shell and the core. If the film of solder were not uniformly thin, the subsequent reducing and drawing-out process would form blisters, or produce a tearing- away of the shell from the core. And so the proper soldering together of the shell and core became an important problem in the art. The complainant claims that the patentee addressed himself to this problem for years; that in his 1884 patent, No. 294,722, he invented the method [929]*929of inserting a base metal core within a seamless gold shell, the shell extending beyond the core to form a chamber. In this chamber he placed loose solder, and then subjected the ingot to heat, and so fused the solder and caused it to run down into an annular space between the core and the shell. The complainant claims tha't the patentee did not by this method obtain a perfectly soldered ingot, for the reason that the solder would not, in running down, distribute itself with uniform thickness throughout the adjacent surfaces of the shell and core. The patentee’s next invention is found in his 1885 patent, No. 327,655, in which his method consists in covering the surface of the cylindrical base metal core with solder filings, and fusing it upon the core, then turning this soldered-covered core in a lathe to remove the surplus solder and make a uniform surface, then inserting this solder-covered core within the gold shell, and subjecting the whole to heat, to fuse the solder and unite the shell and core. The complainant says that neither of these methods proved successful in producing an ingot having a core and shell properly united, or in making a seamless plated wire for commercial use. His next invention was embodied in the patent in suit.

In order to find the thought in the mind of the inventor and get the exact scope of his invention, let us examine the specification. He sets out by saying that, in the manufacture of jewelry or other articles in which plated stock is employed, the quality of the goods produced, especially when plated wire is used, depends in a great degree on the care exercised by the workmen in concealing as far as possible the longitudinal seam, which had generally been considered unavoidable in the making of plated wire. He then proceeds:

“Tlie object of my present invention is to produce a soldered compound ingot adapted to be drawn down into seamless wire, the latter being free from ‘blisters’ and other imperfections as developed in wire produced from ingots as heretofore usually made. To this end I preferably take a core ol‘ base metal of suitable dimensions and wrap a 1hin layer or unbroken sheet of solder around it. I next place the same within and snugly fitting a seamless tube or shell of fine metal, adding at one end of the ingot, if desired, a chamber in which to place loose solder. The whole is then submitted to the action of heat to fuse the solder, thereby producing a compound ingot in which the core and seamless shell are united by an unbroken film of solder, as will be hereinafter set forth and claimed.”

In the description of his drawings and of his ways- of assembling the three parts, namely, the seamless shell, the sleeve of solder, and the cylindrical core, he says:

“The interior surface of the gold shell is * * covered with borax, and the core then placed centrally therein, thereby forming an annular space between the adjacent surfaces. ⅜ * * • A shell or tube of solder is. then forcibly inserted into the annular space to the lower end of the core, and the whole then subjected to the action of heat exceeding the fusing point of the solder.
“Practically I obtain the best result by vertically suspending the ingot and revolving or twisting it around while in the furnace, thereby uniformly heating its surface. After the ingot is removed from the furnace it is found that the contiguous surfaces of the shell and core are united throughout their length by a uniform thickness or film of solder. Solder loosely placed in the chamber serves to insure the filling of the annular space therewith as the fusing progresses.
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Cite This Page — Counsel Stack

Bluebook (online)
128 F. 927, 1904 U.S. App. LEXIS 4721, Counsel Stack Legal Research, https://law.counselstack.com/opinion/burdon-wire-supply-co-v-williams-circtdma-1904.