Application of Frank Passal

426 F.2d 828, 57 C.C.P.A. 1151
CourtCourt of Customs and Patent Appeals
DecidedMay 28, 1970
DocketPatent Appeal 8327
StatusPublished
Cited by1 cases

This text of 426 F.2d 828 (Application of Frank Passal) is published on Counsel Stack Legal Research, covering Court of Customs and Patent Appeals primary law. Counsel Stack provides free access to over 12 million legal documents including statutes, case law, regulations, and constitutions.

Bluebook
Application of Frank Passal, 426 F.2d 828, 57 C.C.P.A. 1151 (ccpa 1970).

Opinion

ALMOND, Judge.

This is an appeal from the decision of the Patent Office Board of Appeals, adhered to on reconsideration, affirming the rejection of claims 1, 2, 5-13, 15-18 and 20 of appellant’s application. 1 Claims 3, 4, 14 and 19 have been allowed.

The invention relates to a process for high-speed bright nickel plating as well as to the composition of an electrolytic nickel plating bath. Prior art nickel plate production rates are undesirably *829 slow, the specification states, while attempts to speed them up through using high plating current densities and various primary and secondary brighteners or bath additives have resulted in inadequately leveled deposits. Appellants have allegedly solved these prior art problems by maintaining a cathode current density at a level of at least 10 asd (amperes per square decimeter) and a high relative velocity between the nickel plating bath and the cathode representing the material to be plated. This velocity may be maintained by either impinging a stream of electrolyte onto the cathode or by various techniques such as vibration, rotation of the cathode and pumping of the electrolyte past the cathode.

Claims 1 and 16 are illustrative:

1. The method of high-speed electroplating a bright nickel deposit which comprises electroplating said nickel deposit from a nickel bath containing soluble nickel salts and a primary brightener consisting essentially of a brightening and leveling quantity of phenylpropiolamide, maintaining the cathode current density during said plating at a level of at least 10 asd, and maintaining a high relative velocity between said nickel bath and said cathode thereby obtaining a highly lustrous, leveled nickel plate over wide cathode current density range.
16. An aqueous electrolytic nickel bath for high-speed electrodeposition of bright nickel plate which contains soluble nickel salts and as additive a composition selected from the group consisting of (a) a primary brightener consisting essentially of at least 0.8 g/1 of phenylpropiolamide and (b) a secondary brightener together with 0.2-0.6 g/1 of phenylpropiolamide.

Claims 2 and 5 depend from claim 1 with claim 2 providing that phenylpropiolamide (hereinafter PPA) is the sole brightening and leveling additive, while claim 5 recites that a secondary brightener is also present.

Claims 6-9 depend from claim 5. In claim 6, the secondary brightener is limited to one selected from aromatic sulfonates, sulfonamides and sulfimides, while claim 7 limits the secondary brightener to saccharin. In claim 8, the amounts of PPA and secondary brightener present in the bath are limited to 0.2-0.6 g/1 (grams per liter) and 1-10 g/1, respectively. Claim 9 limits the amount of PPA in the bath to 0.2-0.6 g/1 and the amount of saccharin to 1-4 g/1.

Claims 10-13 all depend from claim 1. Claim 10 limits the cathode current density to a range of 10-120 asd, and claim 11 limits the relative velocity between the nickel bath and the cathode to 60-320 cm/second. According to claim 12, the relative velocity is obtained by impinging the nickel bath against the cathode and in claim 13 the relative velocity is described as obtained by directing a stream of electrolyte against the cathode. Claim 15 is an independent claim describing a process similar to that of claim 1, limiting the amount of PPA to 0.2-0.6 g/1 and calling for inclusion of 1-10 g/1 of a secondary brightener. The current density range is also defined as maintained at 20-60 asd. Claim 17 depends from claim 16 and limits the secondary brightener to saccharin. Claim 18 depends from claim 17 and recites that the saccharin is present in an amount of 1-4 g/1. Claim 20 is drawn to an aqueous electrolytic nickel bath consisting essentially of 250-500 g/1 nickel sulfate, 20-60 g/1 boric acid and a secondary brightener together with 0.2-0.6 g/1 phenylpropiolamide.

The references relied upon are:

Kennedy et al. (Kennedy) 2,363,973 November 28,1944
Boelter, Jr. (Boelter) 2,870,709 January 27,1959
Hartman et al. (Hartman) 3,139,393 June 30, 1964
Wesley, W. A. et al. (Wesley), “Eleetrodeposition of Nickel at High Current Density,” 36th Annual Proceedings of the American Electroplaters Society, pp. 79-91 (1949).

*830 Hartman discloses the electrodeposition of semi-bright nickel deposits from nickel-plating Watts-type (200-400 g/l nickel sulfate, 30-120 g/l nickel chloride, 30-50 g/l boric acid) baths containing as the brightening additive PPA. The baths are said to have excellent leveling and covering power with relatively ductile, finely grained, milky and lustrous deposits obtained. Conventional bath operating conditions including agitation are said to be applicable. Deposition from baths containing PPA under high current density results in deposits slightly more grainy and less lustrous. Current density of 0.5-12 asd may be used to obtain uniform lustrous semi-bright nickel electrodeposits when the bath contains, in addition to PPA, an effective amount of an additive such as acetylacetone. PPA is said to act as an auxiliary brightener in conjunction with a conventional secondary brightener such as saccharin to yield mirror-bright nickel. Examples using PPA alone are given in table form.

Wesley discloses that increased agitation of simple nickel plating baths, i.e., not containing brightener additives, permits higher current densities and faster plating rates.

Boelter discloses high-speed deposition of copper from a conventional bath by a method of impinging the electrolyte onto the cathode at flow rates of 500-1000 ft./min.

Kennedy discloses a copper electroplating method wherein the cathode is rotated, or motion between it and the electrolyte otherwise caused, and the electrolyte strongly agitated as by pumping or otherwise since thus a smooth coating is laid for a given current density and higher current densities may be employed.

Claims 1, 2, 5-13, 15-18 and 20 were rejected under 35 U.S.C. § 103 as unpatentable over Hartman in view of Wesley, and Boelter or Kennedy. Additionally, all the above claims except 15 were further rejected under 35 U.S.C. § 103 on Hartman alone. Composition claims 16-18 and 20 were also rejected under 35 U.S.C. § 102 as fully met by Hartman.

The board sustained all the above rejections except the rejection of claim 11 on Hartman alone. In its extensive treatment, the board considered first the rejection under 35 U.S.C. § 102, stating:

All that is required to meet the terms of claims 16, 17, and 18 is a nickel bath containing soluble nickel salts, 0.2-0.6 g/l of phenylpropiolamide, and a secondary brightener, specifically, saccharin.

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Bluebook (online)
426 F.2d 828, 57 C.C.P.A. 1151, Counsel Stack Legal Research, https://law.counselstack.com/opinion/application-of-frank-passal-ccpa-1970.